Semiconductor device and method for fabricating the same
There is provided a semiconductor device having enhanced operation performance by utilizing a cut region where a gate cut is implemented. There is provided a semiconductor device comprising a first active pattern, a second active pattern, a third active pattern, and a fourth active pattern, all of which extend in parallel in a first direction, and are arranged along a second direction intersecting the first direction; a first gate electrode extended in the second direction on the first to fourth active patterns a first cut region extended in the first direction between the first active pattern and the second active pattern to cut the first gate electrode and a second cut region extended in the first direction between the third active pattern and the fourth active pattern to cut the first gate electrode, wherein one or more first dimensional features related to the first cut region is different from one or more second dimensional features related to the second cut region.
1. A semiconductor device comprising:
a first active pattern, a second active pattern, a third active pattern, and a fourth active pattern, all of which extend in parallel in a first direction, and are arranged along a second direction intersecting the first direction;
a first gate electrode provided on the first to fourth active patterns and extending in the second direction;
a first cut region that extends in the first direction between the first active pattern and the second active pattern to cut the first gate electrode; and
a second cut region that extends in the first direction between the third active pattern and the fourth active pattern to cut the first gate electrode,
wherein one or more first dimensional features related to the first cut region is different from one or more second dimensional features related to the second cut region, and
wherein the one or more first dimensional features related to the first cut region being different from one or more second dimensional features related to the second cut region comprises:
a first length of the first cut region extended in the first direction being different from a second length of the second cut region extended in the first direction,
a first width of the first cut region in the second direction is shorter than a second width of the second cut region, and
a first height of a bottom surface of the first cut region from a top surface of the substrate is lower than a second height of a bottom surface of the second cut region.
2. The semiconductor device of claim 1 , wherein the one or more first dimensional features related to the first cut region being different from one or more second dimensional features related to the second cut region comprises:
a first distance between the second active pattern and the first cut region being different from a second distance between the third active pattern and the second cut region.
3. The semiconductor device of claim 2 , wherein the first and second active patterns correspond to an NFET region, and the third and fourth active patterns correspond to a PFET region, and
wherein the second distance between the third active pattern and the second cut region is shorter than the first distance between the second active pattern and the first cut region.
4. The semiconductor device of claim 2 , wherein the first and second active patterns corresponding to an NFET region, and the third and fourth active patterns corresponding to a PFET region, and
wherein the second length of the second cut region extended in the first direction is shorter than the first length of the first cut region extended in the first direction.
5. The semiconductor device of claim 1 , further comprising:
a second gate electrode provided on the first to fourth active patterns, the second gate electrode extending in the second direction adjacent to the first gate electrode; and
a third cut region that extends in the first direction between the second active pattern and the third active pattern to cut the second gate electrode, and not to cut the first gate electrode.
6. The semiconductor device of claim 5 , wherein a third distance between the second active pattern and the third cut region is different from a fourth distance between the third active pattern and the third cut region.
7. The semiconductor device of claim 1 , further comprising:
a field insulating film configured to cover a part of side surfaces of the first to fourth active patterns; and
a gate dielectric film interposed between the first to fourth active patterns and the first gate electrode, and between the field insulating film and the first gate electrode.
8. The semiconductor device of claim 7 , wherein the gate dielectric film is not extended along a side surface of the first cut region and a side surface of the second cut region.
9. The semiconductor device of claim 5 , further comprising:
a third gate electrode provided on the first to fourth active patterns, the third gate electrode extending in the second direction; and
a fourth cut region that extends in the first direction between the second active pattern and the third active pattern to cut the third gate electrode, and not to cut the first gate electrode.
10. A semiconductor device comprising:
a substrate;
a first active pattern, a second active pattern, and a third active pattern on the substrate, all of which extend in parallel in a first direction, and are arranged along a second direction intersecting the first direction;
a first gate electrode provided on the first to third active patterns and extending in the second direction;
a second gate electrode extended in the second direction adjacent to the first gate electrode on the first to third active patterns;
a first cut region that extends in the first direction between the first active pattern and the second active pattern to cut the first gate electrode; and
a second cut region that extends in the first direction between the second active pattern and the third active pattern to cut the second gate electrode, and not to cut the first gate electrode,
wherein one or more first dimensional features related to the first cut region is different from one or more second dimensional features related to the second cut region, and
wherein the one or more first dimensional features related to the first cut region being different from the one or more second dimensional features related to the second cut region further comprises:
a first length of the first cut region extending in the first direction being shorter than a second length of the second cut region extending in the first direction,
a first width of the first cut region in the second direction is shorter than a second width of the second cut region, and
a first height of a bottom surface of the first cut region from a top surface of the substrate is lower than a second height of a bottom surface of the second cut region.
11. The semiconductor device of claim 10 , wherein the second active pattern corresponds to an NFET region, and
wherein the one or more first dimensional features related to the first cut region being different from the one or more second dimensional features related to the second cut region further comprises a first distance between the second active pattern and the second cut region being shorter than a second distance between the second active pattern and the first cut region.
12. The semiconductor device of claim 10 , wherein the second active pattern corresponds to a PFET region, and
wherein the one or more first dimensional features related to the first cut region being different from the one or more second dimensional features related to the second cut region further comprises a first distance between the second active pattern and the second cut region being longer than a second distance between the second active pattern and the first cut region.
13. The semiconductor device of claim 10 , wherein the first gate electrode is an active gate electrode, and the second gate electrode is a dummy gate electrode.
14. The semiconductor device of claim 10 , wherein a first distance between the first active pattern and the first cut region is a same as a second distance between the second active pattern and the first cut region.
15. The semiconductor device of claim 10 , wherein a first distance between the second active pattern and the second cut region is a same as a second distance between the third active pattern and the second cut region.
16. A semiconductor device, comprising:
a substrate comprising an NFET region and a PFET region;
a first active pattern provided on the NFET region and extending in a first direction;
a second active pattern provided on the PFET region and extending in the first direction;
a first gate electrode provided on the first and second active patterns and extending in a second direction intersecting the first direction;
a first cut region provided on a first side surface of the first active pattern opposite to the second active pattern and extending in the first direction to cut the first gate electrode; and
a second cut region provided on a second side surface of the second active pattern opposite to the first active pattern and extending in the first direction to cut the first gate electrode,
wherein one or more first dimensional features related to the first cut region is different from one or more second dimensional features related to the second cut region, and
wherein the one or more first dimensional features related to the first cut region being different from the one or more second dimensional features related to the second cut region further comprises:
a first length of the first cut region extending in the first direction being shorter than a second length of the second cut region extending in the first direction,
a first width of the first cut region in the second direction is shorter than a second width of the second cut region, and
a first height of a bottom surface of the first cut region from a top surface of the substrate is lower than a second height of a bottom surface of the second cut region.
17. The semiconductor device of claim 16 , wherein the one or more first dimensional features related to the first cut region being different from the one or more second dimensional features related to the second cut region further comprises:
a second distance between the second active pattern and the second cut region is shorter than a first distance between the first active pattern and the first cut region.
18. The semiconductor device of claim 16 , further comprising:
a second gate electrode provided on the first and second active patterns and extending in the second direction adjacent to the first gate electrode; and
a third cut region that extends in the first direction between the first active pattern and the second active pattern to cut the second gate electrode, and not to cut the first gate electrode.
19. The semiconductor device of claim 18 , wherein a third distance between the first active pattern and the third cut region is shorter than a fourth distance between the second active pattern and the third cut region.
20. The semiconductor device of claim 9 , further comprising:
a gate contact provided between the third cut region and the fourth cut region in the first direction.