Co-packaged optics and transceiver
An assembly. In some embodiments, the assembly includes: a photonic integrated circuit; and an electronic integrated circuit. A front surface of the photonic integrated circuit abuts, in an area of overlap, against a front surface of the electronic integrated circuit. A first portion of the photonic integrated circuit overhangs a first edge of the electronic integrated circuit, and a first portion of the electronic integrated circuit overhangs a first edge of the photonic integrated circuit. A conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit.
1. An assembly, comprising:
a photonic integrated circuit comprising an optoelectronic device; and
an electronic integrated circuit comprising an interface circuit,
a front surface of the photonic integrated circuit abutting, in an area of overlap, against a front surface of the electronic integrated circuit,
a first portion of the photonic integrated circuit overhanging a first edge of the electronic integrated circuit, and
a first portion of the electronic integrated circuit overhanging a first edge of the photonic integrated circuit,
a conductor on the front surface of the electronic integrated circuit being connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit,
a signal path either from a signal input of the optoelectronic device to an output signal of the interface circuit, or from a signal input of the interface circuit to an output signal of the optoelectronic device, has a 3 dB bandwidth of at least 10 GHz.
2. The assembly of claim 1 , wherein the first edge of the electronic integrated circuit is opposite the first portion of the electronic integrated circuit and the first edge of the photonic integrated circuit is opposite the first portion of the photonic integrated circuit.
3. The assembly of claim 1 , wherein:
the optoelectronic device is a photodetector, and
the interface circuit is an amplifier connected to the photodetector; and
wherein the signal path is
from optical input, of light carrying amplitude modulation, to the photodetector,
to output from the amplifier, of an electrical signal corresponding to the amplitude modulation.
4. The assembly of claim 3 , wherein the signal path has a 3 dB bandwidth of at least 60 GHz.
5. The assembly of claim 1 , wherein:
the optoelectronic device is a modulator, and
the interface circuit is an amplifier connected to the modulator by a conductive path having a length less than 500 microns.
6. The assembly of claim 5 , wherein the length of the conductive path is less than 200 microns.
7. The assembly of claim 5 , wherein the length of the conductive path is less than 100 microns.
8. The assembly of claim 1 , wherein:
the optoelectronic device is a modulator, and
the interface circuit is an amplifier connected to the modulator; and
wherein the signal path is
from input of an electrical signal to the amplifier
to output, from the modulator, of light carrying amplitude modulation corresponding to the electrical signal.
9. The assembly of claim 8 , wherein the signal path has a 3 dB bandwidth of at least 40 GHz.
10. The assembly of claim 1 , wherein:
the optoelectronic device is a photodetector, and
the interface circuit is an amplifier connected to the photodetector by a conductive path having a length less than 500 microns.
11. The assembly of claim 10 , wherein the length of the conductive path is less than 200 microns.
12. The assembly of claim 10 , wherein the length of the conductive path is less than 100 microns.
13. The assembly of claim 1 , wherein, in the area of overlap:
no redistribution layer is present on the electronic integrated circuit, and
no redistribution layer is present on the photonic integrated circuit.
14. An assembly, comprising:
a photonic integrated circuit; and
an electronic integrated circuit,
a front surface of the photonic integrated circuit abutting, in an area of overlap, against a front surface of the electronic integrated circuit,
a first portion of the photonic integrated circuit overhanging a first edge of the electronic integrated circuit, and
a first portion of the electronic integrated circuit overhanging a first edge of the photonic integrated circuit,
a conductor on the front surface of the electronic integrated circuit being connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit,
wherein the conductor on the front surface of the electronic integrated circuit is connected, in the area of overlap, by a metal bump, to the conductor on the front surface of the photonic integrated circuit, the metal bump being one of a plurality of metal bumps, the metal bumps being arranged on a grid over a rectangular array, metal bumps being absent from grid points at the corners of the rectangular array.
15. An assembly, comprising:
a photonic integrated circuit;
an electronic integrated circuit; and
a printed circuit board,
a front surface of the photonic integrated circuit abutting, in an area of overlap, against a front surface of the electronic integrated circuit,
a first portion of the photonic integrated circuit overhanging a first edge of the electronic integrated circuit,
a first portion of the electronic integrated circuit overhanging a first edge of the photonic integrated circuit,
a conductor on the front surface of the electronic integrated circuit being connected, in the area of overlap, to a conductor on the front surface of the photonic integrated circuit,
the printed circuit board abutting against the first portion of the electronic integrated circuit, and
a compressible membrane connector between the first portion of the electronic integrated circuit and the printed circuit board, a conductor on the first portion of the electronic integrated circuit being connected to a conductor on the printed circuit board through a conductor in the compressible membrane connector.
16. The assembly of claim 15 , further comprising a digital integrated circuit on the printed circuit board, the digital integrated circuit being connected to the electronic integrated circuit through:
a conductor on the printed circuit board, and
a conductor in the compressible membrane connector.
17. The assembly of claim 16 , further comprising:
a heat sink on the digital integrated circuit; and
a heat sink on the electronic integrated circuit.
18. The assembly of claim 17 , wherein the assembly is configured to permit replacement of:
the photonic integrated circuit, and
the electronic integrated circuit,
without removing the heat sink from the digital integrated circuit.
19. The assembly of claim 15 , wherein, in the area of overlap:
no redistribution layer is present on the electronic integrated circuit, and
no redistribution layer is present on the photonic integrated circuit.
20. The assembly of claim 15 , wherein the first edge of the electronic integrated circuit is opposite the first portion of the electronic integrated circuit and the first edge of the photonic integrated circuit is opposite the first portion of the photonic integrated circuit.