IP Library › Granted Patent US 11,522,506
Granted Patent B2
US 11,522,506 · App. 16/778,547 · Granted Dec 6, 2022

Compact RFIC with stacked inductor and capacitor

Inventors: Vikas Shilimkar (Chandler, AZ); Kevin Kim (Gilbert, AZ); Joseph Gerard Schultz (Wheaton, IL)
Assignee: NXP B.V.
H03F3/213H01L27/0629H01L28/10H01L28/20H01L28/40H03F3/68H03F2200/222H03F2200/451
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Quick Facts
Patent No.
US 11,522,506
App. No.
16/778,547
Granted
Dec 6, 2022
Kind
B2
Abstract

Various embodiments relate to an integrated circuit including a transistor device having input and output terminals, and an inductor-capacitor (LC) circuit coupled to one of the terminals of the transistor device. The LC circuit includes a capacitor having a top plate and a bottom plate, a inductor having a coil structure, and a connector configured to couple the inductor and an interior portion the top plate of the capacitor. The inductor at least partially overlaps the capacitor.

Claims (42)

1. An integrated circuit comprising:

a semiconductor die;

a transistor device integrally formed in the semiconductor die and having input and output terminals; and

an inductor-capacitor (LC) circuit coupled to one of the terminals of the transistor device, the LC circuit comprising:

a capacitor integrally formed in the semiconductor die and having a top plate and a bottom plate;

an inductor integrally formed in the semiconductor die and having a coil structure and a first terminal; and

a connector configured to couple the first terminal of the inductor and an interior portion of the top plate of the first capacitor,

wherein the inductor at least partially overlaps the capacitor.

2. The integrated circuit of claim 1 , wherein capacitor has a hole, wherein the hole is aligned with part of the coil structure.

3. The integrated circuit of claim 1 , wherein the coil structure has a corner and wherein the hole is aligned with the corner.

4. The integrated circuit of claim 1 , further comprising a resistor coupled in series with the inductor and the capacitor.

5. The integrated circuit of claim 1 , wherein the interior portion the top plate of the capacitor includes one of a center 10%, center 20%, and the center 30% of the top plate of the capacitor.

6. The integrated circuit of claim 1 , wherein the interior portion the top plate of the capacitor includes one of a center 40%, center 50%, and the center 60% of the top plate of the capacitor.

7. A power amplifier system in an integrated circuit, the system comprising:

a first transistor device having a first input terminal and a first output terminal;

a second transistor device having a second input terminal and a second output terminal;

an input matching circuit coupled to the first input terminal of the first transistor, the input matching circuit including a first inductor-capacitor (LC) circuit;

an interstage matching circuit coupled between the first output terminal of first transistor and the second input terminal of the second transistor, the interstage matching circuit including a second LC circuit;

wherein the first and second LC circuits each comprise:

a capacitor having a top plate and a bottom plate;

an inductor having a coil structure; and

a connector configured to couple the inductor and an interior portion of the top plate of the capacitor,

wherein the inductor at least partially overlaps the capacitor.

8. The power amplifier system of claim 7 , wherein capacitor has a hole that is aligned with part of the coil structure.

9. The power amplifier system of claim 7 , wherein the coil structure has a corner and wherein the hole is aligned with the corner.

10. The power amplifier system of claim 7 , further comprising a resistor coupled in series with the inductor and the capacitor.

11. The power amplifier system of claim 7 , wherein the interior portion the top plate of the capacitor includes one of a center 10%, center 20%, and the center 30% of the top plate of the capacitor.

12. The power amplifier system of claim 7 , wherein the interior portion the top plate of the capacitor includes one of a center 40%, center 50%, and the center 60% of the top plate of the capacitor.

13. A power amplification system comprising:

an RF input terminal;

a peak amplifier RF integrated circuit coupled at least indirectly to the RF input terminal;

a carrier amplifier RF integrated circuit coupled at least indirectly to the RF input terminal,

wherein at least one of the peak amplifier RF integrated circuit and the carrier amplifier RF integrated circuit includes:

a transistor device having input and output terminals; and

an LC circuit coupled to one of the terminals of the transistor device, the LC circuit comprising:

a capacitor having a top plate and a bottom plate;

an inductor having a coil structure; and

a connector configured to couple the first inductor and an interior portion of the top plate of the first capacitor,

wherein the inductor at least partially overlaps the capacitor.

14. The power amplification system of claim 13 , wherein capacitor has a hole that is aligned with part of the coil structure.

15. The power amplification system of claim 13 , wherein the coil structure has a corner and wherein the hole is aligned with the corner.

16. The power amplification system of claim 13 , further comprising a resistor coupled in series with the inductor and the capacitor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2020
From: SHILIMKAR, VIKAS; KIM, KEVIN; SCHULTZ, JOSEPH GERARD
To: NXP B.V.
Reel/Frame 051685/0829 →
Continuity (1)
Related Publication 20210242840A1 · Aug 5, 2021
Cited By (1)
US 12,580,538