Arrangement for dissipating heat of a power supply unit in a housing
The present disclosure envisages an arrangement ( 100 ) for dissipating heat of a power supply unit ( 105 ) in a housing ( 110 ). The arrangement ( 100 ) comprises at least one packing member ( 120 ). The packing member ( 120 ) is disposed between the power supply unit ( 105 ) and an operative inner wall of the housing ( 110 ) to increase conductive thermal contact between inner walls of the housing ( 110 ) and the power supply unit ( 105 ). The arrangement ( 100 ) facilitates maximum surface contact between a power supply unit and inner walls of a housing.
1. An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an inner wall of said housing, said arrangement configured to increase conductive thermal contact between the inner walls of said housing and said power supply unit;
wherein said packing member is a wedge;
wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member; and
wherein said arrangement comprises a third tapered inner wall configured in said housing, said third tapered inner wall is orthogonal to said first tapered inner wall and said second inner wall, and said arrangement is configured to increase conductive thermal contact between said power supply unit and said first, second and third tapered walls.
2. The arrangement as claimed in claim 1 , wherein said packing member is thermally conductive.
3. The arrangement as claimed in claim 1 , wherein said packing member is a slab of constant cross-section.
4. The arrangement as claimed in claim 1 , wherein said arrangement includes at least one cavity configured on said wedge.
5. The arrangement as claimed in claim 1 , wherein the tapered angle of said wedge ranges from 1° to 10°.
6. An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an operative inner wall of said housing, said arrangement configured to increase conductive thermal contact between at least some of the inner walls of said housing and said power supply unit;
wherein said packing member is a wedge; and
wherein said wedge has chamfered edges.
7. The arrangement as claimed in claim 1 , wherein said wedge comprises screw lugs provided on opposite sides thereof to fasten said wedge to said housing.
8. An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an inner wall of said housing, said arrangement configured to increase conductive thermal contact between at least some of the inner walls of said housing and said power supply unit;
wherein said packing member is a wedge;
wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member; and
wherein a tapered angle of said first tapered inner wall is equal to a tapered angle of said wedge.
9. The arrangement as claimed in claim 1 , wherein said arrangement includes a pair of guiding channels configured on the inner wall of said housing to guide said power supply unit in said housing.
10. The arrangement as claimed in claim 1 , wherein said arrangement includes a plurality of fins configured on an outer surface of said housing.
11. A method of dissipating heat of a power supply unit in a housing, said method comprising the step of inserting a packing member between an inner wall of said housing and said power supply unit to increase conductive thermal contact between the inner wall of said housing and said power supply unit;
wherein said packing member is a wedge;
wherein said arrangement comprises a first tapered inner wall and a second tapered inner wall configured in said housing, said first tapered inner wall is configured opposite to said second tapered inner wall abutting said packing member; and
wherein said arrangement comprises a third tapered inner wall configured in said housing, said third tapered inner wall is orthogonal to said first tapered inner wall and said second inner wall, and said arrangement is configured to increase conductive thermal contact between said power supply unit and said first, second and third tapered walls.
12. The method as claimed in claim 11 , wherein said method comprises the step of securing said packing member within said housing via fasteners.