IP Library Granted Patent US 11,133,332
Granted Patent B2
US 11,133,332 · App. 16/750,260 · Granted Sep 28, 2021

Semiconductor device and manufacturing method of the same

Inventor: Hajime Kimura (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/1225H01L27/124H01L27/1255H01L27/1288H01L28/40H01L29/4966H01L29/7869H01L33/02H01L27/3262H01L27/3265H01L2924/0002
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Quick Facts
Patent No.
US 11,133,332
App. No.
16/750,260
Granted
Sep 28, 2021
Kind
B2
Abstract

An object is to provide a semiconductor device with high aperture ratio or a manufacturing method thereof. Another object is to provide semiconductor device with low power consumption or a manufacturing method thereof. A light-transmitting conductive layer which functions as a gate electrode, a gate insulating film formed over the light-transmitting conductive layer, a semiconductor layer formed over the light-transmitting conductive layer which functions as the gate electrode with the gate insulating film interposed therebetween, and a light-transmitting conductive layer which is electrically connected to the semiconductor layer and functions as source and drain electrodes are included.

Claims (59)

1. A semiconductor device comprising:

an oxide semiconductor layer;

a gate insulating film;

a source electrode of a transistor, the source electrode being electrically connected with the oxide semiconductor layer;

a drain electrode of the transistor, the drain electrode being electrically connected with the oxide semiconductor layer; and

a gate electrode overlapping with the oxide semiconductor layer with the gate insulating film interposed therebetween,

wherein one of the source electrode and the drain electrode comprises a first light-transmitting conductive layer and a first metal layer on and in contact with the first light-transmitting conductive layer,

wherein the first light-transmitting conductive layer is in direct contact with the oxide semiconductor layer,

wherein the first metal layer does not directly contact with the oxide semiconductor layer,

wherein the first metal layer does not overlap with the oxide semiconductor layer, and

wherein all side edges of the first metal layer recedes from all side edges of the first light-transmitting conductive layer.

2. The semiconductor device according to claim 1 , further comprising a pixel electrode,

wherein the other of the source electrode and the drain electrode comprises a second light-transmitting conductive layer,

wherein the second light-transmitting conductive layer comprises indium and zinc, and

wherein the pixel electrode is in direct contact with the second light-transmitting conductive layer.

3. The semiconductor device according to claim 1 , wherein the first light-transmitting conductive layer comprises indium and zinc, and

wherein the oxide semiconductor layer comprises indium and zinc.

4. The semiconductor device according to claim 1 , wherein the first metal layer comprises copper.

5. The semiconductor device according to claim 1 ,

wherein the gate electrode comprises a third light-transmitting conductive layer and a second metal layer over the third light-transmitting conductive layer, and

wherein the second metal layer does not overlap with the oxide semiconductor layer.

6. The semiconductor device according to claim 1 , further comprising a pixel electrode,

wherein the pixel electrode is electrically connected to the other of the source electrode and the drain electrode, and

wherein the pixel electrode partly overlaps with the oxide semiconductor layer.

7. A semiconductor device comprising:

a transparent common electrode;

a first pixel; and

a second pixel,

wherein each of the first pixel and the second pixel comprise:

an oxide semiconductor layer;

a gate insulating film;

a pixel electrode;

a source electrode of a transistor, the source electrode being electrically connected with the oxide semiconductor layer;

a drain electrode of the transistor, the drain electrode being electrically connected with the oxide semiconductor layer; and

a gate electrode overlapping with the oxide semiconductor layer with the gate insulating film interposed therebetween,

wherein one of the source electrode and the drain electrode comprises a first light-transmitting conductive layer and a first metal layer on and in contact with the first light-transmitting conductive layer,

wherein the first light-transmitting conductive layer is in direct contact with the oxide semiconductor layer,

wherein the first metal layer does not directly contact with the oxide semiconductor layer,

wherein the first metal layer does not overlap with the oxide semiconductor layer, and

wherein all side edges of the first metal layer recedes from all side edges of the first light-transmitting conductive layer.

8. The semiconductor device according to claim 7 , wherein the first light-transmitting conductive layer comprises indium and zinc, and

wherein the oxide semiconductor layer comprises indium and zinc.

9. The semiconductor device according to claim 7 , wherein the first metal layer comprises copper.

10. The semiconductor device according to claim 7 ,

wherein the other of the source electrode and the drain electrode comprises a second light-transmitting conductive layer,

wherein the second light-transmitting conductive layer comprises indium and zinc, and

wherein the pixel electrode is in direct contact with the second light-transmitting conductive layer.

11. The semiconductor device according to claim 7 ,

wherein the gate electrode comprises a third light-transmitting conductive layer and a second metal layer over the third light-transmitting conductive layer, and

wherein the second metal layer does not overlap with the oxide semiconductor layer.

12. The semiconductor device according to claim 7 , wherein the pixel electrode of the first pixel partly overlaps with the gate electrode of the second pixel.

13. The semiconductor device according to claim 7 ,

wherein the pixel electrode of the first pixel and the transparent common electrode form a first capacitor, and

wherein the pixel electrode of the second pixel and the transparent common electrode form a second capacitor.

14. The semiconductor device according to claim 7 ,

wherein the transparent common electrode does not overlap with a portion where the oxide semiconductor layer overlaps with the gate electrode in the first pixel.

15. The semiconductor device according to claim 7 ,

wherein the pixel electrode is electrically connected to the one of the source electrode and the drain electrode, and

wherein the pixel electrode partly overlaps with the oxide semiconductor layer.

Priority Claims (1)
JP 2008-130162 · May 16, 2008 · national
Continuity (4)
Continuation 15186692 · Jun 20, 2016
Continuation 14584013 · Dec 29, 2014
Continuation 12434948 · May 4, 2009
Related Publication 20200161343A1 · May 21, 2020
Cited By (2)
US 12,369,402 US 12,581,742