IP Library Granted Patent US 11,081,312
Granted Patent B2
US 11,081,312 · App. 16/785,373 · Granted Aug 3, 2021

Method of manufacturing emitter, emitter, and focused ion beam apparatus

Inventors: Tomokazu Kozakai (Tokyo, JP); Yoshimi Kawanami (Tokyo, JP); Hiroyuki Mutoh (Tokyo, JP); Yoko Nakajima (Tokyo, JP); Hironori Moritani (Tokyo, JP); Shinichi Matsubara (Tokyo, JP)
Assignee: HITACHI HIGH-TECH SCIENCE CORPORATION
H01J37/08H01J37/10H01J37/3053H01J2237/0807H01J2237/3174H01J2237/31749
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Quick Facts
Patent No.
US 11,081,312
App. No.
16/785,373
Granted
Aug 3, 2021
Kind
B2
Abstract

A method of manufacturing an emitter is disclosed. The method enables a crystal structure of the tip of the front end of the emitter to return to its original state with high reproducibility by rearranging atoms in a treatment, and enables a long lasting emitter to be attained by suppressing extraction voltage rise after the treatment. As a method of manufacturing an emitter having a sharpened needle-shape, the method includes: performing an electropolishing process for the front end of an emitter material having conductivity to taper toward the front end; and performing an etching to make the number of atoms constituting the tip of the front end be a predetermined number or less by further sharpening the front end through an electric field-induced gas etching having constantly applied voltage, while observing the crystal structure of the front end, by a field ion microscope, in a sharp portion having the front end at its apex.

Claims (9)

1. A method of manufacturing an emitter that has a sharpened needle-shape, the method comprising:

an electropolishing process electrolytically polishing a front end portion of a conductive emitter material to taper towards the front end; and

an etching process further sharpening the front end by an electric field-induced gas etching processing in a state maintaining an applied voltage constant while observing, through a field ion microscope, a crystal structure of the front end at a sharp portion with the front end portion as an apex to make a number of atoms constituting a tip of the front end fewer than or equal to a predetermined number.

2. The method of manufacturing an emitter of claim 1 , further comprising:

a first etching process performing etching processing, between the electropolishing process and the etching process, by irradiating the processed part of the emitter material with a focused ion beam to form a sharp portion with a front end as the apex.

3. The method of manufacturing an emitter of claim 1 , wherein tungsten is used as the emitter material.

4. The method of manufacturing an emitter of claim 1 , wherein tungsten is used as the emitter material.

5. The method of manufacturing an emitter of claim 1 , wherein iridium is used as the emitter material.

6. The method of manufacturing an emitter of claim 2 , wherein iridium is used as the emitter material.

Assignments (3)
CHANGE OF ADDRESS Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 072903/0593 →
CHANGE OF NAME Recorded Sep 17, 2025
From: HITACHI HIGH-TECH SCIENCE CORPORATION
To: HITACHI HIGH-TECH ANALYSIS CORPORATION
Reel/Frame 072913/0104 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 28, 2021
From: KOZAKAI, TOMOKAZU; KAWANAMI, YOSHIMI; MUTOH, HIROYUKI; NAKAJIMA, YOKO; MORITANI, HIRONORI; MATSUBARA, SHINICHI
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 056689/0937 →
Priority Claims (1)
JP JP2019-057661 · Mar 26, 2019 · national
Continuity (1)
Related Publication 20200312603A1 · Oct 1, 2020