Amphoteric p-type and n-type doping of group III-VI semiconductors with group-IV atoms
Methods of forming a p-type IV-doped III-VI semiconductor are provided which comprise exposing a substrate to a vapor composition comprising a group III precursor comprising a group III element, a group VI precursor comprising a group VI element, and a group IV precursor comprising a group IV element, under conditions to form a p-type IV-doped III-VI semiconductor via metalorganic chemical vapor deposition (MOCVD) on the substrate. Embodiments make use of a flow ratio defined as a flow rate of the group VI precursor to a flow rate of the group III precursor wherein the flow ratio is below an inversion flow ratio value for the IV-doped III-VI semiconductor.
1. A method of forming a p-type IV-doped III-VI semiconductor, the method comprising:
exposing a substrate to a vapor composition comprising a group III precursor comprising a group III element, a group VI precursor comprising a group VI element, and a group IV precursor comprising a group IV element, under conditions to form a p-type IV-doped III-VI semiconductor via metalorganic chemical vapor deposition (MOCVD) on the substrate.
2. The method of claim 1 , wherein the conditions comprise use of a flow ratio defined as a flow rate of the group VI precursor to a flow rate of the group III precursor and the flow ratio is below an inversion flow ratio value for the IV-doped III-VI semiconductor so as to provide the p-type IV-doped III-VI semiconductor.
3. The method of claim 1 , further comprising exposing the substrate to the vapor composition under conditions to form an n-type IV-doped III-VI semiconductor via MOCVD from the vapor composition.
4. The method of claim 3 , wherein the conditions comprise use of a flow ratio defined as a flow rate of the group VI precursor to a flow rate of the group III precursor and the flow ratio is above an inversion flow ratio value for the IV-doped III-VI semiconductor so as to provide the n-type IV-doped III-VI semiconductor.
5. The method of claim 1 , wherein the conditions comprise use of a first flow ratio defined as a flow rate of the group VI precursor to a flow rate of the group III precursor to provide the p-type IV-doped III-VI semiconductor;
wherein the method further comprises exposing the substrate to the vapor composition under conditions to form an n-type IV-doped III-VI semiconductor via MOCVD from the vapor composition, wherein the conditions comprise use of a second, different flow ratio to provide the n-type IV-doped III-VI semiconductor.
6. The method of claim 1 , wherein the group III precursors are selected from a Ga-containing group III precursor, an Al-containing group III precursor, an In-containing group III precursor and combinations thereof.
7. The method of claim 1 , wherein the group IV precursor comprises Si.
8. The method of claim 1 , wherein the vapor composition further comprises a carrier gas comprising N 2 , H 2 , Ar, or combinations thereof.
9. The method of claim 1 , wherein the group III precursors are selected from a Ga-containing group III precursor, an Al-containing group III precursor, an In-containing group III precursor and combinations thereof; wherein the group VI precursor comprises O; and wherein the group IV precursor comprises Si.
10. The method of claim 9 , wherein the vapor composition further comprises a carrier gas comprising N 2 .
11. A method of forming a p-type IV-doped III-VI semiconductor, the method comprising:
exposing a substrate to a vapor composition comprising a group III precursor comprising a group III element, a group VI precursor comprising a group VI element, and a group IV precursor comprising a group IV element, under conditions to form a p-type IV-doped III-VI semiconductor via metalorganic chemical vapor deposition (MOCVD) on the substrate, further comprising exposing the substrate to the vapor composition under conditions to form an n-type IV-doped III-VI semiconductor via MOCVD from the vapor composition, wherein the n-type IV-doped III-VI semiconductor is in contact with the p-type IV-doped III-VI semiconductor, thereby forming a p-n heterojunction.
12. A method of forming a p-type IV-doped III-VI semiconductor, the method comprising:
exposing a substrate to a vapor composition comprising a group III precursor comprising a group III element, a group VI precursor comprising a group VI element, and a group IV precursor comprising a group IV element, under conditions to form a p-type IV-doped III-VI semiconductor via metalorganic chemical vapor deposition (MOCVD) on the substrate, wherein the conditions comprise use of a first flow ratio defined as a flow rate of the group VI precursor to a flow rate of the group III precursor to provide the p-type IV-doped III-VI semiconductor;
wherein the method further comprises exposing the substrate to the vapor composition under conditions to form an n-type IV-doped III-VI semiconductor via MOCVD from the vapor composition, wherein the conditions comprise use of a second, different flow ratio to provide the n-type IV-doped III-VI semiconductor, wherein the n-type IV-doped III-VI semiconductor is in contact with the p-type IV-doped III-VI semiconductor, thereby forming a p-n heterojunction.
13. A method of forming a p-type IV-doped III-VI semiconductor, the method comprising:
exposing a substrate to a vapor composition comprising a group III precursor comprising a group III element, a group VI precursor comprising a group VI element, and a group IV precursor comprising a group IV element, under conditions to form a p-type IV-doped III-VI semiconductor via metalorganic chemical vapor deposition (MOCVD) on the substrate, wherein the group III precursors are selected from a Ga-containing group III precursor, an Al-containing group III precursor, an In-containing group III precursor and combinations thereof; wherein the group VI precursor comprises O; and wherein the group IV precursor comprises Si, wherein the p-type IV-doped III-VI semiconductor formed is p-type Si-doped Ga 2 O 3 or p-type Si-doped (Ga,In) 2 O 3 .
14. A p-n heterojunction comprising a layer of an n-type semiconductor in contact with a p-type IV-doped III-VI semiconductor comprising a group III element, a group VI element and a group IV element, wherein the n-type semiconductor is an n-type IV-doped III-VI semiconductor comprising the group III element, the group VI element and the group IV element.
15. The p-n heterojunction of claim 14 , wherein the group III element is selected from Ga, Al, In, and combinations thereof; the group VI element is O, and the group IV element is Si.
16. A IV-doped III-VI semiconductor comprising a group III element, a group VI element and a group IV element, wherein the semiconductor is p-type.
17. A p-n heterojunction comprising a layer of an n-type semiconductor in contact with the p-type IV-doped III-VI semiconductor of claim 16 .
18. The p-n heterojunction of claim 17 , wherein the group III element is selected from Ga, Al, In, and combinations thereof; the group VI element is O, and the group IV element is Si.
19. A device comprising the p-type IV-doped III-VI semiconductor of claim 16 and another material layer in contact with the p-type IV-doped III-VI semiconductor.
20. The device of claim 19 , wherein the group III element is selected from Ga, Al, In, and combinations thereof; the group VI element is O, and the group IV element is Si.
21. The IV-doped III-VI semiconductor of claim 16 , wherein the group III element is selected from Ga, Al, In, and combinations thereof; the group VI element is O, and the group IV element is Si.
22. A IV-doped III-VI semiconductor comprising a group III element, a group VI element and a group IV element, wherein the semiconductor is Si-doped Ga 2 O 3 or Si-doped (Ga,In) 2 O 3 , wherein the semiconductor is K-phase.
23. The IV-doped III-VI semiconductor of claim 22 in contact with a β-Ga 2 O 3 substrate.
24. A device comprising the IV-doped III-VI semiconductor of claim 22 and another material layer in contact with the IV-doped III-VI semiconductor.