Display capable of detecting fingerprint
A semiconductor package including a prism sheet having dam structure disclosed. The semiconductor package includes a case having a wall configured for surrounding a space in which a semiconductor chip is installed, and a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.
1. A semiconductor package, comprising:
a case having a wall configured for surrounding a space in which a semiconductor chip is installed; and
a prism sheet having a prism surface consisting of a plurality of prism peaks and a plurality of prism valleys and a flat surface facing the prism surface, wherein the prism surface faces the semiconductor chip and the flat surface is coupled to a cover, wherein a dam extending in a direction different from an extending direction of the prism peak is formed on the prism surface.
2. The semiconductor package of claim 1 , wherein the extending direction of the dam is perpendicular to the extending direction of the prism peak.
3. The semiconductor package of claim 1 , wherein the dam is formed in the plurality of prism valleys.
4. The semiconductor package of claim 1 , wherein the dam is formed close to a lateral surface of the prism sheet.
5. The semiconductor package of claim 1 , wherein a height of the dam is the same as a height of the prism peak.
6. The semiconductor package of claim 1 , wherein a cross-section of the dam is a triangle.
7. The semiconductor package of claim 1 , wherein a cross-section of the dam is a rectangle.
8. The semiconductor package of claim 1 , wherein a length of the dam in the extending direction is shorter than the prism sheet.
9. The semiconductor package of claim 1 , wherein the semiconductor chip is an image sensor.
10. The semiconductor package of claim 1 further comprising:
an optical path extending layer arranged on a top surface of the semiconductor chip; and
a micro lens array arranged on a top surface of the optical path extending layer.
11. The semiconductor package of claim 1 , wherein the plurality of prism peak and the plurality of prism valleys are formed by a plurality of first inclined faces and a plurality of second inclined faces that are alternately arranged, wherein an inclination angle of the first inclined face and an inclination angle of the second inclined face are different from each other.