Semiconductor device and methods of manufacturing semiconductor devices

1. A semiconductor device, comprising:

a semiconductor component comprising:

a component face side;

a component base side;

a component lateral side connecting the component face side to the component base side;

a component port adjacent to the component face side and comprising:

a first component terminal on the component face side; and

a first component interconnect coupled to the first component terminal; and

a second component terminal on the component base side;

a clip structure coupled to the component face side with a first interface material; and

an encapsulant covering portions of the semiconductor component and the clip structure;

wherein:

the first component interconnect comprises a component port face;

the encapsulant comprises a first encapsulant face and a second encapsulant face opposite to the first encapsulant face;

the clip structure comprises a first clip face and a second clip face; and

the component port face and the first clip face are exposed from the first encapsulant face; and

the second clip face is electrically coupled to the second component terminal at the second encapsulant face.

2. The semiconductor device of claim 1 , wherein:

the first interface material is electrically insulating; and

the first encapsulant face, the first clip face, and the component port face are substantially co-planar.

3. The semiconductor device of claim 1 , wherein:

the clip structure comprises:

a first clip pad having the first clip face;

a second clip pad having the second clip face; and

a first clip leg connecting the first clip pad and the second clip pad together.

4. The semiconductor device of claim 1 wherein:

the second clip face is coupled to the second component terminal with a conductive plate that overlaps the second clip face and the second component terminal.

5. The semiconductor device of claim 4 , wherein:

the second clip face and the second component terminal are coupled to the conductive plate with a second interface material;

the second interface material is electrically conductive;

the second interface material is exposed from the second encapsulant face; and

outer surfaces of the second interface material are coplanar with the second encapsulant face.

6. The semiconductor device of claim 1 , wherein:

the clip structure comprises:

a first clip pad coupled to the semiconductor component and having the first clip face;

a second clip pad having the second clip face;

a first clip leg connecting the first clip pad and the second clip pad together;

a third clip pad coupled to the semiconductor component;

a fourth clip pad; and

a second clip leg connecting the third clip pad and the fourth clip pad together.

7. The semiconductor device of claim 6 , wherein:

the first clip pad is coupled to the component face side at a first peripheral edge of the semiconductor component;

the third clip pad is coupled to the component face side at a second peripheral edge of the semiconductor component; and

the encapsulant completely covers outer ends of the second clip face and the fourth clip face.

8. The semiconductor device of claim 1 , further comprising:

a dielectric layer over the first encapsulant face and having apertures, wherein portions of the first clip face and the component port face are exposed within the apertures; and

external interconnects coupled to the first clip face and the component port face through the apertures.

9. The device of claim 1 , wherein:

the second component terminal is a drain terminal.

10. A semiconductor device, comprising:

a semiconductor component comprising:

a component face side;

a component base side;

a component lateral side connecting the component face side to the component base side;

a component port adjacent to the component face side, wherein the comprises a component port face; and

a first component terminal on the component base side;

a clip structure comprising:

a first clip pad having a first clip face;

a second clip pad having a second clip face; and

a first clip leg connecting the first clip pad to the second clip pad;

and

an encapsulant covering portions of the semiconductor component and the clip structure;

wherein:

the encapsulant comprises a first encapsulant face and a second encapsulant face opposite to the first encapsulant face;

the first clip pad is coupled to the component face side with a first interface material;

the first interface material is electrically insulating; and

the component port face and the first clip face are exposed from the first encapsulant face.

11. The semiconductor device of claim 10 , wherein:

the component port comprises a second component terminal and a component interconnect;

the component interconnect comprises the component port face;

the component port face and the first clip face are substantially co-planar; and

the first component terminal is one of a drain terminal or a source terminal.

12. The semiconductor device of claim 10 , wherein:

the second clip face is electrically connected to first component terminal at the second encapsulant face.

13. The semiconductor device of claim 10 , wherein:

the second clip pad has an outer end proximate to a side of the encapsulant; and

the outer end is completely covered by the encapsulant.

14. A method of forming a semiconductor device, comprising:

providing a semiconductor component comprising:

a component face side;

a component base side;

a component lateral side connecting the component face side to the component base side;

a component port adjacent to the component face side and comprising a first component terminal on the component face side; and a first component interconnect coupled to the first component terminal, wherein the first component interconnect comprises a component port face; and

a second component terminal on the component base side;

providing a clip structure having a first clip face and a second clip face;

coupling the clip structure to the component face side with a first interface material;

providing an encapsulant covering portions of the semiconductor component and the clip structure;

wherein:

the first interface material is electrically insulating;

the second clip face has an outer end proximate to a side of the encapsulant;

the encapsulant comprises a first encapsulant face and a second encapsulant face opposite to the first encapsulant face; and

the component port face and the first clip face are exposed from the first encapsulant face; and

electrically coupling the second clip face to the second component terminal at the second encapsulant face.

15. The method of claim 14 , further comprising:

providing a dielectric over the first encapsulant face; and

providing apertures in the dielectric that expose portions of the first clip face and the component port face; and

providing external interconnects coupled to the first clip face and the component port face through the apertures.

16. The method of claim 12 , wherein:

the covering includes completely covering the outer end of the second clip face.