IP Library › Granted Patent US 11,024,360
Granted Patent B2
US 11,024,360 · App. 16/799,402 · Granted Jun 1, 2021

Nonvolatile semiconductor memory device

Inventors: Toshifumi Watanabe (Yokohama Kanagawa, JP); Naofumi Abiko (Kawasaki Kanagawa, JP)
Assignee: KIOXIA CORPORATION
G11C11/4074G11C11/4076G11C11/4085G11C11/4094G11C11/5628G11C11/5642G06F3/0688G06F11/1072G11C5/147G11C7/12G11C8/08G11C16/0483
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Quick Facts
Patent No.
US 11,024,360
App. No.
16/799,402
Granted
Jun 1, 2021
Kind
B2
Abstract

A semiconductor memory device includes a memory cell, a word line connected to the memory cell, a source line connected to the memory cell, a bit line connected to the memory cell, and a control circuit configured to perform a read operation on the memory cell. During the read operation, the control circuit applies to the word line a first voltage, a second voltage greater than the first voltage after applying the first voltage, and a third voltage greater than the first voltage and smaller than the second voltage after applying the second voltage, and applies to the source line a fourth voltage according to a timing at which the second voltage is applied to the word line, a fifth voltage smaller than the fourth voltage after applying the fourth voltage, and a sixth voltage greater than the fifth voltage after applying the fifth voltage.

Claims (35)

1. A semiconductor memory device comprising:

a memory cell;

a word line connected to the memory cell;

a source line connected to the memory cell;

a bit line connected to the memory cell; and

a control circuit configured to perform a read operation on the memory cell by:

applying to the word line a first voltage, a second voltage greater than the first voltage after applying the first voltage, and a third voltage greater than the first voltage and smaller than the second voltage after applying the second voltage, and

applying to the source line a fourth voltage according to a timing at which the second voltage is applied to the word line, a fifth voltage smaller than the fourth voltage after applying the fourth voltage, and a sixth voltage greater than the fifth voltage after applying the fifth voltage and while applying the third voltage to the word line.

2. The semiconductor memory device according to claim 1 , wherein the source line is connected to a node having a voltage set according to a reference voltage and the reference voltage is decreased at the timing at which the fifth voltage is applied to the source line and increased at the timing at which the sixth voltage is applied to the source line.

3. The semiconductor memory device according to claim 2 , wherein the reference voltage is maintained constant between the timing at which the fifth voltage is applied to the source line and the timing at which the sixth voltage is applied to the source line.

4. The semiconductor memory device according to claim 2 , wherein the reference voltage is varied between the timing at which the fourth voltage is applied to the source line and the timing at which the fifth voltage is applied to the source line.

5. The semiconductor memory device according to claim 4 , wherein the reference voltage is decreased between the timing at which the fourth voltage is applied to the source line and the timing at which the fifth voltage is applied to the source line.

6. The semiconductor memory device according to claim 1 , wherein the control circuit is configured to

control a first control signal for controlling a voltage to be applied to the bit line, to change from a low level to a high level according to the timing at which the second voltage is applied to the word line.

7. The semiconductor memory device according to claim 6 , wherein

the fifth voltage is applied as the first control signal changes from the low level to the high level.

8. The semiconductor memory device according to claim 1 , wherein the control circuit is configured to

control a first control signal for controlling a voltage to be applied to the bit line, to change from a low level to a high level according to the timing at which the second voltage is applied to the word line, and then to an intermediate level between the low level and the high level.

9. The semiconductor memory device according to claim 8 , wherein

the fifth voltage is applied to the source line while the first control signal is at the high level and the sixth voltage is applied to the source line at a timing at which the first control signal is controlled to change to the intermediate level.

10. A method of performing a read operation in a semiconductor memory device that includes a memory cell, a word line connected to the memory cell, a source line connected to the memory cell, and a bit line connected to the memory cell, said method comprising:

applying to the word line a first voltage, a second voltage greater than the first voltage after applying the first voltage, and a third voltage greater than the first voltage and smaller than the second voltage after applying the second voltage; and

applying to the source line a fourth voltage according to a timing at which the second voltage is applied to the word line, a fifth voltage smaller than the fourth voltage after applying the fourth voltage, and a sixth voltage greater than the fifth voltage after applying the fifth voltage and while applying the third voltage to the word line.

11. The method according to claim 10 , wherein the source line is connected to a node having a voltage set according to a reference voltage and the reference voltage is decreased at the timing at which the fifth voltage is applied to the source line and increased at the timing at which the sixth voltage is applied to the source line.

12. The method according to claim 11 , wherein the reference voltage is maintained constant between the timing at which the fifth voltage is applied to the source line and the timing at which the sixth voltage is applied to the source line.

13. The method according to claim 11 , wherein the reference voltage is varied between the timing at which the fourth voltage is applied to the source line and the timing at which the fifth voltage is applied to the source line.

14. The method according to claim 13 , wherein the reference voltage is decreased between the timing at which the fourth voltage is applied to the source line and the timing at which the fifth voltage is applied to the source line.

15. The method according to claim 10 , further comprising:

changing a first control signal for controlling a voltage to be applied to the bit line, to go from a low level to a high level according to the timing at which the second voltage is applied to the word line.

16. The method according to claim 15 , wherein

the fifth voltage is applied as the first control signal changes from the low level to the high level.

17. The method according to claim 10 , further comprising:

changing a first control signal for controlling a voltage to be applied to the bit line, to go from a low level to a high level according to the timing at which the second voltage is applied to the word line, and then to an intermediate level between the low level and the high level.

18. The method according to claim 17 , wherein

the fifth voltage is applied to the source line while the first control signal is at the high level and the sixth voltage is applied to the source line at a timing at which the first control signal is controlled to go to the intermediate level.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2020
From: WATANABE, TOSHIFUMI; ABIKO, NAOFUMI
To: KIOXIA CORPORATION
Reel/Frame 051909/0628 →
Priority Claims (1)
JP JP2019-156008 · Aug 28, 2019 · national
Continuity (1)
Related Publication 20210065770A1 · Mar 4, 2021