Chromium-free thermal spray composition, method, and apparatus

1. A method for applying a composition to a substrate, comprising:

thermal spraying a layer of the composition onto the substrate, the substrate being provided by a tubular in an area adjacent to a radially-extending upset, such that the layer forms a guide ring that is at least partially ramp-shaped so as to provide a transition between the tubular and the upset, wherein the guide ring resulting from the thermal spraying has a thickness of from 0.75 inches to 3.00 inches and is configured to remain bonded to the downhole component when used downhole in a well; and

controlling a surface temperature of the substrate while thermal spraying the layer of the composition by controlling at least one of sweep distance, sweep time, sweep rate, or deposition rate such that the surface temperature is maintained below a predetermined maximum temperature,

wherein the composition is chromium-free.

2. The method of claim 1 , wherein the composition comprises is iron.

3. The method of claim 2 , wherein the composition comprises trace amounts of sulfur and phosphorous.

4. The method of claim 1 , wherein thermal spraying the layer of the composition comprises:

feeding one or more wires into a sprayer, wherein the one or more wires provide the composition;

melting a portion of the one or more wires by applying an electrical current to the one or more wires, to melt the composition in the portion;

feeding a gas to the sprayer, such that the melted composition is projected through a nozzle of the sprayer; and

depositing the melted, projected composition onto the substrate, such that the composition solidifies and forms into the layer.

5. The method of claim 4 , wherein the predetermined maximum temperature is less than a tempering temperature of the substrate.

6. The method of claim 1 , wherein thermal spraying the layer of the composition does not create a heat-affected zone in the substrate.

7. The method of claim 1 , wherein the composition has a Rockwell Hardness C of between about 50 and about 65, and a wear rate of between about 0.20 grams per 6,000 rotations and between about 0.40 grams per 6,000 rotations in a Dry Sand Rubber Wheel Test.

8. The method of claim 1 , wherein the composition comprises:

0.5 wt % to 1.0 wt % of carbon;

1.5 wt % to 2.5 wt % of manganese;

0.3 wt % to 1.0 wt % of silicon;

1.5 wt % to 2.5 wt % of nickel;

0.0 wt % to about 0.5 wt % of molybdenum;

1.5 wt % to 2.0 wt % of aluminum;

1.5 wt % to 2.1 wt % of vanadium;

1.8 wt % to 2.8 wt % of titanium;

0.0 wt % to 4.0 wt % of niobium;

4.0 wt % to 5.0 wt % of boron;

0.0 wt % to 3.0 wt % of tungsten; and

a balance of iron.

9. The method of claim 1 , wherein controlling the surface temperature comprises using a cooling medium to transfer heat from the substrate.

10. The method of claim 9 , wherein the cooling medium comprises a gas.

11. The method of claim 1 , wherein controlling the surface temperature comprises controlling a feed rate of one or more wires including the composition to a thermal sprayer.

12. The method of claim 1 , wherein the thickness is from 1.00 inches to 3.00 inches.

13. The method of claim 1 , wherein controlling the surface temperature comprises controlling the sweep distance, the sweep time, the sweep rate, or a combination thereof.

14. The method of claim 1 , wherein the area adjacent to the radially-extending upset is also adjacent to a threaded portion of the tubular, and wherein the upset comprises a collar that includes threads that receive the threaded portion of the tubular.

15. A method for applying a composition to a substrate, comprising:

thermal spraying a layer of the composition onto the substrate, the substrate being provided by a downhole component, wherein the layer resulting from the thermal spraying has a thickness of at least 0.10 inches and is configured to remain bonded to the downhole component when used downhole in a well; and

controlling a surface temperature of the substrate while thermal spraying the layer of the composition by controlling at least one of sweep distance, sweep time, sweep rate, or deposition rate such that the surface temperature is maintained below a predetermined maximum temperature,

wherein the composition is chromium-free, and wherein the composition comprises:

0.25 wt % to 1.25 wt % of carbon;

1.0 wt % to 3.5 wt % of manganese;

0.1 wt % to 1.4 wt % of silicon;

1.0 wt % to 3.0 wt % of nickel;

0.0 to 2.0 wt % of molybdenum;

0.7 wt % to 2.5 wt % of aluminum;

1.0 wt % to 2.7 wt % of vanadium;

1.5 wt % to 3.0 wt % of titanium;

0.0 wt % to 6.0 wt % of niobium;

3.5 wt % to 5.5 wt % of boron;

0.0 wt % to 10.0 wt % tungsten; and

a balance of iron.

16. The method of claim 15 , wherein the balance comprises trace amounts of sulfur and phosphorous.

17. A method for applying a composition to a substrate, comprising:

feeding a first wire and a second wire to a nozzle, wherein the first and second wires each comprise the composition;

generating a voltage differential between the first and second wires, such that portions of the first and second wires melt;

spraying droplets comprising a combination of the portions of the first and second wires onto the substrate in a plurality of passes across the substrate, wherein droplets of a second pass build upon droplets of a first pass, so as to form a layer of the composition on the substrate, the substrate being provided by a tubular in an area adjacent to a radially-extending upset, such that the layer forms a guide ring that is at least partially ramp-shaped so as to provide a transition between an outer diameter surface of the tubular and an outer diameter surface of the upset,

wherein the guide ring resulting from the thermal spraying has a thickness of at least 0.10 inches and is configured to remain bonded to the tubular when used downhole in a well, and wherein the composition is chromium-free.

18. The method of claim 17 , further comprising controlling a temperature of the substrate during the thermal spraying, such that the substrate does not exceed a temperature of 400° F.

19. The method of claim 17 , wherein controlling comprises comprising adjusting a sweep rate and/or deposition rate.

20. The method of claim 17 , wherein controlling comprises applying a cooling medium to the substrate.

21. The method of claim 17 , wherein the thickness is between 0.75 inches and 3.00 inches.