Circuit module and method for manufacturing circuit module
An inner conductor of a coaxial cable is electrically connected to a circuit body of a circuit board by means of solder. An outer conductor is electrically connected to a ground body by means of the solder. The inner conductor has a connecting portion connected to the circuit body and a non-exposed portion inside a sheath. A thickness of the connecting portion is equal to or less than 35% of a thickness of the non-exposed portion, and the cross-sectional area of the connecting portion is the same as the cross-sectional area of the non-exposed portion.
1. A circuit module in which an inner conductor of a coaxial cable is connected by means of a solder to a circuit body of a circuit board,
the circuit board comprising:
a dielectric body;
the circuit body formed on a surface of the dielectric body; and
a ground body formed on a back face of the dielectric body, and
the coaxial cable comprising:
the inner conductor;
an insulator provided to surround the inner conductor;
an outer conductor provided to surround the insulator; and
a sheath provided to surround the outer conductor, wherein
the inner conductor has a connecting portion connected to the circuit body, and a non-exposed portion inside the sheath, and
a thickness of the connecting portion is equal to or less than 35% of a thickness of the non-exposed portion and the cross-sectional area of the connecting portion is the same as the cross-sectional area of the non-exposed portion.
2. The circuit module according to claim 1 , wherein
the thickness of the connecting portion is 25% to 35% of the thickness of the non-exposed portion.
3. The circuit module according to claim 1 , wherein
a width of the connecting portion is larger than a width of the non-exposed portion.
4. The circuit module according to claim 2 , wherein
a width of the connecting portion is larger than a width of the non-exposed portion.
5. The circuit module according to claim 1 , wherein
the outer conductor is connected to the ground body.
6. The circuit module according to claim 2 , wherein
the outer conductor is connected to the ground body.
7. The circuit module according to claim 3 , wherein
the outer conductor is connected to the ground body.
8. The circuit module according to claim 4 , wherein
the outer conductor is connected to the ground body.
9. A method for manufacturing a circuit module in which an inner conductor of a coaxial cable is connected by means of a solder to a circuit body of a circuit board,
the circuit board including:
a dielectric body,
the circuit body formed on a surface of the dielectric body, and
a ground body formed on a back face of the dielectric body,
the coaxial cable including:
the inner conductor,
an insulator provided to surround the inner conductor,
an outer conductor provided to surround the insulator, and
a sheath provided to surround the outer conductor, and
the inner conductor having a connecting portion connected to the circuit body, and a non-exposed portion inside the sheath,
the method comprising:
an exposure step in which the insulator, the outer conductor and the sheath of the coaxial cable are stripped away to expose the connecting portion to the outside;
a compression step in which compression is performed to render a thickness of the connecting portion equal to or less than 35% of a thickness of the non-exposed portion and to make the cross-sectional area of the connecting portion the same as the cross-sectional area of the non-exposed portion; and
a connection step in which the connecting portion is connected by means of the solder to the circuit body.
10. The circuit module according to claim 1 , wherein
the inner conductor is constituted by a plurality of wires, the plurality of wires are deformed and all the wires of the connecting portion are in a state of surface contact with the circuit body.