Semiconductor device with porous dielectric structure and method for fabricating the same
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, two conductive features positioned apart from each other over the substrate, and a porous middle layer positioned between the two conductive features and adjacent to the two conductive features. A porosity of the porous middle layer is between about 25% and about 100%.
1. A semiconductor device, comprising:
a substrate;
a first stop layer disposed on the substrate, wherein the first stop layer has a thickness between about 1 nm and about 50 nm;
a plurality of fins disposed on the first stop layer;
an isolation layer disposed on the first stop layer and between the plurality of fins;
a plurality of gate structures disposed on the plurality of fins and the isolation layer, wherein two porous spacers are positioned adjacent to two sides of each gate structure, and wherein a porosity of the porous spacer is between about 25% and about 100%;
a plurality of source/drain regions, correspondingly disposed adjacent to the sides of the plurality of gate structures;
a plurality of covering layers, correspondingly disposed on the plurality of source/drain regions;
a first insulating layer, disposed on the plurality of covering layers and the isolation layer, wherein the first insulating layer is formed of a low-k dielectric material having a dielectric constant of between about 2.4 and about 3.5;
a second insulating layer, disposed on the first insulating layer, wherein the second insulating layer is made of the same low-k dielectric material as the first insulating layer;
a plurality of contacts, disposed penetrating the second insulating layer and the first insulating layer, and respectively correspondingly disposed on the plurality of covering layers; and
a porous capping layer positioned on the plurality of gate structures, wherein a porosity of the porous capping layer is between about 25% and about 100%.
2. The semiconductor device of claim 1 , wherein the porous spacers are made of an energy-removable material consisting of a base material and a decomposable porogen material.
3. The semiconductor device of claim 2 , wherein the base material comprises silicon oxide, and the decomposable porogen material comprises compounds comprising unsaturated bonds.
4. The semiconductor device of claim 1 , wherein the porous capping layer is positioned between the plurality of source/drain regions.
5. The semiconductor device of claim 4 , further comprising two bottom etch stop layers, wherein top surfaces of the two bottom etch stop layers are lower than top surfaces of the plurality of source/drain regions.
6. The semiconductor device of claim 4 , wherein the plurality of fins are positioned between the gate structure and the substrate.
7. The semiconductor device of claim 6 , wherein the fin comprises a protruding portion and two recessed portions positioned adjacent to two sides of the protruding portion, wherein a top surface of the protruding portion is at a vertical level higher than a vertical level of top surfaces of the recessed portions, one of the plurality of gate structures is positioned on the protruding portion, and two of the plurality of source/drain regions are paired and respectively positioned on the recessed portions.
8. The semiconductor device of claim 1 , wherein the plurality of covering layers are formed of metal silicide.