IP Library Granted Patent US 11,093,426
Granted Patent B1
US 11,093,426 · App. 16/825,150 · Granted Aug 17, 2021

USB recepticle configuration and system therefor

Inventor: Jonathan C. Giffen (Austin, TX)
Assignee: Dell Products L.P.
G06F13/382G06F13/4027G06F2213/0042
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Quick Facts
Patent No.
US 11,093,426
App. No.
16/825,150
Granted
Aug 17, 2021
Kind
B1
Abstract

A method may include selectively instantiating a bridge conductor component at a first printed circuit board (PCB) pad and a second PCB pad to provide a first universal serial bus (USB) receptacle configuration at an information handling system, the first configuration having a USB type-C receptacle at a first location at the PCB. The method may further include selectively instantiating the bridge conductor component at the first PCB pad and a third PCB pad to provide a second USB receptacle configuration at an information handling system, the second configuration having a USB type-A receptacle at the first location at the PCB. Instantiation of the bridge conductor component at the first and the second PCB pads is mutually exclusive to instantiation of the first bridge conductor component at the first and the third PCB pads.

Claims (41)

1. A method comprising:

selectively coupling a first signal of a differential signal pair from a universal serial bus (USB) host to a USB type-C receptacle via a first bridge conductor component instantiated at a first printed circuit board (PCB) pad and a second PCB pad to provide a first USB receptacle configuration at an information handling system; and

selectively coupling the first signal from the USB host to a USB type-A receptacle via the first bridge conductor component instantiated at the first PCB pad and a third PCB pad to provide a second USB receptacle configuration at the information handling system,

wherein instantiation of the first bridge conductor component at the first and the second PCB pad is mutually exclusive to instantiation of the first bridge conductor component at the first and the third PCB pad, and

wherein the first PCB pad is shared by the first bridge conductor component in each of the first and the second USB receptacle configurations to eliminate a radio frequency stub associated with a layout where the first PCB pad is not shared.

2. The method of claim 1 , further comprising selectively coupling the first differential signal to the USB type-C receptacle via a signal retiming circuit instantiated between the first bridge conductor and the USB type-C receptacle.

3. The method of claim 1 , wherein the first USB receptacle configuration includes a receptacle stack having the type-C receptacle and a type-A receptacle.

4. The method of claim 1 , wherein the second USB receptacle configuration includes a receptacle stack having the type-A receptacle and another type-A receptacle.

5. The method of claim 1 , further comprising providing a ground reference via located immediately adjacent to the first PCB pad.

6. The method of claim 1 , further comprising:

selectively coupling a second signal of the differential signal pair from the USB host to the USB type-C receptacle via a second bridge conductor component instantiated at a fourth PCB pad and a fifth PCB pad to provide the first USB receptacle configuration at the information handling system; and

selectively coupling the second signal from the USB host to the USB type-A receptacle via the second bridge conductor component instantiated at the fourth PCB pad and a sixth PCB pad to provide the second USB receptacle configuration,

wherein instantiation of the second bridge conductor component at the fourth and the fifth PCB pads is mutually exclusive to instantiation of the second bridge conductor component at the fourth and the sixth PCB pads.

7. An information handling system comprising;

a printed circuit board;

a universal serial bus (USB) host providing a first signal of a differential signal pair;

a first printed circuit board (PCB) trace to couple the first signal to a first PCB pad;

a ground reference via located immediately adjacent to the first PCB pad;

a second PCB trace to couple a second PCB pad to a PCB pad associated with a USB type-C receptacle;

a third PCB trace to couple a third PCB pad to a PCB pad associated with a USB type-A receptacle; and

a first bridge conductor component instantiated at the first and at the second PCB pads to provide a first USB receptacle configuration of the information handling system, or alternatively instantiated at the first and at the third PCB pads to provide a second USB receptacle configuration of the information handling system.

8. The information handling system of claim 7 , further comprising a signal retiming circuit instantiated between the first bridge conductor and the USB type-C receptacle.

9. The information handling system of claim 7 , wherein the first USB receptacle configuration includes a receptacle stack having the type-C receptacle and a type-A receptacle.

10. The information handling system of claim 7 , wherein the second USB receptacle configuration includes a receptacle stack having the type-A receptacle and another type-A receptacle.

11. The information handling system of claim 7 , wherein the first PCB pad is shared by the first bridge conductor component in each of the first and the second USB receptacle configuration to eliminate a radio frequency stub associated with a layout where the first PCB pad is not shared.

12. The information handling system of claim 7 , further comprising:

the USB host providing a second signal of the differential signal pair;

a fourth PCB trace to couple the second signal to a fourth PCB pad;

a fifth PCB trace to couple a fifth PCB pad to a PCB pad associated with a second terminal of the USB type-C receptacle;

a sixth PCB trace to couple a sixth PCB pad to a PCB pad associated with a second terminal of the USB type-A receptacle; and

a second bridge conductor component instantiated at the fourth and the fifth PCB pads to provide the first USB receptacle configuration, or alternatively instantiated at the fourth and the sixth PCB pads to provide the second USB receptacle configuration.

13. A method comprising:

selectively instantiating a first bridge conductor component at a first printed circuit board (PCB) pad and a second PCB pad to provide a first universal serial bus (USB) receptacle configuration at an information handling system, the first configuration having a USB type-C receptacle at a first location at the PCB; and

selectively instantiating the first bridge conductor component at the first PCB pad and a third PCB pad to provide a second USB receptacle configuration at an information handling system, the second configuration having a USB type-A receptacle at the first location at the PCB,

wherein instantiation of the first bridge conductor component at the first and the second PCB pads is mutually exclusive to instantiation of the first bridge conductor component at the first and the third PCB pads, and

wherein the first PCB pad is shared by the first bridge conductor component in each of the first and the second USB receptacle configurations to eliminate a radio frequency stub associated with a layout where the first PCB pad is not shared.

14. The method of claim 13 , wherein the first configuration further includes coupling a first signal of a differential signal pair from a USB host to the USB type-C receptacle via the first bridge conductor component and via a signal retiming circuit.

15. The method of claim 13 , wherein the second configuration further includes coupling a first signal of a differential signal pair from a USB host to the USB type-A receptacle via the first bridge conductor component.

16. The method of claim 13 , wherein the first USB receptacle configuration includes a receptacle stack having the type-C receptacle and a type-A receptacle.

17. The method of claim 13 , wherein the second USB receptacle configuration includes a receptacle stack having the type-A receptacle and another type-A receptacle.

18. The method of claim 13 , further comprising providing a ground reference via located immediately adjacent to the first PCB pad.

Assignments (13)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053311/0169) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060438/0742 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0081) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0441 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052851/0917) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0509 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (052852/0022) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 060436/0582 →
RELEASE OF SECURITY INTEREST AT REEL 052771 FRAME 0906 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
Reel/Frame 058001/0298 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052852/0022 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 053311/0169 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0081 →
SECURITY INTEREST Recorded Jun 5, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 052851/0917 →
SECURITY AGREEMENT Recorded May 28, 2020
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 052771/0906 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 20, 2020
From: GIFFEN, JONATHAN C.
To: DELL PRODUCTS, LP
Reel/Frame 052176/0884 →
Cited By (1)
US 12,430,276