Microchip
Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle θ 1 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies θ 1 >90°.
1. A microchip comprising a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, a channel surrounded by a bonding portion between the first substrate and the second substrate being formed by a channel forming step formed at least in the first substrate, wherein:
a noncontact portion is formed to surround the bonding portion around an entire circumference of the bonding portion and the channel;
an angle θ 1 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies θ 1 >90°;
a bonding surface and the front surface of the second substrate on the side being in contact with the first substrate is configured as a flat surface; and
the bonding surface has a width of not less than 500 μm.
2. The microchip according to claim 1 , wherein an angle θ 2 formed between a side wall surface of the noncontact portion and a bonding surface continuous therewith satisfies θ 2 >90°.
3. A microchip comprising a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrate being bonded to each other, a channel surrounded by a bonding portion between the first substrate and the second substrate being formed by a channel forming step formed at least in the first substrate, wherein:
a noncontact portion is formed to surround the bonding portion around an entire circumference of the bonding portion and the channel;
at least either a side wall surface of the channel forming step or a side wall surface of the noncontact portion is chamfered or rounded in an area near a bonding surface continuous with the side wall surface;
a bonding surface and the front surface of the second substrate on the side being in contact with the first substrate is configured as a flat surface; and
the bonding surface has a width of not less than 500 μm.
4. The microchip according to claim 1 , wherein a bonding portion between the first substrate and the second substrate is formed at least on part of a periphery of the first substrate and the second substrate.