Semi-conductor wafers longer than industry standard square
A semiconductor wafer is as wide as the industry standard width A (presently 156 mm+/−1 mm) and is longer than the industry standard A by at least 1 mm and as much as the standard equipment can reasonably accommodate, presently approximately 3-20 mm and potentially longer, thus, gaining significant additional surface area for sunlight absorption. Modules may be composed of a plurality of such larger wafers. Such wafers can be processed in conventional processing equipment that has a wafer retaining portion of industry standard size A and a configuration that also accommodates a wafer with a perpendicular second edge longer than A by at least 1 and typically 3-20 mm. Wet bench carriers and transport and inspection stations can be so used.
1. A method of handling a rectangular semiconductor wafer, the method comprising:
a. providing the rectangular semiconductor wafer having a first edge having a width size w equal to industry standard size A, and a second edge having a length size L that is larger than the size of the first edge, such that L equals A+x, where x is at least three mm;
b. providing a semiconductor wafer processing apparatus sized to handle and process industry standard size A square wafers, the semiconductor wafer processing apparatus having a wafer retaining portion sized to retain a square wafer having a first edge having a width size w equal to industry standard size A and having a configuration that also accommodates said square wafer with a second edge having a length size L, wherein wafer retaining portion has a first dimension and a second dimension at an area in which said square wafer is retained, the first dimension perpendicular to the second dimension, and wherein the wafer retaining portion is configured such that the wafer retaining portion is size constrained along the first dimension and is not size constrained along the second dimension; and
c. providing the rectangular semiconductor wafer to the wafer retaining portion of the semiconductor wafer processing apparatus such that the first edge of the rectangular semiconductor wafer having width size w is retained in the wafer retaining portion, and such that the second edge of the rectangular semiconductor wafer having length size L is also accommodated, wherein the rectangular semiconductor wafer is oriented in the area such that the first edge of the rectangular semiconductor wafer having width size w is parallel to the first dimension and the second edge of the rectangular semiconductor wafer having length size L is parallel to the second dimension; and
d. performing a wafer processing operation on the rectangular semiconductor wafer using the semiconductor wafer processing apparatus.
2. The method of claim 1 , wherein the semiconductor wafer processing apparatus comprises an edge support apparatus.
3. The method of claim 1 , wherein the semiconductor wafer processing apparatus comprises a planar support apparatus.
4. The method of claim 1 , further comprising, prior steps c and d:
providing the square wafer to the wafer retaining portion of the semiconductor wafer processing apparatus; and
performing the wafer processing operation on the square wafer using the semiconductor wafer processing apparatus.
5. The method of claim 1 , further comprising, prior to step a:
providing a melt of semiconductor material;
applying a pressure differential across a porous mold sheet and forming the rectangular semiconductor wafer on the porous mold sheet from the melt of semiconductor material by contacting the porous mold sheet a surface of the melt of semiconductor material; and
reducing the pressure differential to remove the rectangular semiconductor wafer from the porous mold sheet.
6. The method of claim 2 , wherein:
the rectangular semiconductor wafer has a third edge having the length size L, the third edge of the rectangular semiconductor wafer is located opposite the second edge of the rectangular semiconductor wafer and the second and third edges of the rectangular semiconductor wafer are each perpendicular to the first edge of the rectangular semiconductor wafer;
the edge support apparatus has a bottom support and two edge rails; and
providing the rectangular semiconductor wafer to the wafer retaining portion of the semiconductor wafer processing apparatus such that the first edge of the rectangular semiconductor wafer having width size w is retained in the wafer retaining portion, and such that the second edge of the rectangular semiconductor wafer having length size L is also accommodated comprises providing the rectangular semiconductor wafer to the wafer retaining portion of the semiconductor wafer processing apparatus such that the first edge of the rectangular semiconductor wafer having width size w is retained in the wafer retaining portion by the bottom portion and such that each of the second edge and the third edge of the rectangular semiconductor wafer having length sizes L are respectfully retained by one of the two edge rails.
7. The method of claim 6 , wherein:
the rectangular semiconductor wafer has a fourth edge opposite the first edge of the rectangular semiconductor wafer and the second and third edges of the rectangular semiconductor wafer are each perpendicular to the fourth edge of the rectangular semiconductor wafer; and
the edge support apparatus is configured such that the fourth edge of the rectangular semiconductor wafer is unconstrained when the rectangular semiconductor wafer is provided to the wafer retaining portion of the semiconductor wafer processing apparatus.
8. The method of claim 3 , wherein:
the planar support apparatus comprises belts or rollers that contact the rectangular semiconductor wafer during the wafer processing operation and move the rectangular semiconductor wafer in a direction of travel during the wafer processing operation; and
providing the rectangular semiconductor wafer to the wafer retaining portion of the semiconductor wafer processing apparatus such that the first edge of the rectangular semiconductor wafer having width size w is retained in the wafer retaining portion, and such that the second edge of the rectangular semiconductor wafer having length size L is also accommodated comprises providing the rectangular semiconductor wafer to the wafer retaining portion of the semiconductor wafer processing apparatus such that the first edge of the rectangular semiconductor wafer having width size w is retained in the wafer retaining portion, and such that the second edge of the rectangular semiconductor wafer having length size L is also accommodated and the second edge of the rectangular semiconductor wafer having length size L is parallel to the direction of travel.