Resistance-change type memory device
A resistance-change type memory device includes a substrate, a plurality of electrodes arranged in a first direction parallel to an upper surface of the substrate and extending in a second direction intersecting the upper surface, a resistance-change film provided in a third direction that is parallel to the upper surface and intersects the first direction as viewed from the plurality of electrodes, a semiconductor film provided between the plurality of electrodes and the resistance-change film, and an insulating film provided between the plurality of electrodes and the semiconductor film. The resistance-change film has a resistance value that changes when a current flows therein.
1. A memory device comprising:
a substrate; and
a structure provided on the substrate and extending in a first direction parallel to an upper surface of the substrate,
wherein the structure includes:
a plurality of electrodes extending in a second direction intersecting the upper surface of the substrate and arranged in the first direction;
a semiconductor film provided around each of the plurality of electrodes when viewed from the second direction, and formed continuously around the plurality of electrodes;
a first insulating film provided between each of the plurality of electrodes and the semiconductor film; and
a memory cell provided around the semiconductor film as viewed from the second direction, and connected to the semiconductor film,
wherein the semiconductor film is continuously formed over the entirety of a length of a column formed of the plurality of electrodes.
2. The device according to claim 1 , wherein a plurality of structures are provided and are arranged in a third direction that is parallel to the upper surface of the substrate and intersects the first direction, and
a second insulating film is provided between the plurality of structures.
3. The device according to claim 2 , wherein a distance between electrodes adjacent to each other in the first direction is shorter than a distance between electrodes adjacent to each other in a direction intersecting the first direction.
4. The device according to claim 1 , wherein the memory cell is continuously formed over the entirety of the length of the column formed of the plurality of electrodes.
5. The device according to claim 1 , wherein a current path is formed through the memory cell and the semiconductor film over the entirety of a length of a column formed of the plurality of electrodes.
6. The device according to claim 1 , wherein the memory cell is resistance-change film.