IP Library Granted Patent US 11,018,321
Granted Patent B2
US 11,018,321 · App. 16/795,508 · Granted May 25, 2021

Sealing structure and light emitting device

Inventor: Shinichi Tanisako (Tokyo, JP)
Assignee: PIONEER CORPORATION
H01L51/5256H01L23/29H01L23/31H01L33/52H05B33/04H01L33/56
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Quick Facts
Patent No.
US 11,018,321
App. No.
16/795,508
Granted
May 25, 2021
Kind
B2
Abstract

A sealing structure ( 200 ) seals a light emitting unit ( 140 ) and includes a first inorganic film ( 210 ), a second inorganic film ( 220 ), a first resin-containing film ( 230 ), and a second resin-containing film ( 240 ). The film thickness of the first inorganic film ( 210 ) is equal to or greater than 1 nm and equal to or less than 300 nm. The first resin-containing film ( 230 ) is in contact with the first inorganic film ( 210 ) and includes a first resin. The second inorganic film ( 220 ) is positioned on an opposite side of the first inorganic film ( 210 ) with the first resin-containing film ( 230 ) interposed between the first and second inorganic films. The second resin-containing film ( 240 ) is positioned between the first resin-containing film ( 230 ) and the second inorganic film ( 220 ) and is in contact with the second inorganic film ( 220 ). The second resin-containing film ( 240 ) includes a second resin.

Claims (28)

1. A sealing structure that seals an object to be sealed, the structure comprising:

a first inorganic film;

a first resin-containing film which is in contact with the first inorganic film and comprises a first resin;

a second inorganic film which is positioned on a side opposite to the first inorganic film with the first resin-containing film interposed between the first and second inorganic films;

a second resin-containing film which is positioned between the first resin-containing film and the second inorganic film, is in contact with the first resin-containing film and the second inorganic film, and comprises a second resin; and

wherein the first inorganic film has a recessed portion or a hole positioned on a surface side of the first inorganic film opposite to the object to be sealed, and

a portion of the first resin-containing film is positioned in the recessed portion or the hole.

2. The sealing structure according to claim 1 ,

wherein the first resin-containing film is thicker than the first inorganic film.

3. The sealing structure according to claim 1 ,

wherein the second inorganic film is formed by using a material that is the same as a material of the first inorganic film.

4. The sealing structure according to claim 1 ,

wherein the first inorganic film is positioned to be closer to the object to be sealed than the second inorganic film in a thickness direction.

5. The sealing structure according to claim 1 ,

wherein at least a portion of the first inorganic film overlaps neither the first resin-containing film nor the second resin-containing film, and

at least a portion of the second inorganic film overlaps neither the first resin-containing film nor the second resin-containing film and is in contact with the first inorganic film.

6. The sealing structure according to claim 1 ,

wherein at least a portion of the first resin-containing film does not overlap the second resin-containing film and is in contact with the second inorganic film.

7. The sealing structure according to claim 1 ,

wherein an end of the first resin-containing film overlaps an end of the second resin-containing film.

8. The sealing structure according to claim 1 ,

wherein a Young's modulus of the second resin is lower than a Young's modulus of the first resin.

9. The sealing structure according to claim 1 ,

wherein a glass transition point of the second resin is higher than a glass transition point of the first resin.

10. A light emitting device comprising:

a light emitting unit comprising an organic layer; and

a sealing structure that seals the light emitting unit,

wherein the sealing structure is the sealing structure according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 21, 2021
From: TANISAKO, SHINICHI
To: PIONEER CORPORATION
Reel/Frame 055993/0927 →
Priority Claims (1)
JP JP2016-043754 · Mar 7, 2016 · national
Continuity (2)
Continuation 16083463
Related Publication 20200185649A1 · Jun 11, 2020