IP Library Granted Patent US 11,336,016
Granted Patent B2
US 11,336,016 · App. 16/755,776 · Granted May 17, 2022

Cavity supported patch antenna

Inventors: Zhinong Ying (Lund, SE); Kun Zhao (Stockholm, SE)
Assignee: Sony Group Corporation
H01Q9/0414H01Q1/48
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Quick Facts
Patent No.
US 11,336,016
App. No.
16/755,776
Granted
May 17, 2022
Kind
B2
Abstract

An antenna ( 100 ) comprises a cavity ( 120 ) formed by a conductive plate ( 121 ) in a first horizontal conductive layer ( 221 ) of a multi-layer circuit board and a vertical sidewall formed by conductive vias ( 222 ) extending from the conductive plate ( 121 ). Further, the antenna ( 100 ) comprises an antenna patch ( 130 ) arranged in the cavity. The antenna patch ( 130 ) is formed in a second conductive layer ( 223 ) of the multi-layer circuit board and is peripherally surrounded by the vertical sidewall of the cavity ( 120 ).

Claims (30)

1. An antenna, comprising:

a cavity formed by a conductive plate in a first horizontal conductive layer of a multi-layer circuit board and a vertical sidewall formed by conductive vias extending from the conductive plate;

an antenna patch arranged in the cavity, the antenna patch being formed in a second conductive layer of the multi-layer circuit board and being peripherally surrounded by the vertical sidewall of the cavity; and

a parasitic patch arranged in a plane which is parallel to the antenna patch, wherein the parasitic patch is vertically offset from the antenna patch towards a third horizontal conductive layer, is horizontally offset with respect to the antenna patch, and has a different shape than the antenna patch.

2. The antenna according to claim 1 ,

wherein the conductive vias extend from the conductive plate to the third horizontal conductive layer of the multi-layer circuit board.

3. The antenna according to claim 2 ,

wherein the cavity further comprises a conductive frame which is formed in the third horizontal conductive layer and conductively connects the conductive vias of the vertical sidewall.

4. The antenna according to claim 1 ,

wherein the parasitic patch is formed in the third horizontal conductive layer.

5. The antenna according to claim 1 ,

wherein the parasitic patch is horizontally centered with respect to the antenna patch.

6. The antenna according to claim 1 , comprising:

at least one feed connection extending through the conductive plate to a feed point on the antenna patch.

7. The antenna according to claim 1 , comprising:

a first feed connection extending through the conductive plate to a first feed point on the antenna patch; and

a second feed connection extending through the conductive plate to a second feed point on the antenna patch.

8. The antenna according to claim 7 ,

wherein the first feed point is offset from a center of the antenna patch in a first horizontal direction corresponding to a first polarization direction of the antenna, and

wherein the second feed point is offset from a center of the antenna patch in a second horizontal direction corresponding to a second polarization direction of the antenna.

9. The antenna according to claim 1 , comprising:

multiple cavities, each formed by a conductive plate in the first horizontal conductive layer of the multi-layer circuit board and a vertical sidewall formed by conductive vias extending from the conductive plate;

multiple antenna patches, each arranged in a respective one of the cavities, the antenna patches being formed in the second conductive layer of the multi-layer circuit board and being peripherally surrounded by the vertical sidewall of the respective cavity.

10. The antenna according to claim 1 ,

wherein the antenna is configured for transmission of radio signals having a wavelength of more than 1 mm and less than 3 cm.

11. A communication device, comprising:

at least one antenna according to claim 1 ; and

at least one processor configured to process communication signals transmitted via the at least one antenna.

12. The communication device according to claim 11 , comprising:

radio front end circuitry arranged on the multi-layer circuit board.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2022
From: SONY MOBILE COMMUNICATIONS INC.
To: SONY CORPORATION
Reel/Frame 059619/0806 →
CHANGE OF NAME Recorded Apr 18, 2022
From: SONY CORPORATION
To: SONY GROUP CORPORATION
Reel/Frame 059723/0822 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 16, 2020
From: YING, ZHINONG; ZHAO, KUN
To: SONY MOBILE COMMUNICATIONS INC,
Reel/Frame 052949/0762 →
Priority Claims (1)
SE 1730286-0 · Oct 17, 2017 · national
Continuity (1)
Related Publication 20200287287A1 · Sep 10, 2020