Phosphorated anhydride containing epoxy resin
Disclosed herein are compounds of formulas (I) and (II), Wherein R 1 , R 2 , R 3 and (1) are as described herein. Methods of making compounds of formulas (I) and (II), curable compositions containing them and cured compositions containing them are also described. The compounds of formulas (I) and II are curing agents, fire retardants or both.
1. A curable composition comprising:
(a) at least one epoxy resin; and
(b) at least one compound of formula MO or formula (IV):
wherein
each R 3 is independently selected from the group consisting of C 1 -C 4 alkyl, C 3 -C 6 cycloalkyl, and phenyl; and wherein each phenyl is optionally substituted with one or more groups independently selected from the group consisting of C 1 -C 4 alkyl, C 1 -C 1 alkoxy, phenyl, phenyloxy, alkenyl, and C 2 -C 4 alkynyl;
each R 4 and R 5 is independently selected from the group consisting of alkyl, alkoxy, aryl, aryloxy, arylalkyl, alkenyl, and alkynyl;
l is 0, 1, 2 or 3;
n is 0, 1, 2, 3 or 4; and
m is 0, 1, 2, 3 or 4.
2. The curable composition of claim 1 wherein m and n are 0.
3. The curable composition of claim 1 wherein m and n are independently 1 or 2.
4. The curable composition of claim 1 wherein each R 4 and R 5 is independently selected from the group consisting of C 1 -C 4 alkyl, C 1 -C 4 alkoxy, phenyl, phenyloxy, benzyl, C 2 -C 6 alkenyl, and C 2 -C 6 alkynyl; and
l is 0 or 1.
5. The curable composition of claim 4 wherein each R 4 and R 5 is independently selected from the group consisting of phenyl, phenyloxy, and benzyl.
6. The curable composition of claim 1 wherein n is 1, and mis 1.
7. The curable composition of claim 4 wherein R 5 is benzyl.
8. The curable composition of claim 1 wherein each R 3 is independently selected from the group consisting of methyl, ethyl, cyclopentyl, cyclohexyl, and phenyl.
9. A method of preparing a compound of formula (III) or formula (IV),
wherein a phosphorus containing compound of the formula:
reacts with an olefin compound of the formula:
in the presence of a radical initiator at a temperature of from about 120° C. to about 160° C.,
wherein
each R 3 is independently selected from the group consisting of C 1 -C 4 alkyl, C 3 -C 6 cycloalkyl, and phenyl; and wherein each phenyl is optionally substituted with one or more groups independently selected from the group consisting of C 1 -C 4 alkyl, C 1 -C 4 alkoxy, phenyl, phenyloxy, C 2 -C 4 alkenyl, and C 2 -C 4 alkynyl; and
each R 4 and R 5 is independently selected from the group consisting of alkyl, alkoxy, aryl, aryloxy, arylalkyl, alkenyl, and alkynyl; 1 is 0, 1, 2 or 3; n is 0, 1, 2, 3 or 4; and m is 0, 1, 2, 3 or 4.
10. A method according to claim 9 , wherein the radical initiator comprises an organic peroxide, azobisisobutyronitrile or both.
11. A method according to claim 10 , wherein the radical initiator comprises di-tert-butyl peroxide.
12. The curable composition of claim 1 wherein the at least one epoxy resin is selected from the group consisting of divinylarene dioxide, diglycidyl ethers of bisphenol A, diglycidyl ethers of bromobisphenol A; oligomeric or polymeric diglycidyl ethers of bisphenol A, oligomeric or polymeric diglycidyl ethers of tetrabromobisphenol A, diglycidyl ethers of bisphenol F or their derivatives, epoxy novolac resins, epoxy cresol novolac resins, and mixtures thereof.
13. The curable composition of claim 1 wherein the at least one epoxy resin comprises one or more glycidyl ether compounds of polyphenols, wherein the polyphenol is selected from the group consisting of hydroquinone, resorcinol, bisphenol A, bisphenol F, 4,4′-dihydroxybiphenyl, phenol novolac, cresol novolac, trisphenol (tris-(4-hydroxyphenyl) methane), 1,1,2,2-tetra (4-hydroxyphenyl) ethane, tetrabromobisphenol A, 2,2-bis (4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane, 1,6-dihydroxynaphthalene, and combinations thereof.
14. The curable composition of claim 1 wherein at least one epoxy resin is an alicyclic epoxy resin selected from the group consisting of polyglycidyl ethers of polyols having at least one alicyclic ring, or compounds including cyclohexene oxide or cyclopentene oxide obtained by epoxidizing compounds including a cyclohexene ring or cyclopentene ring with an oxidizer; or
the at least one epoxy resin comprises at least one compound selected from the group consisting of hydrogenated bisphenol A diglycidyl ether; 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate; 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexane carboxylate; 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexane carboxylate; 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexane carboxylate; 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexane carboxylate; bis (3,4-epoxycyclohexylmethyl) adipate; methylene-bis (3,4-epoxycyclohexane); 2,2-bis (3,4-epoxycyclohexyl) propane; dicyclopentadiene diepoxide; ethylene-bis (3,4-epoxycyclohexane carboxylate); dioctyl epoxyhexahydrophthalate; di-2-ethylhexyl epoxyhexahydrophthalate; and combinations thereof.
15. The curable composition of claim 1 wherein at least one epoxy resin is an aliphatic epoxy resin that is selected from the group consisting of polyglycidyl ethers of aliphatic polyols or alkylene-oxide adducts thereof, polyglycidyl esters of aliphatic long-chain polybasic acids, homopolymers synthesized by vinyl-polymerizing glycidyl acrylate or glycidyl methacrylate, and copolymers synthesized by vinyl-polymerizing glycidyl acrylate or glycidyl methacrylate and other vinyl monomers.
16. The curable composition of claim 12 , wherein the at least one epoxy resin comprises a divinylarene dioxide selected from the group consisting of substituted divinylbenzene dioxide, divinylnaphthalene dioxide, divinylbiphenyl dioxide, divinyldiphenylether dioxide, and mixtures thereof.
17. The curable composition of claim 1 wherein the composition further comprises benzoxazine, styrene maleic anhydride copolymer, phenolic novolac, cyanate ester or mixtures thereof.
18. The curable composition of claim 1 wherein the epoxy resin is present in an amount in the range of from 1 weight percent to 70 weight percent based on the total weight of the curable composition.
19. The curable composition of claim 1 wherein the phosphorus-containing compound of claim 7 is present in an amount in the range of from 10 weight percent to 70 weight percent based on the total weight of the curable composition.
20. A prepreg prepared from the curable composition of claim 1 .
21. An electrical laminate prepared from the curable composition of claim 1 .
22. A printed circuit board prepared from the electrical laminate of claim 21 .
23. A cured thermoset product prepared by curing the curable epoxy resin composition of claim 1 .