Deterministic quantum emitter formation in hexagonal boron nitride via controlled edge creation
A quantum emitter device is composed of a hole milled in a layer of hexagonal boron nitride (hBN) on a substrate made of silicon dioxide. The hole preferably has a side wall angle 1.1°±0.28° from the horizontal, has an oval shape with minor axis 516 nm±20 nm and major axis 600 nm±20 nm, and/or has a depth 4 nm±1 nm. The hBN layer preferably has a total thickness of 5-10 nm. The holes may be fabricated using a gallium focused ion beam, a helium focused ion beam, electron beam directed etching, or photolithography and reactive ion etch (RIE) with sidewall tapering.
1. A quantum emitter device comprising: a substrate made of silicon dioxide; a layer of hexagonal boron nitride (hBN) on the substrate; and a hole milled in the layer of hBN.
2. The device of claim 1 , wherein the hole milled in the layer of hBN has a side wall angle 1.1°±0.28° from the horizontal.
3. The device of claim 1 , wherein the hole milled in the layer of hBN has an oval shape with minor axis 516 nm±20 nm, major axis 600 nm±20 nm.
4. The device of claim 1 , wherein the hole milled in the layer of hBN has a depth 4 nm±1 nm.
5. The device of claim 1 , wherein the hBN layer has a total thickness of 5-10 nm.
6. The device of claim 1 , comprising multiple holes milled in the layer of hBN.
7. The device of claim 1 , comprising multiple holes milled in the layer of hBN with a density of 1 hole per 1 μm 2 .
8. A method of fabricating solid-state quantum emitters in 2D hexagonal boron nitride comprising providing a layer of hexagonal boron nitride (hBN) on a substrate made of silicon dioxide, and fabricating holes in the layer of hBN.
9. The method of claim 8 , wherein fabricating the holes uses a gallium focused ion beam with ion dose of 10 pC/μm 2 , and beam energy of 20 keV.
10. The method of claim 8 , wherein fabricating the holes uses a helium focused ion beam, preferably about 100 pC/μm 2 dose at an energy of 25 keV.
11. The method of claim 8 , wherein fabricating the holes uses electron beam directed etching at 25 and 15 keV and at a dose of ˜1 μC/μm 2 , performed in H2O vapor.
12. The method of claim 8 , wherein fabricating the holes uses photolithography and reactive ion etch (RIE) with sidewall tapering.
13. The method of claim 8 , wherein fabricating the holes uses photolithography to define array of holes with ˜500 nm diameter in photoresist, performing reactive ion etching with Ar or XeF 2 ions.