IP Library Granted Patent US 11,243,350
Granted Patent B2
US 11,243,350 · App. 16/817,582 · Granted Feb 8, 2022

Photonic devices integrated with reflectors

Inventors: Yusheng Bian (Ballston Lake, NY); Bo Peng (Malta, NY); Michal Rakowski (Malta, NY)
Assignee: GlobalFoundries U.S. Inc.
G02B6/1225G02B2006/1213G02B2006/12104
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,243,350
App. No.
16/817,582
Granted
Feb 8, 2022
Kind
B2
Abstract

The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.

Claims (25)

1. A semiconductor device comprising:

a substrate;

a photonic component arranged above the substrate, the photonic component having a top surface; and

a top reflector arranged above the photonic component, wherein the top reflector has a plurality of grating structures configured to reflect electromagnetic waves directly towards the photonic component, and the top surface of the photonic component is uncovered by the top reflector.

2. The semiconductor device of claim 1 , wherein the photodetector is peripherally enclosed by the grating structures of the top reflector.

3. The semiconductor device of claim 1 , wherein the top reflector is a first top reflector and the semiconductor device further comprises a second top reflector arranged above the first top reflector, wherein the second top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.

4. The semiconductor device of claim 1 , wherein the top reflector is formed upon a dielectric layer.

5. A semiconductor device comprising:

a substrate;

a photonic component arranged above the substrate, the photonic component has a top surface;

a bottom reflector arranged above the substrate and positioned directly below the photonic component, wherein the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves directly towards the photonic component; and

a top reflector arranged above the photonic component, wherein the top reflector has a plurality of grating structures configured to reflect electromagnetic waves directly towards the photonic component, and the top surface of the photonic component is uncovered by the top reflector.

6. The semiconductor device of claim 5 , wherein the photonic component is peripherally enclosed by the grating structures of the top reflector.

7. The semiconductor device of claim 5 , wherein the grating structures in the bottom reflector are made of silicon.

8. The semiconductor device of claim 5 , wherein the grating structures in the top reflector are made of silicon nitride.

9. The semiconductor device of claim 5 , wherein the photonic component is a waveguide coupler.

10. The semiconductor device of claim 9 , wherein the waveguide coupler includes a dielectric material.

11. The semiconductor device of claim 9 , wherein the waveguide coupler is optically coupled to an adjacent waveguide body, the waveguide body being arranged above the substrate.

12. The semiconductor device of claim 9 , further comprising an insulating layer arranged upon the substrate, wherein the bottom reflector is arranged upon the insulating layer.

13. The semiconductor device of claim 5 , wherein the photonic component is a photodetector.

14. The semiconductor device of claim 13 , further comprising:

an insulating layer arranged upon the substrate; and

a top active layer arranged upon the insulating layer, wherein the bottom reflector is arranged upon the top active layer and the photodetector is arranged upon the bottom reflector.

15. The semiconductor device of claim 5 , wherein the photonic component is arranged upon the bottom reflector.

16. The semiconductor device of claim 5 , wherein the grating structures in the top reflectors and the bottom reflectors have widths and pitches that are configured to have dimensions in the microscale.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2020
From: GLOBALFOUNDRIES INC.
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 054633/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 12, 2020
From: BIAN, YUSHENG; PENG, BO; RAKOWSKI, MICHAL
To: GLOBALFOUNDRIES INC.
Reel/Frame 052162/0033 →
Continuity (1)
Related Publication 20210286130A1 · Sep 16, 2021
Cited By (2)
US 12,276,835 US 12,560,762