IP Library Granted Patent US 10,882,082
Granted Patent B2
US 10,882,082 · App. 16/773,679 · Granted Jan 5, 2021

Freeze cleaning apparatus

Inventors: Hideaki Sakurai (Kanagawa, JP); Kyo Otsubo (Tokyo, JP); Minako Inukai (Kanagawa, JP)
Assignee: TOSHIBA MEMORY CORPORATION
B08B7/0092H01L21/02057H01L21/67023H01L21/67028H01L21/67051H01L21/67109H01L21/68735
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Quick Facts
Patent No.
US 10,882,082
App. No.
16/773,679
Granted
Jan 5, 2021
Kind
B2
Abstract

A freeze cleaning apparatus includes a table for supporting a processing target substrate having a first surface and a second surface opposite to the first surface, a liquid supply unit positioned to supply a cleaning liquid onto the second surface of the processing target substrate that is placed such that the first surface faces the table, and a cooling gas discharge unit in the table to supply a cooling gas to the first surface side of the processing target substrate. A gap between the table and the processing target substrate is set such that the cooling gas flows as a laminar flow between the table and the processing target substrate.

Claims (14)

1. A freeze cleaning apparatus, comprising:

a table that faces a first surface of a processing target substrate, the processing target substrate having a second surface opposite the first surface;

a liquid supply unit configured to supply a cleaning liquid onto the second surface of the processing target substrate placed such that the first surface faces the table;

a side wall that surrounds a space between the processing target substrate and the table;

a cooling gas discharge unit that is provided in the table to discharge a cooling gas into the space;

a drain that discharges the cooling gas from the space to the outside; and

a valve located on the drain, wherein

the space between the processing target substrate and the table is a closed space.

2. The freeze cleaning apparatus according to claim 1 , wherein a top surface of the table is sloped downward from a center thereof toward the drain.

3. The freeze cleaning apparatus according to claim 1 , further comprising:

a sensor that detects a temperature of the cleaning liquid on the processing target substrate;

a flow rate adjusting unit that adjusts a flow rate of the cooling gas; and

a controller that controls the flow rate adjusting unit based on the temperature detected by the sensor.

4. The freeze cleaning apparatus according to claim 3 , wherein the controller stops supply of the cooling gas and starts thawing the cleaning liquid based on the temperature detected by the sensor.

Assignments (3)
CHANGE OF NAME AND ADDRESS Recorded Feb 4, 2022
From: K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 058957/0124 →
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 058905/0582 →
MERGER Recorded Jan 31, 2022
From: TOSHIBA MEMORY CORPORATION
To: K.K PANGEA
Reel/Frame 058946/0675 →