Laser cutting metal foil with a polymer backing layer
Laser cutting a metal foil by providing a polymer film as a carrier layer for the metal foil where the metal foil is ablated by the laser beam wavelength selected for laser cutting and wherein the polymer film is a polymer film that is transparent to the laser beam wavelength selected for laser cutting such that laser cutting produces metal foil cut parts in a substrate while the polymer backing remains intact for supporting the cut parts for subsequent separation of the cut parts from substrate.
1. A method of laser cutting a metal foil layer from a substrate construction, the method comprising:
providing a carrier layer for the metal foil layer;
generating a laser beam having a selected wavelength;
directing the laser beam toward a surface of the metal foil layer to cut the metal foil layer, wherein the metal foil layer is vaporized by the laser beam at the selected wavelength and wherein the carrier layer is transparent to the laser beam at the selected wavelength such that the carrier layer remains substantially intact while the metal foil layer is laser cut into a plurality of parts; and
directing the laser beam to one or more removal areas cut from the substrate and by setting the laser beam to cause the metal foil layer to curl proximate one or more cut lines and the metal foil layer to lift off of the carrier layer proximate the one or more cut lines for aiding in separation of the carrier layer from the metal foil layer.
2. The method of claim 1 , wherein the carrier layer is a polymer film that is transparent to the selected wavelength.
3. The method of claim 1 , wherein the carrier layer is laminated to the metal foil layer using an adhesive layer.
4. The method of claim 1 , wherein aiding the separation of the carrier later from the metal foil layer comprises defocusing the laser beam and reducing a scanning speed of the laser beam while directing the laser beam to one or more removal areas.
5. The method of claim 1 , further comprising directing the laser beam along a sinusoidal pattern between the one or more removal areas to curl or bend the metal foil layer.
6. The method of claim 1 , wherein the substrate is retained in place during laser processing by a restraining mechanism comprising generating a vacuum below the substrate.
7. A substrate construction for laser cutting a metal foil, the substrate construction comprising:
a metal foil layer; and
a carrier layer supporting the metal foil layer,
wherein the metal foil layer comprises a metal that is vaporized by laser energy provided at a selected wavelength in the range of 1020 nm to 1090 nm and wherein the carrier layer is transparent to the laser energy provided at the selected wavelength such that when laser processed at the selected wavelength the metal foil lifts off the carrier layer at one or more locations proximate the locations of the metal foil layer vaporized during laser processing, aiding the metal foil layer in separation from the carrier layer.
8. The substrate construction of claim 5 , wherein the carrier layer is a polymer film.
9. The substrate construction of claim 5 , and further comprising an adhesive layer between the carrier layer and the metal foil layer.
10. The substrate construction of claim 8 , wherein the polymer film remains intact when the metal foil layer is cut by laser energy from a laser beam having the wavelength in the range of 1020 nm to 1090 nm.
11. A method of laser processing a multi-layer substrate, the method comprising:
one or more locations on a top layer of the substrate with a laser beam at a selected wavelength to cut a part from the top layer;
subsequently directing the laser beam to one or more separation locations at or near one or more of the vaporized locations to cause the top layer to curl at or near at least one or more of the separation locations wherein the top layer of the multi-layer substrate comprises a metal foil and a bottom layer of the multi-layer substrate is a carrier layer comprising a polymer.
12. The method of claim 11 , wherein subsequently directing the laser beam to one or more separation locations further comprises defocusing the laser beam.
13. The method of claim 11 , wherein the laser beam stresses the top layer at or near separation locations but does not cut the top layer at or near the separation locations such that the laser beam then causes the top layer to partially separate from a carrier layer.
14. The method of claim 11 , wherein the multi-layer substrate further comprises an adhesive layer between the top layer and the carrier layer.