Laser processing of workpieces

1. A method comprising:

forming a defect in or on an object, the forming comprising:

directing a beam of radiation onto the object, the beam comprising:

a quasi-non-diffracting beam;

a focal volume having a freeform energy distribution;

positioning the focal volume partially or fully within the object;

generating the beam, the generating comprising:

partially blocking the beam upstream of the focal volume to adjust an axial symmetry of the freeform energy distribution with respect to an optical axis of the beam using an adjustable blocking element; and/or

spatially modulating a phase of the beam upstream of the focal volume to adjust a geometry of the freeform energy distribution using a phase mask,

wherein the freeform energy distribution has energy sufficient to induce multi-photon absorption in a region of the object that is co-located with the focal volume and the induced multi-photon absorption produces the defect.

2. The method of claim 1 , wherein the defect comprises a shape that is substantially similar to the freeform energy distribution.

3. The method of claim 1 , wherein:

the adjustable blocking element comprises a liquid crystal optical element; and

the partially blocking comprises adjusting the liquid crystal optical element to selectively block a portion of the beam.

4. The method of claim 1 , wherein the freeform energy distribution comprises a combination of a circular cylinder portion and elliptic cylinder portion, each having a longitudinal axis along an optical axis of the beam.

5. The method of claim 1 , wherein the freeform energy distribution comprises an hourglass shape having a longitudinal axis along an optical axis of the beam.

6. The method of claim 1 , wherein defect comprises a break feature, a cavity, or both.

7. The method of claim 1 , wherein the object comprises a transparent substrate.

8. The method of claim 7 , wherein the transparent substrate comprises crystalline quartz, fused silica, crown glass, borosilicate glass, soda lime glass, and/or phosphate glass, fluoride crystal, silicon crystal, sapphire, glass ceramics, transparent ceramics, polymers, or plastics.

9. The method of claim 7 , wherein the transparent substrate comprises a semiconductor substrate.

10. The method of claim 9 , wherein the semiconductor substrate comprises silicon, silicon carbide, germanium, gallium arsenide, indium gallium arsenide, aluminum gallium arsenide, gallium nitride, aluminum gallium nitride, indium phosphate, or lithium niobate.

11. The method of claim 7 , wherein the transparent substrate comprises a composite wafer, wherein the composite wafer comprises a plurality of layers of different materials, and wherein the different materials comprise any of glass, ceramic, semiconductors, polymers, or plastic.

12. The method of claim 1 , wherein the radiation comprises a wavelength in a range approximately from 250 nm to 2.0 μm.

13. The method of claim 1 , wherein a rate of defect formation is greater than approximately 1000 defects per minute.

14. The method of claim 1 , wherein the spatially modulating comprises moving an optical center of the phase mask away from the optical axis.

15. The method of claim 1 , wherein the quasi-non-diffracting beam comprises:

a wavelength λ;

a spot size w o ; and

a cross section that comprises a Rayleigh range Z R that is greater than

F

D

⁢

π

⁢

w

0

,

2

λ

,

wherein F D is a dimensionless divergence factor having a value greater than approximately 10.

16. The method of claim 1 , wherein:

the freeform energy distribution comprises a first cross section and a second cross section; and

the second cross section is parallel to the first cross section and is geometrically dissimilar from the first cross section.