Power semiconductor device
An object of the invention is to improve the reliability of a power semiconductor device. The power semiconductor device according to the invention includes a semiconductor element, a first terminal and a second terminal that transmit current to the semiconductor element, a first base and a second base that are disposed to face each other while interposing a part of the first terminal, a part of the second terminal, and the semiconductor element between the first base and the second base, and a sealing material that is provided in a space between the first base and the second base. The second terminal includes an intermediate portion formed in such a way that a distance from the first terminal increases along a direction away from the semiconductor element. The intermediate portion is provided between the first base and the second base and in the sealing material.
1. A power semiconductor device, comprising:
a first semiconductor element having a first terminal and a second semiconductor element having a second terminal, the first and second terminals transmit current to the first and second semiconductor elements, respectively; and
a first base and a second base that are disposed to face each other while interposing a first part of the first terminal, a first part of the second terminal, the first semiconductor element and the second semiconductor element, between the first base and the second base; and
a sealing material that is provided in a space between the first base and the second base,
wherein an end portion of the first terminal and an end portion of the second terminal project outwardly from, and perpendicular to a same side of the semiconductor device such that the end portion of the first terminal is adjacent to and substantially parallel to the end portion of the second terminal on the same side of the semiconductor device;
wherein the first terminal includes a first intermediate portion extending between the end portion of the first terminal and the first semiconductor device;
wherein the second terminal includes a second intermediate portion extending between the end portion of the second terminal and the second semiconductor device;
wherein the first and second intermediate portions are formed in such a way that a lateral separation between the first intermediate portion and the second intermediate portion increases in a direction away from the first and second semiconductor elements and toward the same side of the semiconductor device such that the separation is greatest at the same side, and
the second intermediate portion is provided between the first base and the second base and in the sealing material.
2. The power semiconductor device according to claim 1 , wherein the first base is provided with a first flow path forming portion that overlaps with the second intermediate portion and flows a coolant in a thickness direction of the sealing material when viewed from an arrangement direction of the first base and the second base.
3. The power semiconductor device according to claim 1 , comprising
a protrusion that is connected to the second intermediate portion and protrudes from the sealing material,
wherein the second intermediate portion is bent at an angle different from that of the protrusion between the semiconductor element and the protrusion.