Optical module having multiple laser diode devices and a support member
A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.
1. An optical module apparatus comprising:
a plurality of ceramic support members;
a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips, each of the plurality of laser diode chips having a single laser diode configured to emit a laser beam; wherein at least one of the plurality of laser diode chips comprises a gallium and nitrogen containing laser diode device configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, or green emission with a wavelength ranging from 500 nm to 560 nm;
one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine or collimate the laser beams to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration; and
a power source electrically coupled to the plurality of laser diode chips; wherein:
the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink;
the one or more optical devices comprise free-space optics configured to create one or more free space optical beams;
a thermal path from each of the plurality of laser diode chips to the heat sink is characterized by a thermal impedance; and
the optical module apparatus is characterized by an optical output power of at least 5 W.
2. The apparatus of claim 1 , wherein at least one of the plurality of laser diode chips comprises an AlInGaP laser diode device configured to emit a laser beam characterized by red emission with a wavelength ranging from 625 nm to 665 nm; or wherein at least one of the plurality of laser diode chips comprises a GaAs or AlGaAsP laser diode device configured to emit a laser beam characterized by an infrared emission, or a combination thereof.
3. The apparatus of claim 1 , further comprising an electrical input interface configured to couple electrical input power to the plurality of laser diode chips; and wherein the electrical input interface is configured to couple radio frequency electrical inputs to the laser diode chips or wherein the electrical input interface is configured to couple logic signals to the laser diode chips.
4. The apparatus of claim 1 , wherein the plurality of laser diode chips are operable in an environment comprising at least 150,000 ppm oxygen gas; wherein each of the plurality of laser diode chips is substantially free from efficiency degradation over a time period from the oxygen gas.
5. The apparatus of claim 1 , further comprising a combiner configured to provide the output beam characterized by a selected spatial pattern having a maximum width and a minimum width.
6. The apparatus of claim 1 , further comprising a plurality of submount members characterized by a coefficient of thermal expansion (CTE) each coupled to one of the plurality of ceramic support members and the heat sink, wherein the plurality of submount members couple the plurality of laser diode chips to the plurality of ceramic support members.
7. The apparatus of claim 6 , wherein each of the plurality of submount members comprises a material selected from aluminum nitride, silicon carbide, BeO, diamond, composite diamond, and a combination of any of the foregoing.
8. The apparatus of claim 1 , further comprising a submount attached to the plurality of ceramic support members, the submount being characterized by a thermal conductivity of at least 200 W/(mk); and wherein each of the plurality of laser diode chips are thermally coupled directly to one of the plurality of ceramic support members.
9. The apparatus of claim 1 , wherein the one or more optical devices comprise an optical fiber, wherein the output beam is coupled into the optical fiber.
10. The apparatus of claim 1 , wherein the plurality of laser diode chips include N laser diode chips and N ranges from 3 to 50.
11. The apparatus of claim 1 , wherein the output beam is characterized by an optical power of 5 W and greater, 10 W and greater, 50 W and greater, 100 W and greater, or 200 W and greater.
12. An optical module apparatus comprising:
a plurality of ceramic support members;
a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips; each of the plurality of laser diode chips having a single laser diode configured to emit a laser beam; wherein at least one of the laser diode chips comprises gallium and nitrogen and is configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, green emission with a wavelength ranging from 500 nm to 560 nm, and a combination thereof;
one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine and/or collimate the laser beams;
the laser beams characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
wherein the one or more optical devices comprise free-space optics configured to create one or more free space optical beams;
an optical fiber configured to receive the laser beams from the plurality of laser diode chips by optical coupling; and to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration; wherein:
the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink; and
the output beam is characterized by an optical output power of at least 5 W.
13. The apparatus of claim 12 , wherein the free space optics provide optical coupling of the laser beams to the optical fiber and are selected from one or more of a fast axis collimating (FAC) lens or a slow axis collimating (SAC) lens.
14. The apparatus of claim 12 , wherein the optical fiber is spaced from the plurality of laser diode chips by between about 0.2 mm to about 10 mm.
15. The apparatus of claim 12 , wherein the output beam is characterized by an optical power of 5 W and greater, 10 W and greater, 50 W and greater, 100 W and greater, or 200 W and greater.
16. The apparatus of claim 12 , wherein the optical fiber has a dimension of between about 100 μm to about 800 μm.
17. The apparatus of claim 12 , wherein at least one of the laser diode chips comprises an AlInGaP laser diode device configured to emit a laser beam characterized by red emission with a wavelength ranging from 625 nm to 665 nm; or wherein at least one of the laser diode chips comprises a GaAs or AlGaAsP laser diode device configured to emit a laser beam characterized by an infrared emission, or a combination thereof.
18. A system comprising:
an optical module apparatus;
a package configured to enclose the optical module apparatus; and
an application configured with the optical module apparatus, the optical module apparatus comprising:
a plurality of ceramic support members;
a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips; each of the plurality of laser diode chips having a single laser diode configured to emit a laser beam; wherein at least one of the laser diode chips comprises a gallium and nitrogen containing laser diode device configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, or green emission with a wavelength ranging from 500 nm to 560 nm;
one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine or collimate the laser beams to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration; and
a power source electrically coupled to the plurality of laser diode chips; wherein:
the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink;
the one or more optical devices comprise free-space optics configured to create one or more free space optical beams;
a thermal path from each of the plurality of laser diode chips to the heat sink is characterized by a thermal impedance; and
the optical module apparatus is characterized by an optical output power of 5 W or greater.
19. A system comprising:
an optical module apparatus;
a package configured to enclose the optical module apparatus; and
an application configured with the optical module apparatus, the optical module apparatus comprising:
a plurality of ceramic support members;
a plurality of laser diodes each coupled to one of the plurality of ceramic support members to form a plurality of laser diode chips; each of the plurality of laser diode chips having a single laser diode; each of the plurality of laser diode chips overlying one of the plurality of ceramic support members, each of the laser diode chips configured to emit a laser beam; wherein at least one of the laser diode chips comprises gallium and nitrogen and is configured to emit a laser beam characterized by emission selected from violet emission with a wavelength ranging from 395 nm to 425 nm, blue emission with a wavelength ranging from 415 nm to 485 nm, green emission with a wavelength ranging from 500 nm to 560 nm, and a combination thereof;
one or more optical devices configured to receive laser beams from the plurality of laser diode chips, and to combine and/or collimate the laser beams;
the laser beams characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration;
wherein the one or more optical devices comprise free-space optics configured to create one or more free space optical beams;
an optical fiber configured to receive the laser beams from the plurality of laser diode chips by optical coupling; and to provide an output beam characterized by a selected wavelength range, a selected spectral width, a selected power, and a selected spatial configuration; wherein:
the plurality of ceramic support members are configured to transport thermal energy from the plurality of laser diode chips to a heat sink; and
the output beam is characterized by an optical output power of at least 5 W.