Antennaless wireless device
A radiating system of a wireless device transmits and receives electromagnetic wave signals in a frequency region and comprises an external port, a radiating structure, and a radiofrequency system. The radiating structure includes: a ground plane layer with a connection point; a radiation booster with a connection point and being smaller than 1/30 of a free-space wavelength corresponding to a lowest frequency of the frequency region; and an internal port between the radiation booster connection point and the ground plane layer connection point. The radiofrequency system includes: a first port connected to the radiating structure's internal port; and a second port connected to the external port. An input impedance at radiating structure's disconnected internal port has a non-zero imaginary part across the frequency region. The radiofrequency system modifies impedance of the radiating structure to provide impedance matching to the radiating system within the frequency region at the external port.
1. A chip antenna component comprising:
a dielectric carrier; and
at least one conductive part, wherein:
the dielectric carrier and the at least one conductive part are arranged in an antenna chip package;
the chip antenna component is configured to be part of a radiating structure of a radiating system, the radiating structure further comprising a ground plane layer and an internal port defined between a connection point of the chip antenna component and a connection point at the ground plane layer;
the chip antenna component is configured to be connected to a radiofrequency system for matching purposes;
the chip antenna component is configured to operate in one or more frequency regions containing one or more frequency bands; and
the chip antenna component is smaller than a quarter of the wavelength of a first resonance frequency of the radiating structure, the resonance frequency measured at the internal port of the radiating structure when no radiofrequency system is connected to the chip antenna component; and
the radiating structure operates in a frequency range containing a first frequency region lower than the first resonance frequency.
2. The chip antenna component of claim 1 , wherein the at least one conductive part is a contact of a circuit component.
3. The chip antenna component of claim 2 , wherein the contact is a soldering pad.
4. The chip antenna component of claim 2 , wherein the contact is a pin.
5. The chip antenna component of claim 2 , wherein the contact is located at an end of the antenna chip package.
6. The chip antenna component of claim 1 , wherein the at least one conductive part is a circuit terminal.
7. The chip antenna component of claim 1 , wherein the ratio between the first resonance frequency of the radiating structure and a highest frequency of the first frequency region of operation of the radiating structure is greater than 3.
8. The chip antenna component of claim 1 , wherein the antenna chip package includes a ceramic element.
9. The chip antenna component of claim 1 , wherein the radiating structure has an input impedance, measured at the internal port of the radiating structure, that includes a reactive component.
10. The chip antenna component of claim 9 , wherein the radiating structure input impedance includes a capacitive component.
11. A wireless device comprising a radiating system comprising:
a radiating structure comprising:
a chip antenna component comprising:
a dielectric carrier; and
at least one conductive part;
a ground plane layer; and
an internal port defined between a connection point of the chip antenna component and a connection point at the ground plane layer;
a radiofrequency system; and
an external port, wherein:
the dielectric carrier and the at least one conductive part in the chip antenna component are arranged in an antenna chip package;
the chip antenna component is configured to be connected to the radiofrequency system for matching purposes;
the chip antenna component is smaller than a quarter of a wavelength of a first resonance frequency of the radiating structure, the first resonance frequency being measured at the internal port of the radiating structure when no radiofrequency system is connected to the chip antenna component;
the radiating structure operates in a frequency range containing a first frequency region lower than the first resonance frequency; and
the wireless device is configured to operate in one or more frequency regions containing one or more frequency bands.
12. The wireless device of claim 11 , wherein the at least one conductive part in the chip antenna component of the wireless device radiating structure is a contact of a circuit component.
13. The wireless device of claim 12 , wherein the contact is a soldering pad.
14. The wireless device of claim 12 , wherein the contact is a pin.
15. The wireless device of claim 12 , wherein the contact is located at an end of the antenna chip package.
16. The wireless device of claim 11 , wherein the at least one conductive part in the chip antenna component of the wireless device radiating structure is a circuit terminal.
17. The wireless device of claim 11 , wherein the ratio between the first resonance frequency of the radiating structure and a highest frequency of the first frequency region of operation of the radiating structure is greater than 3.
18. The wireless device of claim 11 , wherein the antenna chip package includes a ceramic element.
19. The wireless device of claim 11 , wherein the radiating structure has an input impedance, measured at the internal port of the radiating structure, that includes a reactive component.
20. The wireless device of claim 19 , wherein the radiating structure input impedance includes a capacitive component.