Memory devices and methods of manufacturing thereof
A semiconductor device is disclosed. The semiconductor device includes a fin-based structure formed on a substrate. The semiconductor device includes a plurality of first nanosheets, vertically spaced apart from one another, that are formed on the substrate. The semiconductor device includes a first source/drain (S/D) region electrically coupled to a first end of the fin-based structure. The semiconductor device includes a second S/D region electrically coupled to both of a second end of the fin-based structure and a first end of the plurality of first nanosheets. The semiconductor device includes a third S/D region electrically coupled to a second end of the plurality of first nanosheets. The fin-based structure has a first crystal lattice direction and the plurality of first nano sheets have a second crystal lattice direction, which is different from the first crystal lattice direction.
1. A semiconductor device, comprising:
a fin-based structure formed on a substrate, wherein the fin-based structure extends along a physical direction;
a plurality of first nanosheets, vertically spaced apart from one another, that are formed on the substrate, wherein the plurality of first nanosheets extend along the physical direction;
a first source/drain (S/D) region coupled to a first end of the fin-based structure along the physical direction, and having a first conductive type;
a second S/D region coupled to both of a second end of the fin-based structure and a first end of the plurality of first nanosheets along the physical direction, and having the first conductive type; and
a third S/D region coupled to a second end of the plurality of first nanosheets along the physical direction, and having the first conductive type;
wherein at least one active plane of the fin-based structure has a first crystal lattice direction, and at least one active plane of each the plurality of first nanosheets has a second crystal lattice direction that is different from the first crystal lattice direction.
2. The semiconductor device of claim 1 , wherein the first crystal lattice direction includes a <110> crystal lattice direction, and the second crystal lattice direction includes a [100] crystal lattice direction.
3. The semiconductor device of claim 1 , wherein the first crystal lattice direction includes at least one of the following crystal lattice directions: [110], [101], [011], [ 1 10], [1 1 0], [ 1 01], [10 1 ], [01 1 ], or [0 1 1], and the second crystal lattice direction includes at least one of the following crystal lattice directions: [100], [010], [001], [ 1 00], [0 1 0], or [00 1 ].
4. The semiconductor device of claim 1 , wherein sidewalls of the fin-based structure each has a {110} crystal plane, and a top boundary and bottom boundary of each of the plurality of first nanosheets each have a {100} crystal plane.
5. The semiconductor device of claim 1 , wherein the fin-based structure, the first S/D region, and the second S/D region are configured as at least a portion of a programming transistor of an anti-fuse memory cell, and the plurality of first nanosheets, the second S/D region, and the third S/D region are configured as at least a portion of a reading transistor of the anti-fuse memory cell.
6. The semiconductor device of claim 5 , wherein the reading transistor is electrically coupled to the programming transistor in series via the second shared S/D region.
7. The semiconductor device of claim 1 , further comprising:
a plurality of second nanosheets, vertically spaced apart from one another, that are formed on the substrate, the third S/D region coupled to a first end of the plurality of second nanosheets along the physical direction;
a fourth S/D region electrically coupled to a second end of the plurality of second nanosheets along the physical direction,
wherein at least one active plane of each of the plurality of second nanosheets has the second crystal lattice direction.
8. The semiconductor device of claim 7 , wherein sidewalls of the fin-based structure each has a {110} crystal plane, and a top boundary and bottom boundary of each of the plurality of first and second nanosheets each have a {100} crystal plane.
9. The semiconductor device of claim 7 , wherein the fin-based structure, the first S/D region, and the second S/D region are configured as at least a portion of a programming transistor of an anti-fuse memory cell, the plurality of first nanosheets, the second S/D region, and the third S/D region are configured as at least a portion of a first reading transistor of the anti-fuse memory cell, and the plurality of second nanosheets, the third S/D region, and the fourth S/D region are configured as at least a portion of a second reading transistor of the anti-fuse memory cell.
10. The semiconductor device of claim 1 , further comprising:
a plurality of all-around gate stacks operatively associated with the plurality of first nanosheets, each of the plurality of gate stacks including a metal gate and a gate dielectric.
11. A semiconductor device, comprising:
a fin-based structure formed on a substrate, the fin-based structure extended along a first direction;
one or more first nanosheets disposed on the substrate, each of the one or more first nanosheets spaced apart from one another along a second direction perpendicular to the first direction, wherein the one or more first nanosheets are also extended along the first direction;
a first source/drain (S/D) region disposed between the fin-based structure and the one or more first nanosheets along the first direction, and having a first conductive type;
a second S/D region disposed opposite the fin-based structure from the first S/D region, and having the first conductive type; and
a third S/D region disposed opposite the one or more first nanosheets from the first S/D region, and having the first conductive type;
wherein sidewalls of the fin-based structure, facing toward or away from a third direction perpendicular to the first direction and the second direction, each have a first crystal plane direction, and a top boundary and a bottom boundary of each of the first nanosheets each have a second, different crystal plane direction.
12. The semiconductor device of claim 11 , wherein the first crystal plane direction includes (110), and the second, different crystal plane direction includes (100).
13. The semiconductor device of claim 11 , wherein the fin-based structure, the first S/D region, and the second S/D region are configured as at least a portion of a programming transistor of an anti-fuse memory cell, and the one or more first nanosheets, the first S/D region, and the third S/D region are configured as at least a portion of a reading transistor of the anti-fuse memory cell.
14. The semiconductor device of claim 13 , wherein the programming transistor is electrically coupled to the reading transistor via the first S/D region.
15. The semiconductor device of claim 11 , further comprising:
one or more second nanosheets disposed on the substrate, each of the one or more second nanosheets spaced apart from one another along the second direction, wherein the third S/D region is disposed between the one or more second nanosheets and the one or more first nanosheets along the first direction; and
a fourth source/drain (S/D) region disposed opposite the one or more second nanosheets from the third S/D region.
16. The semiconductor device of claim 15 , wherein the fin-based structure, the first S/D region, and the second S/D region are configured as at least a portion of a programming transistor of an anti-fuse memory cell, the one or more first nanosheets, the first S/D region, and the third S/D region are configured as at least a portion of a first reading transistor of the anti-fuse memory cell, and the one or more second nanosheets, the third S/D region, and the fourth S/D region are configured as at least a portion of a second reading transistor of the anti-fuse memory cell.
17. The semiconductor device of claim 16 , wherein the programming transistor is electrically coupled to the first reading transistor via the first S/D region, and the first reading transistor is electrically coupled to the second reading transistor via the third S/D region.
18. A semiconductor device, comprising:
a first transistor having a first conductive type; and
a second transistor having the first conducive type and connected to the first transistor in series;
wherein the first transistor includes a fin-based structure extending along a physical direction, and at least one active plane of the fin-based structure has a first crystal lattice direction;
wherein the second transistor includes a plurality of nanosheets vertically spaced apart from one another and extending along the physical direction, and at least one active plane of each the plurality of first nanosheets has a second crystal lattice direction that is different from the first crystal lattice direction.
19. The semiconductor device of claim 18 ,
wherein the first transistor includes:
a first source/drain (S/D) region disposed between the fin-based structure and the one or more first nanosheets along the physical direction, and having the first conductive type; and
a second S/D region disposed opposite the fin-based structure from the first S/D region, and having the first conductive type; and
wherein the second transistor includes:
the first S/D region; and
a third S/D region disposed opposite the one or more first nanosheets from the first S/D region, and having the first conductive type.
20. The semiconductor device of claim 18 , wherein the first crystal lattice direction includes a <110> crystal lattice direction, and the second crystal lattice direction includes a [100] crystal lattice direction.