Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity
A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.
1. A method of chemical mechanical polishing, comprising:
bulk polishing of a substrate with a polishing pad, a polishing surface of the polishing pad having a first temperature;
metal clearing the substrate; and
over-polishing, after the metal clearing, the substrate with the polishing pad with a temperature of the polishing surface of the polishing pad lowered for the over-polishing by a coolant to have a second temperature that is lower than the first temperature of the polishing surface of the polishing pad during bulk polishing.
2. The method of claim 1 , wherein lowering the temperature includes flowing the coolant onto the polishing surface through one or more nozzles suspended on an arm over the polishing surface of the polishing pad.
3. The method of claim 2 , wherein the coolant comprises a liquid coolant medium.
4. The method of claim 3 , wherein the liquid coolant medium comprises one or more of liquid nitrogen or water.
5. The method of claim 2 , wherein the coolant comprises a gas coolant medium.
6. The method of claim 5 , wherein the gas coolant medium includes nitrogen or carbon dioxide.
7. The method of claim 5 , comprising flowing the gas coolant medium from a source of compressed gas.
8. The method of claim 5 , comprising directing the gas coolant medium through a vortex tube to direct a cold stream of gas onto the polishing pad.
9. The method of claim 2 , comprising starting and stopping fluid flow through the one or more nozzles.
10. A method of chemical mechanical polishing, comprising:
bulk polishing of a substrate with a polishing pad, a polishing surface of the polishing pad having a first temperature; and
conditioning the polishing pad with a temperature of the polishing surface of the polishing pad lowered by a coolant for the conditioning to have a second temperature that is lower than the first temperature of the polishing surface of the polishing pad during bulk polishing.
11. The method of claim 10 , wherein lowering the temperature includes flowing the coolant onto the polishing surface through one or more nozzles suspended on an arm over the polishing surface of the polishing pad.
12. The method of claim 11 , wherein the coolant comprises a liquid coolant medium.
13. The method of claim 12 , wherein the liquid coolant medium comprises one or more of liquid nitrogen or water.
14. The method of claim 11 , wherein the coolant comprises a gas coolant medium.
15. The method of claim 14 , wherein the gas coolant medium includes nitrogen or carbon dioxide.
16. The method of claim 14 , comprising flowing the gas coolant medium from a source of compressed gas.
17. The method of claim 14 , comprising directing the gas coolant medium through a vortex tube to direct a cold stream of gas onto the polishing pad.
18. The method of claim 11 , comprising starting and stopping fluid flow through the one or more nozzles.