Heat dissipation device
This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
1. A heat dissipation device configured to be in thermal contact with a heat source, and the heat dissipation device comprising:
a heat dissipation body having at least one vertical channel and configured to be in thermal contact with the heat source; and
a cover plate comprising a first layer and a second layer that are stacked on each other, wherein the first layer is stacked on the heat dissipation body and covers the at least one vertical channel;
wherein a thermal conductivity of the first layer is at least twenty times higher than a thermal conductivity of the second layer, and the cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
2. The heat dissipation device according to claim 1 , wherein the thermal conductivity of the first layer is at least one hundred times higher than the thermal conductivity of the second layer.
3. The heat dissipation device according to claim 1 , wherein an extension direction of the at least one vertical channel is not perpendicular to a vertical direction.
4. The heat dissipation device according to claim 3 , wherein the extension direction of the at least one vertical channel is parallel to the vertical direction.
5. The heat dissipation device according to claim 3 , wherein the extension direction of the at least one vertical channel has an acute angle to the vertical direction.
6. The heat dissipation device according to claim 1 , wherein a diameter of the at least one first through hole is larger than or equal to 2 millimeters.
7. The heat dissipation device according to claim 1 , wherein a quantity of the at least one first through hole is plural, and every two of the first through holes that are adjacent to each other are spaced apart by a distance larger than or equal to 3 millimeters.
8. The heat dissipation device according to claim 1 , wherein a porosity of the cover plate ranges between 20% and 50%.
9. The heat dissipation device according to claim 1 , wherein a thickness of the cover plate ranges between 1 millimeter and 5 millimeters.
10. The heat dissipation device according to claim 1 , wherein the cover plate further comprises a thermal insulation part located between the first layer and the second layer.
11. The heat dissipation device according to claim 10 , wherein the thermal insulation part is an air layer.
12. The heat dissipation device according to claim 10 , wherein the thermal insulation part is a vacuum layer.
13. The heat dissipation device according to claim 1 , wherein the cover plate further comprises a thermal insulation part located inside the second layer.
14. The heat dissipation device according to claim 13 , wherein the thermal insulation part is an air layer.
15. The heat dissipation device according to claim 13 , wherein the thermal insulation part is a vacuum layer.
16. The heat dissipation device according to claim 1 , wherein the at least one first through hole is a circular, square, triangular or hexagonal through hole.
17. The heat dissipation device according to claim 1 , wherein a quantity of the at least one vertical channel is plural, the heat dissipation body comprise a base and a plurality of heat dissipation fins, the plurality of heat dissipation fins protrude from the base, every two adjacent heat dissipation fins are spaced apart by one of the vertical channels, the cover plate is stacked on the plurality of heat dissipation fins, and the cover plate and the base are respectively located on two opposite sides of the plurality of heat dissipation fins.
18. The heat dissipation device according to claim 17 , wherein the cover plate is connected to the plurality of heat dissipation fins by press fit, riveting or welding.
19. The heat dissipation device according to claim 17 , wherein the cover plate is adhered to the plurality of heat dissipation fins via a thermally conductive adhesive.