Wafer placement apparatus
A wafer placement apparatus includes a ceramic plate having a top surface including a wafer placement surface, the ceramic plate allowing at least one of an electrostatic electrode and a heater electrode to be embedded therein; and a cooling plate disposed on an undersurface of the ceramic plate opposite to the wafer placement surface to cool the ceramic plate, wherein the cooling plate includes a coolant channel, and the coolant channel has a multi-layer structure at least partially including two or more layers stacked vertically, the two or more layers being spaced different distances apart from the wafer placement surface.
1. A wafer placement apparatus, comprising:
a ceramic plate having a top surface including a wafer placement surface, the ceramic plate allowing at least one of an electrostatic electrode and a heater electrode to be embedded therein; and
a cooling plate disposed on an undersurface of the ceramic plate opposite to the wafer placement surface to cool the ceramic plate,
wherein the cooling plate includes a coolant channel, and the coolant channel has a multi-layer structure at least partially including a first layer and a second layer stacked vertically, the first layer and the second layer being spaced different distances apart from the wafer placement surface, and
wherein, in the coolant channel, one portion of the first layer is located closer to the ceramic plate on a first side of a border of a plurality of zones into which the cooling plate is divided and another portion of the first layer is located further from the ceramic plate on a second side of the border, the portions of the first layer are continuous with each other and are connected with a first communication portion, wherein one portion of the second layer is located further from the ceramic plate on the first side of the border and another portion of the second layer is located closer to the ceramic plate on the second side of the border, the portions of the second layer are continuous with each other and are connected with a second communication portion, and wherein the first layer and the second layer are vertically switched with each other at the border.
2. The wafer placement apparatus according to claim 1 ,
wherein, in the coolant channel, an outlet port of the second layer located further from the ceramic plate on the first side of the border is disposed near an inlet port of the first layer located closer to the ceramic plate on the first side of the border, and an inlet port of the second layer located closer to the ceramic plate on the second side of the border is disposed near an outlet port of the first layer located further from the ceramic plate on the second side of the border when the cooling plate is viewed in a plan.
3. The wafer placement apparatus according to claim 1 , wherein the cooling plate has no heater.