IP Library Granted Patent US 11,252,495
Granted Patent B2
US 11,252,495 · App. 16/781,694 · Granted Feb 15, 2022

Headphone pad mounting system

Inventors: Daniel William Clark (San Diego, CA); Robert Jason Egger (San Diego, CA)
Assignee: Dan Clark Audio, Inc.
H04R1/105H04R1/1075H04R1/1066
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Quick Facts
Patent No.
US 11,252,495
App. No.
16/781,694
Granted
Feb 15, 2022
Kind
B2
Abstract

A headphone may employ an ear pad mounted to a housing. Affixing a soft sticky or tacky non-adhesive polymer base to the underside of a headphone ear pad allows easy attachment of ear pads to a headphone with the ability to frequently and non-destructively swap pads, without the weight, bulk and fragility of other pad attachment mechanisms.

Claims (28)

1. A method comprising:

affixing a non-adhesive polymer base to an underside of an ear pad, the non-adhesive polymer base comprising a gel elastomer;

attaching the ear pad to a headphone housing; and

playing sound via an acoustic driver positioned within the headphone housing.

2. The method of claim 1 , wherein the non-adhesive polymer base is affixed to the ear pad via at least one adhesive.

3. The method of claim 1 , wherein the ear pad is attached to an ear cup of the headphone housing.

4. The method of claim 1 , wherein the ear pad contacts a baffle of the headphone housing.

5. The method of claim 1 , wherein the ear pad comprises a single material.

6. The method of claim 1 , wherein the ear pad comprises a multiple different materials.

7. A method comprising:

affixing a non-adhesive polymer base to an underside of an ear pad, the non-adhesive polymer base comprising only a gel elastomer;

attaching the first ear pad to a headphone housing;

playing sound via an acoustic driver positioned within the headphone housing;

removing the first ear pad from the headphone housing; and

attaching a second ear pad to the headphone housing.

8. The method of claim 7 , wherein the headphone housing is unaltered between removal of the first ear pad and attachment of the second ear pad.

9. The method of claim 7 , wherein the first ear pad and second ear pad each have separate non-adhesive polymer bases.

10. The method of claim 7 , wherein the first ear pad is positioned in alignment with the headphone housing and the second ear pad overlaps an edge of the headphone housing.

11. The method of claim 7 , wherein a user customizes the position of the non-adhesive polymer base relative to the underside of the ear pad.

12. A method comprising:

affixing a non-adhesive polymer base to an underside of an ear pad the non-adhesive polymer base comprising a gel elastomer;

attaching the ear pad to a headphone housing in a first position;

playing sound via an acoustic driver positioned within the headphone housing;

removing the ear pad from the headphone housing; and

re-attaching the ear pad to the headphone housing in a second position.

13. The method of claim 12 , wherein the first position and the second position are different relative to an ear cup of the headphone housing.

14. The method of claim 12 , wherein the ear pad is re-attached to the headphone housing without altering the headphone housing or non-adhesive polymer base.

15. The method of claim 12 , wherein the ear pad is re-attached to the headphone housing cyclically over time without altering the headphone housing or non-adhesive polymer base.

Assignments (2)
CHANGE OF NAME Recorded Jan 6, 2022
From: MRSPEAKERS, INC.
To: DAN CLARK AUDIO, INC.
Reel/Frame 058574/0664 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2020
From: CLARK, DANIEL WILLIAM; EGGER, ROBERT JASON
To: MRSPEAKERS, LLC
Reel/Frame 053231/0437 →
Continuity (2)
Provisional Application 62800844 · Feb 4, 2019
Related Publication 20200252709A1 · Aug 6, 2020