OLED encapsulation structure including self-healing encapsulation layer, method of encapsulating thereof, and OLED display device including same
View Patent ↗The present application relates to an organic light-emitting diode (OLED) encapsulation structure, a method of encapsulating an organic light-emitting diode (OLED), and an organic light-emitting diode (OLED) display device. The OLED encapsulation structure includes a substrate, a self-healing encapsulation layer, and at least two inorganic encapsulation layers, wherein a cavity is formed between two adjacent layers of the inorganic encapsulation layers, a layer of the self-healing encapsulation layer is provided in the cavity, and one of the inorganic encapsulation layers covers the OLED device. The self-healing encapsulation layer 13 is used to achieve self-healing of cracks at room temperature to prevent water and oxygen from entering the interior of the OLED panel through cracks.
1. An organic light-emitting diode (OLED) encapsulation structure, comprising a substrate, a self-healing encapsulation layer, and at least two inorganic encapsulation layers,
wherein a number of layers of the self-healing encapsulation layer is one less than a number of layers of the inorganic encapsulation layers, the self-healing encapsulation layer is made of a material comprising methyl methacrylate and n-butyl acrylate that are mixed in a preset molar ratio, and the preset molar ratio ranges from 45/55 to 55/45; and
wherein an OLED device is fabricated on the substrate, a cavity is formed between two adjacent layers of the inorganic encapsulation layers, a layer of the self-healing encapsulation layer is provided in the cavity, and one of the inorganic encapsulation layers covers the OLED device.
2. The OLED encapsulation structure according to claim 1 , wherein the inorganic encapsulation layer is made of a material comprising silicon nitride.
3. The OLED encapsulation structure according to claim 1 , wherein the material of the self-healing encapsulation layer further comprises a curing agent.
4. A method of encapsulating an organic light-emitting diode (OLED), comprising the following steps:
(1) providing a substrate on which an OLED device is fabricated;
(2) forming an inorganic encapsulation layer on the substrate to cover the OLED device;
(3) forming a self-healing encapsulation layer on the inorganic encapsulating layer in the step (2), wherein the self-healing encapsulation layer is made of a material comprising methyl methacrylate and n-butyl acrylate that are mixed in a preset molar ratio;
(4) forming an inorganic encapsulation layer on the self-healing encapsulation layer in the step (3), wherein a cavity is formed between the inorganic encapsulation layer in the step (2) and the inorganic encapsulation layer in the step (4), and the self-healing encapsulation layer in the step (4) is wrapped in the cavity; and
(5) performing the steps (3) and (4) cyclically until formations of all the inorganic encapsulation layers and the self-healing encapsulation layer have been completed.
5. The method of encapsulating the OLED according to claim 4 , wherein the step of forming a self-healing encapsulation layer on the inorganic encapsulation layer in the step (2) comprises the steps as follows:
spray-coating the material of the self-healing encapsulation layer on the inorganic encapsulation layer in the step (2); and
after the material of the self-healing encapsulation layer is leveled, performing ultraviolet curing to obtain the self-healing encapsulation layer.
6. The method of encapsulating the OLED according to claim 4 , wherein the material of the self-healing encapsulation layer further comprises a curing agent.
7. The method of encapsulating the OLED according to claim 6 , wherein the material of the self-healing encapsulation layer is prepared based on the following steps:
mixing the methyl methacrylate, the n-butyl acrylate, and the curing agent to obtain a mixture; and
degassing the mixture under vacuum to obtain the material of the self-healing encapsulation layer.
8. The method of encapsulating the OLED according to claim 4 , wherein the preset molar ratio ranges from 45/55 to 55/45.
9. An organic light-emitting diode (OLED) display device, comprising an OLED display panel which comprises an OLED encapsulation structure, wherein
the OLED encapsulation structure comprises a substrate, a self-healing encapsulation layer, and at least two inorganic encapsulation layers,
wherein a number of layers of the self-healing encapsulation layer is one less than a number of layers of the inorganic encapsulation layers, the self-healing encapsulation layer is made of a material comprising methyl methacrylate and n-butyl acrylate that are mixed in a preset molar ratio, and the preset molar ratio ranges from 45/55 to 55/45; and
wherein an OLED device is fabricated on the substrate, a cavity is formed between two adjacent layers of the inorganic encapsulation layers, a layer of the self-healing encapsulation layer is provided in the cavity, and one of the inorganic encapsulation layers covers the OLED device.
10. The OLED display device according to claim 9 , wherein the inorganic encapsulation layer is made of a material comprising silicon nitride.
11. The OLED display device according to claim 9 , wherein the material of the self-healing encapsulation layer further comprises a curing agent.