Electronic module, electronic equipment, imaging sensor module, imaging apparatus, and display apparatus
An electronic module has a flexible wiring member, a wiring circuit board, and a conductive connection member. The flexible wiring member has a flexible base, a first wiring layer formed on at least one face of the flexible base, and a first electrode formed of the first wiring layer at the end part that is not covered by a first insulating layer. The wiring circuit board has a base provided with a wiring, a second insulating layer having opening formed on at least one face of the base, and a second electrode formed in the opening. The conductive connection member connects the first electrode and the second electrode to each other. The end of the flexible wiring member is arranged above the opening in plan view.
1. An electronic module comprising:
a flexible wiring member comprising:
a first base which is an insulating and flexible base,
a first wiring layer formed on the first base, and
a plurality of first electrodes formed of the first wiring layer at an end part of the flexible wiring member;
a wiring circuit board comprising:
a second base,
a second wiring layer formed on the second base,
a second insulating layer formed on the second base, the second insulating layer being formed of a solder-resist, the second insulating layer including a first part, a second part, a third part, and a fourth part, the first part and the second part being arranged with an opening between the first part and the second part in a plan view, the third part and the fourth part being arranged with the opening between the third part and the fourth part in the plan view, a first side of the opening formed by the first part and a second side of the opening formed by the second part is longer than a third side of the opening formed by the third part and a fourth side of the opening formed by the fourth part, and
a plurality of second electrodes formed of the second wiring layer being under the opening, the plurality of second electrodes being arranged in a direction along the first side and the second side, a part of the second wiring layer other than the plurality of second electrodes being arranged between the second base and the second insulating layer; and
a plurality of conductive connection members that respectively connect the plurality of first electrodes and the plurality of second electrodes to each other, the plurality of conductive connection members being formed of a solder,
wherein the plurality of first electrodes and a part of the first base of the flexible wiring member are arranged in the opening so that an end of the flexible wiring member is opposite to the first part of the second insulating layer in the plan view, a distance between the plurality of second electrodes and the first base is less than a thickness of the first part of the second insulating layer, and the second part of the second insulating layer is arranged between the second base and the flexible wiring member in a direction perpendicular to the wiring circuit board.
2. The electronic module according to claim 1 , wherein the plurality of conductive connection members are surrounded by the second insulating layer, and the plurality of conductive connection members do not extend between the second part of the second insulating layer and the flexible wiring member in the direction perpendicular to the wiring circuit board.
3. The electronic module according to claim 1 , wherein at least one of the plurality of first electrodes is arranged with an inclination relative to at least one of the plurality of second electrodes.
4. The electronic module according to claim 1 , wherein the flexible wiring member has a portion contacting with the second insulating layer.
5. The electronic module according to claim 1 , wherein the flexible wiring member comprises a first insulating layer that covers a part of the first wiring layer other than the plurality of first electrodes, and
wherein the first insulating layer is located between the first wiring layer and the second part of the second insulating layer in the direction perpendicular to the wiring circuit board.
6. The electronic module according to claim 1 , wherein a width of the end part of the flexible wiring member is smaller than a width of the opening in a width direction of the end part.
7. The electronic module according to claim 1 , wherein the end part of the flexible wiring member is arranged so as to be spaced apart from the first part of the second insulating layer.
8. The electronic module according to claim 1 ,
wherein the electronic module further comprises a resin covering an edge part of the flexible wiring member in a width direction of the end part of the flexible wiring member, and
wherein the resin and the plurality conductive connection members are arranged so as to be spaced apart from each other between the flexible base and the wiring circuit board.
9. The electronic module according to claim 1 ,
wherein the end part of the flexible wiring member further comprises a resin covering an edge part of the flexible wiring member in a width direction of the end part,
wherein the electronic module has an intermediate member having lower Young's modules than the resin and the plurality of conductive connection members, and
wherein, between the first base and the wiring circuit board, the resin and the intermediate member are arranged to be contacted with each other, and the intermediate member and the plurality of conductive connection members are arranged to be contacted with each other.
10. An electronic equipment comprising:
a casing; and
the electronic module according to claim 1 accommodated in the casing.
11. The electronic equipment according to claim 10 further comprising:
an imaging sensor mounted on the wiring circuit board, wherein the wiring circuit board is arranged between the imaging sensor and the flexible wiring member.
12. The electronic equipment according to claim 11 further comprising:
an image processing circuit accommodated in the casing,
wherein the flexible wiring member connects the wiring circuit board and the image processing circuit.
13. An electronic equipment according to claim 12 , further comprising:
a unit accommodated in the casing,
wherein the unit is configured to move the imaging sensor.
14. A display apparatus comprising:
the electronic module according to claim 1 ; and
a light emitting element on the wiring circuit board.
15. The electronic module according to claim 1 , wherein a thickness of the plurality of conductive connection members is greater than a thickness of the second insulating layer.
16. The electronic module according to claim 1 , wherein both of opposite sides of the opening in the second insulating layer are surrounded by the second insulating layer in the plan view.
17. The electronic module according to claim 1 , wherein a part of the first base overlapping the second part of the second insulating layer is arranged with an inclination relative to the second part of the second insulating layer.
18. The electronic module according to claim 1 , wherein a part of the second wiring layer is arranged between the second base and the first part of the second insulating layer.
19. The electronic module according to claim 1 , wherein at least one of the plurality of conductive connection member is in contact with the second part of the second insulating layer.
20. An electronic module comprising:
a flexible wiring member comprising:
a first base which is an insulating and flexible base, and a first wiring layer formed on the first base,
a plurality of first electrodes formed of the first wiring layer at an end part of the flexible wiring member, and
a first insulating layer that covers a part of the first wiring layer other than the first electrode;
a wiring circuit board comprising:
a second base,
a second wiring layer formed on the second base,
a second insulating layer formed on the second base, the second insulating layer being formed of a solder-resist, the second insulating layer including a first part, a second part, a third part, and a fourth part, the first part and the second part being arranged with an opening between the first part and the second part in a plan view, the third part and the fourth part being arranged with the opening between the third part and the fourth part in the plan view, a first side of the opening formed by the first part and a second side of the opening formed by the second part is longer than a third side of the opening formed by the third part and a fourth side of the opening formed by the fourth part, and
a plurality of second electrodes formed of the second wiring layer being under the opening, the plurality of second electrodes being arranged in a direction along the first side and the second side, a part of the second wiring layer other than the plurality of second electrodes being arranged between the second base and the second insulating layer; and
a plurality of conductive connection members that respectively connect the plurality of first electrodes and the plurality of second electrodes to each other, the plurality of conductive connection members being formed of a solder,
wherein the plurality of first electrodes and a part of the first base of the flexible wiring member are arranged in the opening so that an end of the flexible wiring member is opposite to the first part of the second insulating layer in the plan view, a distance between the plurality of second electrodes and the first base is less than a thickness of the first part of the second insulating layer, and the second part of the second insulating layer is arranged between the second base and the flexible wiring member in a direction perpendicular to the wiring circuit board,
wherein a part of the first insulating layer is located between the first wiring layer and the second part of the second insulating layer in the direction perpendicular to the wiring circuit board,
wherein the first electrode is arranged with an inclination relative to the second electrode, and
wherein a part of the first base overlapping the second part of the second insulating layer and the part of the first insulating layer are iarranged with an inclination relative to the second part of the second insulating layer.
21. The electronic module according to claim 20 , wherein at least one of the conductive connection members is in contact with the second insulating layer.
22. The electronic module according to claim 20 , wherein the wiring circuit board includes a silicon substrate, and a light emitting element is arranged on the silicon substrate.
23. An electronic equipment comprising:
the electronic module according to claim 20 ; and
an imaging element mounted on the wiring circuit board,
wherein the imaging element is electrically connected to the wiring circuit board via a metal wire.
24. An electronic equipment comprising:
the electronic module according to claim 20 ;
an imaging element mounted on the wiring circuit board; and
an image stabilizing unit to move the imaging element.