Distributed multi-die protocol application interface
Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
1. A single package multi-die electronic device comprising:
a communication bus comprising a plurality of channels;
a first die comprising a first bus interface coupled to the communication bus; and
a second die comprising:
a second bus interface coupled to the communication bus; and
data processing circuitry configured to exchange data with the first die over the communication bus;
wherein the plurality of channels comprises:
a first set of unidirectional channels extending from the first bus interface to the second bus interface; and
a second set of unidirectional channels extending from the second bus interface to the first bus interface;
wherein the first bus interface is configured to provide source synchronous data to the second bus interface using the communication bus.
2. The single package multi-die electronic device of claim 1 , wherein the second bus interface is configured to synchronize data signals of the source synchronous data by latching source synchronous data received from the first bus interface using a received clock signal.
3. The single package multi-die electronic device of claim 1 , wherein the second dies comprises data transfer circuitry configured to couple the second bus interface to the data processing circuitry.
4. The single package multi-die electronic device of claim 3 , wherein the data exchanged over the communication bus is communicated at a first data rate that is an integer ratio of a second data rate of the data transfer circuitry.
5. The single package multi-die electronic device of claim 3 , wherein the data transfer circuitry comprises queuing circuitry.
6. The single package multi-die electronic device of claim 1 , comprising:
a first clock domain associated with the first bus interface; and
a second clock domain associated with the data processing circuitry.
7. The single package multi-die electronic device of claim 1 , wherein:
the first die comprises first control circuitry configured to manage the first bus interface;
the second die comprises a second control circuitry communicatively coupled to the first control circuitry; and
the second control circuitry is configured to manage the second bus interface.
8. The single package multi-die electronic device of claim 7 , wherein the first control circuitry and the second control circuitry employ a synchronous control protocol.
9. The single package multi-die electronic device of claim 8 , wherein the synchronous control protocol comprises validity information.
10. The single package multi-die electronic device of claim 1 , wherein the source synchronous data comprises peripheral component express (PCIe) data, memory data, or both.
11. An electronic device comprising:
a single package multi-die electronic device comprising:
data processing circuitry;
a communication bus comprising a plurality of unidirectional single-ended data lines;
a first die comprising:
a first clock domain associated with a first communication bus interface of the first die; and
a second clock domain associated with data transfer circuitry that couples the first communication bus interface with the data processing circuitry; and
a second die that transmits and receives data with the first die via the plurality of data lines.
12. The electronic device of claim 11 , wherein the second die:
comprises a second communication bus interface; and
is configured to transmit and receive the data with the first die using the second communication bus interface.
13. The electronic device of claim 11 , wherein:
the second die is coupled to a memory device; and
the data exchanged between the first die and the second die comprises memory data exchanged with the memory device.
14. The electronic device of claim 11 , wherein:
the first clock domain comprises a first clock that provides a first bit rate;
the second clock domain comprises a second clock that provides a second bit rate; and
the first bit rate is a ratio of the second bit rate.
15. The electronic device of claim 11 , wherein:
the second die is coupled to an external device over a Peripheral Component Interface Express (PCIe) data link; and
the data exchanged between the second die and the first die comprises PCIe data transmitted over the PCIe data link.
16. The electronic device of claim 11 , wherein:
the communication bus comprises a clock signal line; and
the data exchanged between the first die and the second die comprises source synchronous data.
17. The electronic device of claim 11 , wherein the data transfer circuitry comprises queuing circuitry.
18. A method of transmitting data from a first die to a second die of a single package multi-die electronic device, the method comprising:
transmitting data to a first bus interface of the first die at a first data rate;
adjusting, at the first bus interface, the data to a second data rate;
transmitting the converted data over a communication bus from the first bus interface to second bus interface of the second die;
adjusting, at the second bus interface, the received data from the second data rate to the first data rate; and
transmitting, via data transfer circuitry, the received data to processing circuitry of the second die at the first data rate.
19. The method of claim 18 , wherein the data comprises peripheral component interconnect express (PCIe) data and memory data.
20. The method of claim 19 , wherein the memory data comprises double data rate (DDR) data.