Electronic apparatus having inter-chip stiffener

1. An electronic apparatus comprising:

a first semiconductor chip mounted on a substrate;

a second semiconductor chip mounted on the substrate;

a spacer attached to the substrate and situated between the first and second semiconductor chips, a height of the spacer being equal to a height of the first semiconductor chip and the second semiconductor chip;

a lid enclosing the first semiconductor chip, the second semiconductor chip, and the spacer, the lid having a notch facing the spacer;

an adhesive material filling the notch and adhesively coupling the lid to a top of the spacer; and

an underfill material underneath the first and second semiconductor chips, underneath the spacer and between the spacer and the first and second semiconductor chips.

2. The electronic apparatus of claim 1 , wherein the spacer is a silicon spacer and the silicon spacer has no electrical function.

3. The electronic apparatus of claim 1 , wherein the spacer is spaced 50 to 100 microns from each of the first and second semiconductor chips.

4. The electronic apparatus of claim 1 , wherein the spacer has a thickness of 0.5 to 1.0 millimeters and a length corresponding to a width of a smallest of the first and second semiconductor chips.

5. The electronic apparatus of claim 1 , further comprising:

a silicon bridge embedded in the substrate to electrically connect the first and second semiconductor chips.

6. The electronic apparatus of claim 1 , further comprising:

a third semiconductor chip mounted on the substrate and a second spacer attached to the substrate and situated between one of the first and second semiconductor chips and the third semiconductor chip.

7. The electronic apparatus of claim 6 , wherein both the spacer and the second spacer are silicon and have no electrical function.

8. The electronic apparatus of claim 1 , wherein the adhesive material comprises a Youngs modulus at least 1/100 that of a high strength adhesive material with a Youngs modulus ranging from 9,000 to 10,000 megapascals.

9. The electronic apparatus of claim 1 , wherein the adhesive material comprises a Youngs modulus at least 100 times that of a low strength adhesive material with a Youngs modulus ranging from 7 to 10 megapascals.

10. An electronic apparatus comprising:

a first semiconductor chip attached to a substrate;

a second semiconductor chip attached to the substrate;

a silicon spacer attached to the substrate and situated between the first and second semiconductor chips, the silicon spacer attached to the substrate by the same means as the first and second semiconductor chips are attached to the substrate and the silicon spacer is spaced 50 to 100 microns from each of the first and second semiconductor chips;

a lid enclosing the first semiconductor chip, the second semiconductor chip, and the spacer, the lid having a notch facing the spacer;

an adhesive material filling the notch and adhesively coupling a top of the spacer to the lid; and

an underfill material underneath the first and second semiconductor chips, underneath the silicon spacer and between the silicon spacer and the first and second semiconductor chips.

11. The electronic apparatus of claim 10 , wherein the silicon spacer has a thickness of 0.5 to 1.0 millimeters and a length corresponding to a width of a smallest of the first and second semiconductor chips.

12. The electronic apparatus of claim 10 , wherein the silicon spacer has no electrical function, and wherein the adhesive material comprises a Youngs modulus at least 100 times that of a low strength adhesive material with a Youngs modulus ranging from 7 to 10 megapascals.

13. The electronic apparatus of claim 10 , further comprising:

a silicon bridge embedded in the substrate electrically connecting the first and second semiconductor chips.

14. An electronic apparatus comprising:

a first semiconductor chip mounted on a substrate;

a second semiconductor chip mounted on the substrate;

a third semiconductor chip mounted on the substrate;

a first spacer attached to the substrate and situated between the first semiconductor chip and the second semiconductor chip;

a second spacer attached to the substrate and situated between the third semiconductor chip and one of the first semiconductor chip and the second semiconductor chip;

a lid enclosing the first semiconductor chip, the second semiconductor chip, the third semiconductor chip, the first spacer, and the second spacer, wherein the lid comprises a first notch extending an entire length of the first spacer, and a second notch extending an entire length of the second spacer; and

an adhesive material filling the first notch, filling the second notch, and joining top surfaces of the first spacer and the second spacer with the lid.

15. The electronic apparatus of claim 14 , wherein both the first spacer and the second spacer are made of silicon and have no electrical function.

16. The electronic apparatus of claim 14 , wherein the first spacer is laterally spaced 50 microns to 100 microns from each of the first semiconductor chip and the second semiconductor chip.

17. The electronic apparatus of claim 14 , wherein the first spacer has a thickness of 0.5 to 1.0 millimeters and a length corresponding to a width of a smallest of the first semiconductor chip and the second semiconductor chip.

18. The electronic apparatus of claim 14 , further comprising:

a silicon bridge embedded in the substrate to electrically connect the first semiconductor chip and the second semiconductor chip.

19. The electronic apparatus of claim 14 , wherein the adhesive material comprising a Youngs modulus at least 100 times that of a low strength adhesive material with a Youngs modulus ranging from 7 to 10 megapascals.