SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER, AND DISPLAY MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS COMPRISING SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER
According to one embodiment, a semiconductor manufacturing apparatus member includes a base and a particle-resistant layer. The base includes a main portion and an alumite layer. The main portion includes aluminum. The alumite layer is provided at a front surface of the main portion. The particle-resistant layer is provided on the alumite layer and includes a polycrystalline ceramic. A Young's modulus of the alumite layer is greater than 90 GPa.
1 . A semiconductor manufacturing apparatus member, comprising:
a base including a main portion which includes aluminum and an alumite layer provided at a front surface of the main portion; and
a particle-resistant layer provided on the alumite layer and which includes a polycrystalline ceramic,
wherein a Young's modulus of the alumite layer is greater than 90 GPa.
2 . The semiconductor manufacturing apparatus member according to claim 1 , wherein the Young's modulus of the alumite layer is at least 100 GPa.
3 . The semiconductor manufacturing apparatus member according to claim 1 , wherein the Young's modulus of the alumite layer is 150 GPa or less.
4 . The semiconductor manufacturing apparatus member according to claim 1 , wherein the particle-resistant layer includes at least one type selected from the group consisting of an oxide of a rare-earth element, a fluoride of a rare-earth element, and an acid fluoride of a rare-earth element.
5 . The semiconductor manufacturing apparatus member according to claim 4 , wherein the particle-resistant layer includes an oxide of a rare-earth element and the rare-earth element is at least one selected from the group consisting of Y, Sc, Yb, Ce, Pr, Eu, La, Nd, Pm, Sm, Gd, Tb, Dy, Ho, Er, Tm, and Lu.
6 . The semiconductor manufacturing apparatus member according to claim 1 , wherein an average crystallite size of the polycrystalline ceramic is at least 3 nm and 50 nm or less.
7 . The semiconductor manufacturing apparatus member according to claim 6 , wherein the average crystallite size is at least 3 nm and 30 nm or less.
8 . The semiconductor manufacturing apparatus member according to claim 1 , wherein the particle-resistant layer has an arithmetic average height Sa of 0.060 or less after a reference plasma resistance test is performed in which the semiconductor manufacturing apparatus member is exposed to a plasma.
9 . A semiconductor manufacturing apparatus, comprising the semiconductor manufacturing apparatus member according to claim 1 .
10 . A display manufacturing apparatus, comprising the semiconductor manufacturing apparatus member according to claim 1 .