Active bridge enabled co-packaged photonic transceiver
Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.
1. A microelectronic package, comprising:
a package substrate comprising a bridge;
a die coupled with the package substrate, wherein the die is communicatively coupled with the bridge; and
a photonic integrated circuit (PIC) communicatively coupled with the bridge,
wherein the bridge is to facilitate communication between the die and the PIC without a retimer, the bridge includes a circuit element that is to alter a signal that is to propagate through the bridge, and the circuit element is an element of an electronic integrated circuit (EIC) of a photonic transceiver that includes the PIC.
2. The microelectronic package of claim 1 , wherein the PIC includes an optical element.
3. The microelectronic package of claim 1 , wherein the bridge is an active bridge, and the die is an active die.
4. The microelectronic package of claim 1 , further comprising the EIC, wherein the EIC includes a serializer/deserializer (SERDES), a transimpedance amplifier (TIA), a control interface, or a driver embedded in the bridge.
5. The microelectronic package of claim 1 , wherein the PIC includes an optical transmitter to transmit an optical signal.
6. The microelectronic package of claim 1 , wherein the PIC includes an optical receiver.
7. A microelectronic package, comprising:
a package substrate with a bridge embedded therein;
an active die coupled with the package substrate; and
a photonic transceiver that includes a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC);
wherein the EIC is an element of the bridge; and
wherein the PIC is an element of a die that is coupled with the package substrate.
8. The microelectronic package of claim 7 , wherein the bridge is communicatively coupled with the active die and the PIC.
9. The microelectronic package of claim 7 , wherein the bridge is to facilitate communication of an electrical signal between the die and the PIC.
10. The microelectronic package of claim 7 , wherein the bridge is an embedded multi-die interconnect bridge (EMIB).
11. The microelectronic package of claim 1 , wherein the circuit element is a serializer/deserializer (SERDES), a transimpedance amplifier (TIA), a control interface, or a driver.
12. The microelectronic package of claim 7 , wherein the EIC includes a serializer/deserializer (SERDES), a transimpedance amplifier (TIA), a control interface, or a driver.
13. The microelectronic package of claim 7 , wherein the PIC includes a plurality of optical signal paths.
14. A microelectronic package, comprising:
a package substrate with a bridge positioned therein;
a die coupled with the package substrate, wherein the die is communicatively coupled with the bridge; and
a photonic integrated circuit (PIC) coupled with the package substrate, wherein the PIC is communicatively coupled with the bridge,
wherein the bridge includes a circuit element that is to alter a signal to propagate through the bridge, and wherein the circuit element is an element of an electronic integrated circuit (EIC) of a photonic transceiver that includes the PIC.
15. The microelectronic package of claim 14 , wherein the circuit element is a serializer/deserializer (SERDES), a transimpedance amplifier (TIA), a control interface, or a driver.