Semiconductor integrated circuit and withstand voltage test method
A voltage application region and a voltage applying pad form withstand voltage measuring wiring lines insulated from each other and different from each other by connecting a seal ring and a relay region through a via, and the withstand voltage measuring wiring lines different from each other are configured to apply a voltage between insulated seal rings provided on wiring layers adjacent to each other by applying a voltage between the voltage application region and the voltage applying pad.
1. A semiconductor integrated circuit comprising:
a chip formation region having a laminated structure in which a plurality of wiring layers are laminated;
a plurality of seal rings disposed to surround an outside of the chip formation region, having an identical laminated structure with the chip formation region, and formed of metal wiring;
a plurality of relay regions disposed at the outside of the chip formation region, having an identical laminated structure with the chip formation region, and formed of metal wiring;
a plurality of vias formed between the wiring layers adjacent to each other; and
a voltage application region and a voltage applying pad provided on a wiring layer which is positioned farthest from a substrate and on which the chip formation region and one of the seal rings are formed, among the plurality of wiring layers,
wherein the voltage application region and the voltage applying pad form withstand voltage measuring wiring lines insulated from each other and different from each other by connecting one of the seal rings and one of the relay regions through one of the vias, and
the withstand voltage measuring wiring lines different from each other are configured to apply a voltage between insulated seal rings provided on the wiring layers adjacent to each other by applying a voltage between the voltage application region and the voltage applying pad.
2. The semiconductor integrated circuit according to claim 1 , further comprising:
a second voltage applying pad,
wherein a thickness of an interlayer insulating film to which a voltage is applied through a withstand voltage measuring wiring line connected to the voltage applying pad and a withstand voltage measuring wiring line connected to the voltage application region, and which is formed between insulated seal rings provided on the wiring layers adjacent to each other, and a thickness of an interlayer insulating film to which a voltage is applied through a withstand voltage measuring wiring line connected to the second voltage applying pad and the withstand voltage measuring wiring line connected to the voltage application region, and which is formed between insulated seal rings provided on the wiring layers adjacent to each other are different from each other.
3. The semiconductor integrated circuit according to claim 1 ,
wherein a seal ring or a relay region formed on a specific wiring layer among the plurality of wiring layers has a protruding region protruding toward the chip formation region as compared with a seal ring or a relay region formed on another wiring layer.
4. A withstand voltage test method in the semiconductor integrated circuit of claim 1 , comprising:
applying a voltage between the voltage application region and the voltage applying pad, and then measuring a leak current flowing between the voltage application region and the voltage applying pad.
5. A withstand voltage test method in the semiconductor integrated circuit in claim 2 , comprising:
applying a voltage between the voltage application region and the voltage applying pad, and then measuring a leak current flowing between the voltage application region and the voltage applying pad; and
applying a voltage between the voltage application region and the second voltage applying pad, and then measuring a leak current flowing between the voltage application region and the second voltage applying pad.