Display panel and method for manufacturing display panel

1. A display panel comprising:

a first substrate having a first wiring;

a second substrate having a second wiring, the first substrate and the second substrate laminated on each other to form a laminated structure; and

a third wiring located on a side surface of the laminated structure,

wherein the third wiring connects the first wiring and the second wiring, and

wherein the first wiring and the second wiring have a same line width and spacing.

2. The display panel according to claim 1 , wherein the first wiring is located on a side of the first substrate away from the second substrate, and wherein the second wiring is located on a side of the second substrate away from the first substrate.

3. The display panel according to claim 2 , wherein the first substrate further comprises a light emitting device located on the same side as the first wiring, and wherein the second substrate further comprises a flexible printed circuit board located on the same side as the second wiring.

4. The display panel according to claim 2 , wherein the first substrate and the second substrate have a same size and shape.

5. The display panel according to claim 1 , wherein the first substrate further comprises a first protective layer covering the first wiring, wherein the second substrate further comprises a second protective layer covering the second wiring, and wherein the display panel further comprises a third protective layer covering the third wiring.

6. The display panel according to claim 1 , further comprising an adhesive layer located between the first substrate and the second substrate.

7. The display panel according to claim 1 , wherein portions, located at least in an edge region of the display panel, of the first wiring and the second wiring are aligned with each other along a laminated direction.

8. A method for manufacturing a display panel, the method comprising:

providing a first substrate having a first wiring;

providing a second substrate having a second wiring;

joining the first substrate and the second substrate to form a laminated structure; and

forming a third wiring on a side surface of the laminated structure to connect the first wiring and the second wiring,

wherein the first wiring and the second wiring have a same line width and spacing.

9. The method according to claim 8 , wherein joining the first substrate and the second substrate comprises joining a side of the first substrate away from the first wiring and a side of the second substrate away from the second wiring.

10. The method according to claim 9 , wherein providing the first substrate further comprises disposing a light emitting device on a side of the first substrate on which the first wiring is formed, and wherein providing the second substrate further comprises disposing a flexible printed circuit board on a side of the second substrate on which the second wiring is formed.

11. The method according to claim 8 , wherein forming the third wiring comprises:

forming a conductive layer on the side surface of the laminated structure; and

patterning the conductive layer to form the third wiring.

12. The method according to claim 8 , further comprising grinding the side surface of the laminated structure before forming the third wiring.

13. The method according to claim 8 , wherein providing the first substrate further comprises forming a first protective layer on a side of the first substrate on which the first wiring is formed,

providing the second substrate further comprises forming a second protective layer on a side of the second substrate on which the second wiring is formed, and

after the third wiring is formed, the method further comprises forming a third protective layer covering the third wiring.

14. The method according to claim 9 , wherein, before joining the first substrate and the second substrate, an adhesive layer is formed on a surface to be joined of at least one of the first substrate and the second substrate.