Semiconductor device including trench structure and manufacturing method
An embodiment of a semiconductor device includes a silicon carbide semiconductor body including source and body regions of opposite conductivity types. A trench structure extends from a first surface into the silicon carbide semiconductor body along a vertical direction, and includes a gate electrode and a gate dielectric. A contact is electrically connected to the source region at the first surface. The source region includes a first source sub-region directly adjoining the contact at a source contact area of the first surface, a second source sub-region, and a third source sub-region. The second sub-region is arranged between the first and third sub-regions along the vertical direction. A doping concentration profile along the vertical direction of the source region includes a doping concentration minimum in the second sub-region and a doping concentration maximum in the third sub-region. Each of the second and third sub-regions overlaps with the source contact area.
1. A semiconductor device, comprising:
a silicon carbide semiconductor body comprising a source region of a first conductivity type and a body region of a second conductivity type;
a trench structure extending from a first surface of the silicon carbide semiconductor body into the silicon carbide semiconductor body along a vertical direction, the trench structure comprising a gate electrode and a gate dielectric; and
a contact electrically connected to the source region at the first surface,
wherein the source region comprises a first source sub-region directly adjoining the contact at a source contact area of the first surface, a second source sub-region, and a third source sub-region, the second source sub-region being arranged between the first source sub-region and the third source sub-region along the vertical direction,
wherein a doping concentration profile along the vertical direction of the source region includes a doping concentration minimum in the second source sub-region and a doping concentration maximum in the third source sub-region,
wherein each of the second source sub-region and the third source sub-region overlaps with the source contact area.
2. The semiconductor device of claim 1 , wherein the gate electrode is directly opposed to each of the first source sub-region, the second source sub-region and the third source sub-region.
3. The semiconductor device of claim 1 , wherein the doping concentration profile along the vertical direction of the source region includes a doping concentration valley in the second source sub-region and a doping concentration peak in the third source sub-region.
4. The semiconductor device of claim 1 , wherein a lateral extent of the second source sub-region is defined between an interface to a sidewall of the trench structure and a pn junction to the body region, and wherein a doping concentration profile of the second source sub-region is constant along at least 80% of the lateral extent.
5. The semiconductor device of claim 1 , wherein the doping concentration minimum in the second source sub-region is in a range of at least 0.01% to at most 50% of the doping concentration maximum in the third source sub-region.
6. The semiconductor device of claim 1 , wherein a vertical extent of the second source sub-region is in a range of at least 30 nm to at most 300 nm.
7. The semiconductor device of claim 1 , wherein at least a part of the second source sub-region comprises dopants of the second conductivity type, and wherein the dopants of the second conductivity type partially compensate dopants of the first conductivity type in a range of at least 10% to at most 99.9%.
8. The semiconductor device of claim 1 , further comprising lattice defects in the second source sub-region, wherein the lattice defects reduce mobility of free charge carriers in the second source sub-region.
9. The semiconductor device of claim 1 , further comprising lattice defects in the second source sub-region, wherein the lattice defects reduce an effective n-type doping level in the second source sub-region.
10. A method of manufacturing a semiconductor device, the method comprising:
forming a source region of a first conductivity type and a body region of a second conductivity type in a silicon carbide semiconductor body;
forming a trench structure extending from a first surface of the silicon carbide semiconductor body into the silicon carbide semiconductor body along a vertical direction, the trench structure comprising a gate electrode and a gate dielectric; and
forming a contact electrically connected to the source region at the first surface,
wherein the source region comprises a first source sub-region directly adjoining the contact at a source contact area of the first surface, a second source sub-region, and a third source sub-region,
wherein the second source sub-region is arranged between the first source sub-region and the third source sub-region along the vertical direction,
wherein a doping concentration profile along the vertical direction of the source region includes a doping concentration minimum in the second source sub-region and a doping concentration maximum in the third source sub-region,
wherein each of the second source sub-region and the third source sub-region overlaps with the source contact area.
11. The method of claim 10 , wherein the first source sub-region, the second source sub-region and the third source sub-region are formed by ion implantation processes using a same ion implantation mask.