Vertical memory device having an insulator layer for improved yield
A semiconductor memory device includes a substrate, a first conductor layer, and a first insulator layer. The substrate includes a first region on which memory cells are provided, a second region on which a control circuit of the memory cells is provided, and a third region separating the first region and the second region. The first conductor layer is above the second region of the substrate. The first insulator layer is above the second and third regions of the substrate. The first insulator layer includes a first portion that is above the first conductor layer and extends along a surface direction of the substrate, and a second portion that is continuous with the first portion and extends along a thickness direction of the substrate from the first portion toward a surface of the substrate in the third region.
1. A semiconductor memory device, comprising:
a semiconductor substrate including a first region on which memory cells are provided, a second region on which a control circuit of the memory cells is provided, and a third region separating the first region and the second region;
a first conductor layer above the second region of the semiconductor substrate, the first conductor layer being a gate electrode of a transistor included in the control circuit;
a first interlayer insulating film above the transistor in the second region and above the third region of the semiconductor substrate; and
a first insulator layer provided above the first interlayer insulating film, the first insulator layer being a single layer, being composed of a material different from a material of the first interlayer insulating film, and containing silicon and nitrogen, the first insulator layer including:
a first portion that is above the first conductor layer and extends along a surface direction of the semiconductor substrate, and
a second portion that is continuous with the first portion and extends along a thickness direction of the semiconductor substrate from the first portion toward a surface of the semiconductor substrate in the third region, wherein the second portion is in contact with the semiconductor substrate.
2. The semiconductor memory device according to claim 1 , wherein the first insulator layer is a silicon nitride film.
3. The semiconductor memory device according to claim 1 , wherein a thickness of the first insulator layer is uniform between the first portion and the second portion.
4. The semiconductor memory device according to claim 1 , further comprising:
a second insulator layer including a first portion between the first conductor layer and the first portion of the first insulator layer and a second portion along a side wall of the first conductor layer.
5. The semiconductor memory device according to claim 4 , wherein each of the first insulator layer and the second insulator layer is a silicon nitride film.
6. The semiconductor memory device according to claim 1 , further comprising:
a contact that extends through the first insulator layer and the first interlayer insulating film along the thickness direction of the semiconductor substrate and is in contact with the first conductor layer and the first interlayer insulating film.
7. The semiconductor memory device according to claim 1 , wherein the second portion of the first insulator layer surrounds the first region of the semiconductor substrate.
8. The semiconductor memory device according to claim 1 , further comprising:
a second conductor layer above the third region of the semiconductor substrate at a same layer level as the first conductor layer, wherein
the second portion of the first insulator layer extends through the second conductor layer along the thickness direction of the semiconductor substrate.
9. The semiconductor memory device according to claim 8 , wherein the second conductor layer serves as a gate electrode of a dummy transistor.
10. The semiconductor memory device according to claim 8 , wherein the first insulator layer further includes:
a third portion that is continuous with the first portion, extends along the thickness direction of the semiconductor substrate from the first portion toward the surface of the semiconductor substrate in the third region, wherein
the third portion is between the second portion and the first conductor layer.
11. The semiconductor memory device according to claim 10 , wherein the third portion of the first insulator layer extends through the second conductor layer along the thickness direction of the semiconductor substrate.
12. The semiconductor memory device according to claim 8 , further comprising:
a third insulator layer between the second portion of the first insulator layer and the second conductor layer, wherein
the third insulator is doped with impurities.
13. The semiconductor memory device according to claim 1 , wherein the first insulator layer further includes:
a third portion that is continuous with the first portion, extends along the thickness direction of the semiconductor substrate from the first portion toward the surface of the semiconductor substrate in the third region, wherein
the third portion is between the second portion and the first conductor layer.
14. The semiconductor memory device according to claim 1 , wherein the second portion of the first insulator layer contacts the surface of the semiconductor substrate in the third region.
15. The semiconductor memory device according to claim 1 , wherein the second portion of the first insulator layer extends into the semiconductor substrate in the third region.
16. The semiconductor memory device according to claim 1 , wherein the third region of the semiconductor substrate is a p-well region.
17. The semiconductor memory device according to claim 1 , wherein the third region of the semiconductor substrate is an n-well region.
18. The semiconductor memory device according to claim 1 , wherein a width of the second portion of the first insulator layer is greater than a width of the first conductor layer.
19. The semiconductor memory device according to claim 1 , further comprising:
a stack of conductor layers spaced from each other above the first region of the semiconductor substrate; and
a memory pillar extending through the stack of conductor layers.
20. A semiconductor memory device, comprising:
a semiconductor substrate including a first region on which memory cells are provided, a second region on which a control circuit of the memory cells is provided, and a third region separating the first region and the second region;
a first conductor layer above the second region of the semiconductor substrate, the first conductor layer being a gate electrode of a transistor included in the control circuit;
an oxide film in contact with the semiconductor substrate in the third region;
a first interlayer insulating film above the second region and the third region of the semiconductor substrate; and
a first insulator layer provided above the first interlayer insulating film, composed of a material different from a material of the first interlayer insulating film, and containing silicon and nitrogen, the first insulator layer including:
a first portion that is above the first conductor layer and extends along a surface direction of the semiconductor substrate, and
a second portion that is continuous with the first portion and extends along a thickness direction of the semiconductor substrate from the first portion toward a surface of the semiconductor substrate in the third region, wherein the second portion is in contact with the oxide film.