IP Library Granted Patent US 11,532,863
Granted Patent B2
US 11,532,863 · App. 16/771,613 · Granted Dec 20, 2022

Broadband circulator and method of manufacturing the same

Inventors: David E. Barry (Dunedin, FL); James P. Kingston (Tampa, FL)
H01P1/387H01P11/001
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,532,863
App. No.
16/771,613
Granted
Dec 20, 2022
Kind
B2
Abstract

A broadband microstrip ferrite circulator or isolator includes a carrier. The broadband microstrip ferrite circulator or isolator further includes a dielectric substrate having an opening therein. The broadband microstrip ferrite circulator or isolator further includes a ferrite disc positioned within the opening of the dielectric substrate. The broadband microstrip ferrite circulator or isolator further includes a conductor having three contacts extending therefrom, the conductor being positioned on the ferrite disc. The broadband microstrip ferrite circulator or isolator further includes a magnet. The broadband microstrip ferrite circulator or isolator further includes a spacer positioned between the conductor and the magnet.

Claims (23)

1. A broadband microstrip ferrite circulator or isolator, comprising:

a carrier;

a dielectric substrate having an opening therein and being non-metallized;

a first low loss microwave adhesive for attaching the dielectric substrate to the carrier, the first low loss microwave adhesive having a melting temperature of above 230 degrees Celsius in order to withstand curing and solder reflow temperatures;

a ferrite disc positioned within the opening of the dielectric substrate;

a conductor having three contacts extending therefrom, the conductor being positioned on the ferrite disc;

a second low loss microwave adhesive for attaching the conductor to the dielectric substrate and to the ferrite disc;

a magnet; and

a spacer positioned between the conductor and the magnet.

2. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the carrier is a plated steel carrier.

3. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the carrier is a ferrous carrier.

4. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the dielectric substrate is made of a ceramic material.

5. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the ferrite disc is a no metallization ferrite disc.

6. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the ferrite disc is a high saturation magnetization ferrite disc.

7. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the conductor extends to an edge of the dielectric substrate to eliminate the need for a pattern on the dielectric substrate.

8. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the conductor is a standalone conductor that is adhered to the ferrite disc with leads crossing a ferrite/dielectric gap.

9. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the spacer is attached to the conductor using a third low loss microwave adhesive.

10. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the magnet is attached to the spacer using a nonconductive adhesive.

11. The broadband microstrip ferrite circulator or isolator of claim 1 wherein the spacer has an integrated ground plane.

12. The broadband microstrip ferrite circulator or isolator of claim 1 wherein each of the three contacts of the conductor extends beyond an outer dimension of the carrier.

13. A method of manufacturing a circulator, comprising:

forming a pre-circulator structure by stacking, in order, a carrier, a first adhesive, a non-metallized dielectric substrate having an opening therein, a ferrite disc in the opening of the non-metallized dielectric substrate, a second adhesive, a conductor having a center portion with three legs extending therefrom, a third adhesive, a spacer, a fourth adhesive, and a magnet; and

applying pressure to the pre-circulator structure and heating the pre-circulator structure with the pressure applied to a temperature between about 200 degrees Celsius and about 325 degrees Celsius in order to cure the first adhesive, the second adhesive, the third adhesive, and the fourth adhesive.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2021
From: SMITHS INTERCONNECT, INC.
To: TRAK MICROWAVE LIMITED
Reel/Frame 056170/0843 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2020
From: BARRY, DAVID E.; KINGSTON, JAMES P.
To: TRAK MICROWAVE CORPORATION
Reel/Frame 052899/0714 →
MERGER AND CHANGE OF NAME Recorded Jun 10, 2020
From: TRAK MICROWAVE CORPORATION; SMITHS INTERCONNECT, INC.
To: SMITHS INTERCONNECT, INC.
Reel/Frame 052899/0836 →
Continuity (2)
Provisional Application 62598935 · Dec 14, 2017
Related Publication 20210175592A1 · Jun 10, 2021