IP Library Granted Patent US 11,111,578
Granted Patent B1
US 11,111,578 · App. 16/790,559 · Granted Sep 7, 2021

Atomic layer deposition of fluoride thin films

Inventors: Jeffrey W. Elam (Elmhurst, IL); Anil U. Mane (Naperville, IL); Maximillian Gebhard (Westmont, IL)
Assignee: UChicago Argonne, LLC
C23C16/30C23C16/4408C23C16/45527C23C16/45553C23C16/45555H01J37/285
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,111,578
App. No.
16/790,559
Granted
Sep 7, 2021
Kind
B1
Abstract

A secondary electron emissive coating. The coating is formed by atomic layer deposition of CaF 2 on a substrate by ALD half cycle exposure of an alkaline metal amidinate and ALD half cycle exposure of a fluorinated compound, where the deposition occurs at a reaction temperature greater than a highest sublimation temperature of the first metal precursor and the second metal precursor and less than 50° C. above the highest sublimation temperature.

Claims (17)

1. A method of forming a secondary electron emissive coating comprising:

providing a substrate within an atomic layer deposition reactor; and

depositing a coating of CaF 2 by an atomic layer deposition process including at least one cycle of:

pulsing a first metal precursor comprising an alkaline metal amidinate into the reactor for a first metal precursor pulse time;

purging the reactor of the first metal precursor;

pulsing a second precursor comprising a fluorinated compound into the reactor for a second precursor pulse time; and

purging the reactor of the co-reactant precursor;

wherein the depositing occurs at a reaction temperature greater than a highest sublimation temperature of the first metal precursor and the second metal precursor and less than 50° C. above the highest sublimation temperature.

2. The method of claim 1 , wherein the substrate is an aluminum compound.

3. The method of claim 1 , wherein the substrate is AlF 3 .

4. The method of claim 1 , wherein the first metal precursor is [Ca(amd) 2 ] 2 .

5. The method of claim 4 , wherein the second precursor is selected from the group consisting of HF, HF-pyridine, WF 6 , TaF 5 , MoF 6 , and NbF 5 .

6. The method of claim 5 , wherein the second precursor is HF or HF-pyridine.

7. The method of claim 6 , wherein the reaction temperature is less than 200° C.

8. The method of claim 1 , wherein depositing the coating comprises at least 10 atomic layer deposition cycles.

9. The method of claim 4 , wherein depositing the coating comprises at least 40 atomic layer deposition cycles.

10. The method of claim 1 , wherein the reaction temperature is 25° C.-50° C. above the highest sublimation temperature.

Assignments (2)
CONFIRMATORY LICENSE Recorded Jan 22, 2021
From: UCHICAGO ARGONNE, LLC
To: UNITED STATES DEPARTMENT OF ENERGY
Reel/Frame 054998/0470 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 2, 2020
From: GEBHARD, MAXIMILIAN; ELAM, JEFFREY W.; MANE, ANIL U.
To: UCHICAGO ARGONNE, LLC
Reel/Frame 054521/0350 →