IP Library Granted Patent US 11,342,442
Granted Patent B2
US 11,342,442 · App. 16/748,095 · Granted May 24, 2022

Semiconductor product comprising a heteroepitaxial layer grown on a seed area of a nanostructured pedestal

Inventors: Steven R. J. Brueck (Albuquerque, NM); Stephen D. Hersee (Albuquerque, NM); Seung-Chang Lee (Albuquerque, NM); Daniel Feezell (Albuquerque, NM)
H01L29/66462B82Y10/00B82Y40/00H01L21/02107H01L21/02381H01L21/02532H01L21/02538H01L21/02639H01L29/04H01L29/0665H01L29/0673H01L29/0676H01L29/16H01L29/20H01L29/66469H01L29/66666H01L29/66795H01L29/775H01L29/7783H01L29/785H01L29/7827H01L29/7851H01L27/1211H01L29/045
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Quick Facts
Patent No.
US 11,342,442
App. No.
16/748,095
Granted
May 24, 2022
Kind
B2
Abstract

A method for making a heteroepitaxial layer. The method comprises providing a semiconductor substrate. A seed area delineated with a selective growth mask is formed on the semiconductor substrate. The seed area comprises a first material and has a linear surface dimension of less than 100 nm. A heteroepitaxial layer is grown on the seed area, the heteroepitaxial layer comprising a second material that is different from the first material. Devices made by the method are also disclosed.

Claims (37)

1. A semiconductor product, comprising:

a semiconductor substrate comprising silicon and having a (001) Si facet;

a nanostructured pedestal formed on the semiconductor substrate, the pedestal having a top surface and a side surface, the pedestal being formed from the same material as the semiconductor substrate;

a selective growth mask layer on the side surface of the pedestal;

a seed area formed on an exposed top surface of the pedestal, the seed area having a first linear surface dimension that ranges from about 10 nm to about 50 nm and the seed area having a second linear surface dimension that ranges from about 200 nm to about 5000 nm, the seed area being approximately coplanar with a top surface of the selective growth mask layer; and

a heteroepitaxial layer grown on the seed area without nucleating substantially any threading dislocations, wherein the heteroepitaxial layer slopes outward from the seed area and slopes inward distal from the seed area.

2. The semiconductor product of claim 1 , wherein a portion of the heteroepitaxial layer extends above the growth mask and has a width dimension that is wider than a corresponding width dimension of the seed area.

3. The semiconductor product of claim 1 , wherein the heteroepitaxial layer is substantially defect-free.

4. The semiconductor product of claim 1 , wherein a portion of the heteroepitaxial layer above the selective growth mask layer has a polygonal cross-sectional shape.

5. The semiconductor product of claim 1 , wherein the entire heteroepitaxial layer is above a top surface of the selective growth mask layer.

6. The semiconductor product of claim 1 , wherein the seed area comprises a (001) plane of silicon.

7. The semiconductor product of claim 1 , wherein the selective growth mask layer is comprised of silicon dioxide.

8. The semiconductor product of claim 1 , wherein the heteroepitaxial layer forms a portion of a transistor.

9. A heteroepitaxial layer product, the product comprising:

a semiconductor substrate comprising silicon and having a (001) Si facet;

a nanostructured pedestal formed on the semiconductor substrate, the pedestal having a top surface and a side surface, the pedestal being formed from the same material as the semiconductor substrate;

a selective growth mask layer on the side surface of the pedestal, the seed area being approximately coplanar with a top surface of the selective growth mask layer;

a seed area formed on an exposed top surface of the pedestal, the seed area having a linear surface dimension that ranges from about 10 nm to about 50 nm; and

a heteroepitaxial layer grown on the seed area without nucleating substantially any threading dislocations, wherein the entire heteroepitaxial layer is above a top surface of the selective growth mask layer, and further wherein the heteroepitaxial layer slopes outward from the seed area and slopes inward distal from the seed area.

10. The heteroepitaxial layer product of claim 9 , wherein a portion of the heteroepitaxial layer extends above the growth mask and has a width dimension that is wider than a corresponding width dimension of the seed area.

11. The heteroepitaxial layer product of claim 9 , wherein the heteroepitaxial layer is substantially defect-free.

12. The heteroepitaxial layer product of claim 9 , wherein a portion of the heteroepitaxial layer is above the selective growth mask layer and the portion has a polygonal cross-sectional shape.

13. The heteroepitaxial layer product of claim 9 , wherein the seed area comprises a (001) plane of the silicon material.

14. The heteroepitaxial layer product of claim 9 , wherein the seed area has a second linear surface dimension that ranges from about 200 nm to about 5000 nm.

15. The heteroepitaxial layer product of claim 9 , wherein the heteroepitaxial layer forms a portion of a transistor.

16. The semiconductor product of claim 1 , wherein the growing the heteroepitaxial layer on the seed area occurs without nucleating any threading dislocations.

17. The heteroepitaxial layer product of claim 9 , wherein the growing the heteroepitaxial layer on the seed area occurs without nucleating any threading dislocations.

18. A semiconductor product, comprising:

a semiconductor substrate comprising silicon and having a (001) Si facet;

a nanostructured pedestal formed on the semiconductor substrate, the pedestal having a top surface and a side surface, the pedestal being formed from the same material as the semiconductor substrate;

a selective growth mask layer on the side surface of the pedestal;

a seed area formed on an exposed top surface of the pedestal, the seed area having a first linear surface dimension that ranges from about 10 nm to less than 25 nm and the seed area having a second linear surface dimension that ranges from about 200 nm to about 5000 nm, the seed area being approximately coplanar with a top surface of the selective growth mask layer; and

a heteroepitaxial layer grown on the seed area without nucleating substantially any threading dislocations, wherein the heteroepitaxial layer slopes outward from the seed area and slopes inward distal from the seed area.

19. The semiconductor product of claim 18 , wherein the entire heteroepitaxial layer is above a top surface of the selective growth mask layer.

20. The semiconductor product of claim 1 , wherein the seed area comprises a (001) plane of silicon.

21. The semiconductor product of claim 1 , wherein the selective growth mask layer is comprised of silicon dioxide.

22. The semiconductor product of claim 1 , wherein the heteroepitaxial layer forms a portion of a transistor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2022
From: FEEZELL, DANIEL; HERSEE, STEPHEN; LEE, SEUNG-CHANG; BRUECK, STEVEN
To: THE REGENTS OF THE UNIVERSITY OF NEW MEXICO
Reel/Frame 060014/0819 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2022
From: THE REGENTS OF THE UNIVERSITY OF NEW MEXICO
To: UNM RAINFOREST INNOVATIONS
Reel/Frame 060014/0950 →
Continuity (5)
Continuation 16162787 · Oct 17, 2018
Continuation 14830241 · Aug 19, 2015
Division 13944808 · Jul 17, 2013
Provisional Application 61672713 · Jul 17, 2012
Related Publication 20200203505A1 · Jun 25, 2020
Cited By (1)
US 12,463,033