Systems for and methods of forming micro-holes in glass-based objects using an annular vortex laser beam
The systems and methods disclosed herein utilize a beam-forming system configured to convert a Gaussian laser beam into an annular vortex laser beam having a relatively large depth of focus, which enables the processing of thick or stacked glass-based objects annular laser beam is defined in part by a topological charge m that defines an amount of rotation of the annular vortex beam around its central axis as it propagates annular vortex beam is used to form micro-holes in a glass-based object using either a one-step or a two-step method micro-holes formed by either process can be in the form of recesses or through-holes, depending on the application size of the micro-holes can be controlled by controlling the size of the annular vortex beam over the depth of focus range.
1. A method of forming a micro-hole in a glass-based object having a body that defines opposite first and second surfaces, comprising:
a) forming a phase device with a phase distribution defined by:
PD ( r ,θ)=φ 1 ( r ,θ)+φ 2 ( r ,θ),
wherein φ 1 (r,θ) is a first phase term equal to −k·r·sin (γ) and φ 2 (r,θ) is a second phase term equal to m·θ, where (r, θ) are polar radial and angular coordinates, γ is an axicon angle in the range 0.10°≤γ≤20°, and m is a topological charge in the range 3≤m≤20, where m is an integer;
b) directing a Gaussian laser beam to the phase device to convert the Gaussian beam to an annular vortex beam having the phase distribution φ PD (r,θ), a depth of focus DOF, a wavelength λ, a first focus ring within the depth of focus DOF and having an inner diameter D 1 , an outer diameter D 2 , and a width WA=(D 2 −D 1 )/2, and a second focus ring within the depth of focus DOF and having inner and outer diameters that are larger than the inner diameter D 1 and the outer diameter D 2 ;
c) directing the annular vortex beam to the first surface and through the body of the glass-based object, thereby irradiating annular regions of the body within the depth of focus to form irradiated annular regions, wherein said irradiating either:
i) transforms the irradiated annular regions to concentric modified annular regions that etch preferentially as compared to a portion of the body that has not been irradiated by the annular vortex beam;
ii) transforms a portion of the irradiated annular regions into a closed-end annular micro-hole and an annular recess that surrounds the closed-end annular micro-hole by ablating the portion of the irradiated annular regions; or
iii) transforms an inner one of the irradiated annular regions into a through micro-hole by ablating the inner one of the irradiated annular regions and transforms an outer one of the irradiated annular regions into an annular recess by ablating the outer one of the irradiated annular regions.
2. The method according to claim 1 , wherein the phase device comprises either:
an axicon lens configured to define the first phase term ϕ 1 (r,θ) and a phase element configured to define the second phase term ϕ 2 (r,θ); or
a single phase element configured to define the first phase term ϕ 1 (r,θ) and the second phase term ϕ 2 (r,θ).
3. The method according to claim 2 , wherein the phase element comprises either a phase plate or an active phase element.
4. The method according to claim 3 , wherein the active phase element comprises a spatial light modulator.
5. The method according to claim 1 , wherein the irradiating forms the modified annular regions, and further comprising:
performing an etching process to remove an inner one of the modified annular regions to form a substantially cylindrical through micro-hole, wherein the etching process comprises at least one of:
i) an application of heat;
ii) an application of ultrasound; or
ii) an application of an acid etchant.
6. The method according to claim 1 , wherein:
the irradiating transforms the portion of the irradiated annular regions into the closed-end annular micro-hole and the annular recess that surrounds the closed-end annular micro-hole by ablating the portion of the irradiated annular regions, and
the annular micro-hole and the annular recess have different relative depths.
7. The method according to claim 1 , wherein:
the irradiating transforms the portion of the irradiated annular regions into the closed-end annular micro-hole and the annular recess that surrounds the closed-end annular micro-hole by ablating the portion of the irradiated annular regions, and
the annular micro-hole and the annular recess have substantially identical depths.
8. The method according to claim 1 , wherein:
the irradiating transforms the inner one of the irradiated annular regions into the through micro-hole by ablating the inner one of the irradiated annular regions and transforms the outer one of the irradiated annular regions into the annular recess by ablating the outer one of the irradiated annular regions, and
the annular recess serves as a location for debris collection and creates surface texture on the glass-based object.
9. The method according to claim 1 , wherein:
the irradiating transforms the inner one of the irradiated annular regions into the through micro-hole by ablating the inner one of the irradiated annular regions and transforms the outer one of the irradiated annular regions into the annular recess by ablating the outer one of the irradiated annular regions, and
the annular recess serves as a location for debris collection and creates surface texture on the glass-based object.
10. The method according to claim 1 , wherein:
the glass-based object comprises a plurality of glass layers stacked together, and
an index-matching fluid is disposed between confronting surfaces of each of the glass layers during the irradiating.
11. A method of forming a micro-hole in a glass-based object having a body that defines opposite first and second surfaces, comprising:
a) forming an annular vortex beam having a depth of focus DOF, a wavelength λ, a first focus ring within the depth of focus DOF, wherein the first focus ring has an inner diameter D 1 , an outer diameter D 2 , and a width WA=(D 2 −D 1 )/2, and a second focus ring within the depth of focus DOF and having inner and outer diameters that are larger than the inner diameter D 1 and the outer diameter D 2 ;
b) directing the annular vortex beam to the first surface and through the body of the glass-based object, thereby irradiating annular regions of the body to transform the annular regions to an inner modified annular region and an outer modified annular region that etch preferentially as compared to a portion of the body that has not been irradiated by the annular vortex beam; and
c) etching the glass-based object to remove the inner modified annular region to form the micro-hole, and remove a portion of the outer modified annular region to form an annular recess surrounding the micro-hole.
12. The method according to claim 11 , wherein forming the annular vortex beam comprises:
forming a Gaussian beam from a laser source;
directing the Gaussian beam through an axicon lens having an axicon angle γ to form a hollow beam;
directing the hollow beam to a phase element configured with phase regions defined by a topological charge m, wherein m is an integer in the range 1≤m≤20, and wherein the hollow beam is either transmitted through or reflected from the phase element to define a phase-modulated hollow beam; and
focusing the phase-modulated hollow beam to a focus plane that defines a center of the depth of focus DOF, and wherein the glass-based object resides within the depth of focus DOF.
13. A method of forming a micro-hole in a glass-based object having a body that defines opposite first and second surfaces, comprising:
a) forming an annular vortex beam having a depth of focus DOF, a wavelength λ, a first focus ring within the depth of focus DOF, wherein the first focus ring has an inner diameter D 1 , an outer diameter D 2 , and a width WA=(D 2 −D 1 )/2, and a second focus ring within the depth of focus DOF and having inner and outer diameters that are larger than the inner diameter D 1 and the outer diameter D 2 ; and
b) directing the annular vortex beam to the first surface and into the body of the glass-based object and either:
i) ablating annular portions of the body from the first surface but not reaching the second surface to form the micro-hole in the form of a closed annular micro-hole having a central portion and an annular recess surrounding the micro-hole; or
ii) ablating an annular portion of the body from the first surface to the second surface to form the micro-hole as a substantially cylindrical through micro-hole and the annular recess surrounding the micro-hole.
14. The method according to claim 13 , wherein the annular vortex beam has a peak intensity in the range from 110 TW/cm 2 to 4800 TW/cm 2 .
15. The method according to claim 13 , wherein the outer diameter D 2 is in the range from 5 microns to 60 microns and wherein the width WA is in the range from 5 microns to 9 microns.
16. The method according to claim 13 , wherein the depth of focus is in the range from 2 mm to 40 mm as measured by the outer diameter D 2 of the focus ring varying in size by no more than 10% from a minimum outer diameter D 2 MIN of the focus ring.
17. A system for forming a micro-hole in a glass-based object having a body that defines opposite first and second surfaces, comprising:
a) a laser source configured to generate a Gaussian laser beam;
b) an optical system operably disposed to receive and process the Gaussian laser beam, the optical system including a phase device configured with a phase distribution φ PD (r, θ)=φ 1 (r, θ)+φ 2 (r,θ), wherein φ 1 (r,θ) is a first phase term equal to −k·r·sin (γ) and φ 2 (r,θ) is a second phase term equal to m·θ, where (r, θ) are polar radial and angular coordinates, γ is an axicon angle in the range 0.10°≤γ≤20°, and m is a topological charge in the range 3≤m≤20, where m is an integer;
c) wherein the Gaussian laser beam is processed by the optical system and the phase device therein to convert the Gaussian laser beam to an annular vortex beam that exits the optical system along a system axis, the annular vortex beam having the phase distribution φ PD (r,θ), a depth of focus DOF, a wavelength 2 , a first focus ring within the depth of focus DOF and having an inner diameter D 1 , an outer diameter D 2 , and a width WA=(D 2 −D 1 )/2, and a second focus ring within the depth of focus DOF and having inner and outer diameters that are larger than the inner diameter D 1 and the outer diameter D 2 ; and
d) a support stage configured to operably support the glass-based object relative to the annular vortex beam so that the annular vortex beam travels through the first surface and through the body of the glass-based object, thereby irradiating an annular region of the body within the depth of focus to form an irradiated annular region, wherein said irradiating either:
i) transforms the irradiated annular regions to concentric modified annular regions that etch preferentially as compared to a portion of the body that has not been irradiated by the annular vortex beam;
ii) transforms a portion of the irradiated annular regions into a closed-end annular micro-hole and an annular recess that surrounds the closed-end annular micro-hole by ablating the portion of the irradiated annular regions; or
iii) transforms an inner one of the irradiated annular regions into a through micro-hole by ablating the inner one of the irradiated annular regions and transforms an outer one of the irradiated annular regions into an annular recess by ablating the outer one of the irradiated annular regions.
18. The system according to claim 17 , wherein the phase device comprises either:
an axicon lens configured to define the first phase term ϕ 1 (r,θ) and a phase element configured to define the second phase term ϕ 2 (r,θ); or
a single phase element configured to define the first phase term ϕ 1 (r,θ) and the second phase term ϕ 2 (r,θ).
19. The system according to claim 18 , wherein the phase element comprises either a phase plate or an active phase element.
20. The system according to claim 17 , wherein the laser source comprises a diode-pumped pulse laser that emits optical pulses having a wavelength λ transparent to material being processed and a temporal pulse width from 200 femtoseconds to 20 picoseconds.
21. The system according to claim 17 , wherein the glass-based object consists of a planar glass sheet having a thickness TH in the range 0.5 mm TH 2 mm.
22. The system according to claim 17 , wherein the micro-hole has a diameter from 10 microns to 500 microns.
23. The system according to claim 17 , wherein the depth of focus is in the range from 2 mm to 40 mm as measured by the outer diameter D 2 of the focus ring varying in size by no more than 10% from a minimum outer diameter D 2 MIN of the focus ring, and wherein the width WA of the focus ring is in the range from 5 microns to 9 microns.