Method of thin film deposition in trenches
Embodiments of the present disclosure generally relate to processing a workpiece containing a substrate during deposition, etching, and/or curing processes with a mask to have localized deposition on the workpiece. A mask is placed on a first layer of a workpiece, which protects a plurality of trenches from deposition of a second layer. In some embodiments, the mask is placed before deposition of the second layer. In other embodiments, the second layer is cured before the mask is deposited. In other embodiments, the second layer is etched after the mask is deposited. Methods disclosed herein allow the deposition of a second layer in some of the trenches present in the workpiece, while at least partially preventing deposition of the second layer in other trenches present in the workpiece.
1. A method for processing a workpiece, comprising:
depositing a second layer comprising an uncured composition directly on a first layer disposed on a substrate;
applying a mask directly on the second layer, wherein the mask covers a first portion of the second layer and leaves exposed a second portion of the second layer, wherein a first portion of the first layer is disposed below the first portion of the second layer and a second portion of the first layer is disposed below the second portion of the second layer, and wherein the first portion of the first layer comprises a first plurality of trenches;
exposing the mask and the second portion of the second layer to a curing process, wherein the mask shields the first portion of the second layer from the curing process while the second portion of the second layer is at least partially cured during the curing process, and wherein subsequent to the curing process, the first portion of the second layer comprises the uncured composition and the second portion of the second layer comprises a cured composition formed from the uncured composition; and
removing the mask and the first portion of the second layer comprising the uncured composition.
2. The method of claim 1 , wherein the at least one of the first plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
3. The method of claim 1 , wherein the second portion of the first layer comprises a second plurality of trenches, and at least one of the second plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
4. The method of claim 3 , wherein the first portion of the first layer comprises a first plurality of trenches, and at least one of the first plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
5. The method of claim 1 , wherein the mask and the first portion of the second layer are removed during the same process.
6. The method of claim 1 , wherein the first portion of the second layer is removed by an etching process.
7. The method of claim 1 , wherein the curing process is selected from a group consisting of a thermal curing process, an ultraviolet curing process, a plasma-assisted treatment process, an ion beam treatment process, an e-beam treatment, a baking treatment, and any combination thereof.
8. A method for processing a workpiece, comprising:
depositing a second layer comprising an uncured composition directly on a first layer disposed on a substrate, wherein a first portion of the first layer comprises a first plurality of trenches;
applying a mask directly on the second layer, wherein the mask covers a first portion of the second layer and leaves exposed a second portion of the second layer;
exposing the mask and the second portion of the second layer to a curing process, wherein the mask shields the first portion of the second layer from the curing process while the second portion of the second layer is at least partially cured during the curing process, and wherein subsequent to the curing process, the first portion of the second layer comprises the uncured composition and the second portion of the second layer comprises a cured composition formed from the uncured composition; and
removing the mask and the first portion of the second layer comprising the uncured composition during the same process.
9. The method of claim 8 , wherein the first portion of the first layer is disposed below the first portion of the second layer and a second portion of the first layer is disposed below the second portion of the second layer, and wherein the first portion of the first layer comprises a first plurality of trenches, and at least one of the first plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
10. The method of claim 8 , wherein the first portion of the first layer is disposed below the first portion of the second layer and a second portion of the first layer is disposed below the second portion of the second layer, and wherein the second portion of the first layer comprises a second plurality of trenches, and at least one of the second plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
11. The method of claim 10 , wherein the first portion of the first layer comprises a first plurality of trenches, and at least one of the first plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
12. The method of claim 8 , wherein the first portion of the second layer is removed by an etching process.
13. The method of claim 8 , wherein the curing process is selected from a group consisting of a thermal curing process, a plasma-assisted treatment process, an ion beam treatment process, an e-beam treatment, a baking treatment, and any combination thereof.
14. A method for processing a workpiece, comprising:
depositing a second layer comprising an uncured composition directly on a first layer disposed on a substrate, wherein a first portion of the first layer comprises a first plurality of trenches;
applying a mask directly on the second layer, wherein the mask covers a first portion of the second layer and leaves exposed a second portion of the second layer;
exposing the mask and the second portion of the second layer to a curing process, wherein the mask shields the first portion of the second layer from the curing process while the second portion of the second layer is at least partially cured during the curing process, and wherein subsequent to the curing process, the first portion of the second layer comprises the uncured composition and the second portion of the second layer comprises a cured composition formed from the uncured composition; and
removing the mask and the first portion of the second layer comprising the uncured composition, wherein the first portion of the second layer is removed by an etching process.
15. The method of claim 14 , wherein the first portion of the first layer is disposed below the first portion of the second layer and a second portion of the first layer is disposed below the second portion of the second layer, and wherein the first portion of the first layer comprises a first plurality of trenches, and at least one of the first plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
16. The method of claim 14 , wherein the first portion of the first layer is disposed below the first portion of the second layer and a second portion of the first layer is disposed below the second portion of the second layer, and wherein the second portion of the first layer comprises a second plurality of trenches, and at least one of the second plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
17. The method of claim 16 , wherein the first portion of the first layer comprises a first plurality of trenches, and at least one of the first plurality of trenches makes an angle of about 15° to about 75° with respect to a surface of the first layer.
18. The method of claim 14 , wherein the mask and the first portion of the second layer are removed during the same process.
19. The method of claim 14 , wherein the curing process is selected from a group consisting of a thermal curing process, a plasma-assisted treatment process, an ion beam treatment process, an e-beam treatment, a baking treatment, and any combination thereof.