Wedge tool, bonding device, and bonding inspection method
It is an object to enable a non-destructive inspection of reliability of a bonding part and enabling an accurate inspection. A wedge tool includes: a groove which is formed along a direction of an ultrasonic vibration in a tip portion and in which a bonding wire is disposed in a wedge bonding; a first planar surface and a second planar surface disposed on both sides of the groove; and at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding.
1. A wedge tool performing a wedge bonding by an ultrasonic vibration, comprising:
a groove which is formed along a direction of the ultrasonic vibration in a tip portion of the wedge tool and in which a bonding wire is disposed in a wedge bonding;
a first planar surface and a second planar surface disposed on both sides of the groove on the tip portion of the wedge tool; and
at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein
the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding, and
the convex portion is located in a central part of at least one of the first planar surface and the second planar surface in a direction in which the groove is formed.
2. The wedge tool according to claim 1 , wherein
a bottom surface of the groove is parallel to the first planar surface and the second planar surface.
3. The wedge tool according to claim 1 , wherein
an end portion of the groove in a direction in which the groove is formed has a curved surface shape, and is smoothly connected to a side surface of the wedge tool.
4. The wedge tool according to claim 1 , wherein
a width of the convex portion in a direction in which the groove is formed is equal to or larger than 1/20 of a radius of the bonding wire bonded by a wedge bonding.
5. The wedge tool according to claim 1 , wherein
a distance from an end portion of the convex portion close to the groove to a central line of the groove is 1.1 times or more larger than a radius of the bonding wire bonded by a wedge bonding.
6. The wedge tool according to claim 1 , wherein
a height of the convex portion is equal to or larger than 1/40 and equal to or smaller than ½ of a radius of the bonding wire bonded by a wedge bonding.
7. The wedge tool according to claim 1 , wherein
the convex portions are formed in both the first planar surface and the second planar surface, and
the convex portions are located in positions symmetrical about the central line of the groove.
8. A wedge tool performing a wedge bonding by an ultrasonic vibration, comprising:
a groove which is formed along a direction of the ultrasonic vibration in a tip portion of the wedge tool and in which a bonding wire is disposed in a wedge bonding;
a first planar surface and a second planar surface disposed on both sides of the groove on the tip portion of the wedge tool; and
at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein
the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding,
the convex portions are formed in both the first planar surface and the second planar surface, and
distances from the end portion of the convex portion close to the groove to the central line of the groove in a planar view are different from each other.
9. A bonding device, wherein
a wedge bonding of a semiconductor device is performed using the wedge tool according to claim 1 .
10. A bonding inspection method, comprising:
performing a wedge bonding of a semiconductor device using a wedge tool including: a groove which is formed along a direction of the ultrasonic vibration in a tip portion of the wedge tool and in which a bonding wire is disposed in a wedge bonding; a first planar surface and a second planar surface disposed on both sides of the groove on the tip portion of the wedge tool; and at least one convex portion formed away from the groove in at least one of the first planar surface and the second planar surface, wherein the bonding wire comes in contact with the convex portion by a deformation of the bonding wire in a bonding part of the bonding wire and a bonded object bonded to each other by a wedge bonding; and
detecting a transfer mark generated by transferring the convex portion in the bonding part of the bonding wire and the bonded object formed by a wedge bonding.