Photonic die alignment
A first photonic die has a first coupling edge and a first die surface, and comprises: a first waveguide extending in proximity to the first coupling edge; a portion of the first die surface forming an alignment edge substantially parallel to the first waveguide; and a first alignment feature etched into or formed adjacent to the first coupling edge. A second photonic die has a second coupling edge and a second die surface, and comprises: a second waveguide extending in proximity to the second coupling edge; a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge; and a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other.
1. An apparatus comprising:
a first photonic die having a first coupling edge and a first die surface perpendicular to the first coupling edge, the first photonic die comprising:
a first waveguide extending in proximity to the first coupling edge;
a portion of the first die surface forming an alignment edge substantially perpendicular to the first die surface and substantially parallel to the first waveguide; and
a first alignment feature etched into or formed adjacent to the first coupling edge; and
a second photonic die having a second coupling edge and a second die surface perpendicular to the second coupling edge, the second photonic die comprising:
a second waveguide extending in proximity to the second coupling edge;
a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge when the first photonic die and the second photonic die are substantially aligned with each other with the first coupling edge in proximity to and substantially parallel to the second coupling edge; and
a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other with the first coupling edge in proximity to and substantially parallel to the second coupling edge
wherein the alignment edge of the first die and the receptacle of the second die are configured to constrain: (1) translation along a first axis perpendicular to the first die surface, (2) rotation about a second axis perpendicular to the first coupling edge, and (3) rotation about a third axis perpendicular to both the first and second axes.
2. The apparatus of claim 1 , wherein the first waveguide has a propagation axis that is tilted at a nonzero angle with respect to an axis normal to the first coupling edge, and the second waveguide has a propagation axis that is tilted at a nonzero angle with respect to an axis normal to the second coupling edge.
3. The apparatus of claim 1 , wherein the first alignment feature and the second alignment feature are configured to constrain: (1) rotation about the first axis, (2) translation along the second axis, and (3) translation along the third axis.
4. An apparatus comprising:
a first photonic die having a first coupling edge and a first die surface perpendicular to the first coupling edge, the first photonic die comprising:
a first waveguide extending in proximity to the first coupling edge;
a portion of the first die surface forming an alignment edge substantially perpendicular to the first die surface and substantially parallel to the first waveguide; and
a first alignment feature etched into or formed adjacent to the first coupling edge; and
a second photonic die having a second coupling edge and a second die surface perpendicular to the second coupling edge, the second photonic die comprising:
a second waveguide extending in proximity to the second coupling edge;
a portion of the second die surface configured to form a receptacle sized to constrain a position of the alignment edge when the first photonic die and the second photonic die are substantially aligned with each other with the first coupling edge in proximity to and substantially parallel to the second coupling edge; and
a second alignment feature etched into or formed adjacent to the second coupling edge and configured to enable alignment with the first alignment feature when the first photonic die and the second photonic die are substantially aligned with each other with the first coupling edge in proximity to and substantially parallel to the second coupling edge;
wherein the first waveguide has a propagation axis that is tilted at a nonzero angle with respect to an axis normal to the first coupling edge, and the second waveguide has a propagation axis that is tilted at a nonzero angle with respect to an axis normal to the second coupling edge; and
wherein the first alignment feature comprises a set of grooves including a first groove and a second groove.
5. The apparatus of claim 4 , wherein:
the first groove comprises a first wall at a first angle with respect to the coupling edge, and a second wall at a second angle with respect to the coupling edge, where a bisector of the first angle and the second angle is substantially parallel to the propagation axis of the first waveguide or the propagation axis of the second waveguide, and
the second groove comprises a first wall substantially parallel to the first wall of the first groove, and a second wall shifted so that the second groove is asymmetric with respect to the first groove.
6. The apparatus of claim 5 , wherein the second alignment feature comprises a pair of curved protrusions including a first curved protrusion and a second curved protrusion.
7. The apparatus of claim 6 , wherein the first curved protrusion and the second curved protrusion have cylindrical shapes and are substantially identical in size.